2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)最新文献_第10页

Emotion Expression Model for Robot Using Color 基于颜色的机器人情感表达模型

2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) Pub Date : 2023-05-09 DOI: 10.1109/ECTI-CON58255.2023.10153254

Suzuka Tanaka, K. Hashikura, Md. Abdus Samad Kamal, I. Murakami, Kou Yamada

引用次数: 0

Impact of Prosumers’ PV reverse power flow on voltage rise in MV distribution systems 产消户光伏反向潮流对中压配电系统电压上升的影响

2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) Pub Date : 2023-05-09 DOI: 10.1109/ECTI-CON58255.2023.10153177

Kantanat Ratchawang, N. Hoonchareon

引用次数: 0

Trap for Deactivation of Conducting Particle in Gas-insulated Switchgear 气体绝缘开关设备中导电微粒失活的捕集器

2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) Pub Date : 2023-05-09 DOI: 10.1109/ECTI-CON58255.2023.10153243

N. Phansiri, N. Tanthanuch, B. Techaumnat

{"title":"Trap for Deactivation of Conducting Particle in Gas-insulated Switchgear","authors":"N. Phansiri, N. Tanthanuch, B. Techaumnat","doi":"10.1109/ECTI-CON58255.2023.10153243","DOIUrl":"https://doi.org/10.1109/ECTI-CON58255.2023.10153243","url":null,"abstract":"This paper presents the study of the simple particle traps for deactivation particle movement in gas insulated switchgears. The study aims to investigate the designed trap to stop the movement of the particle by using the dielectrophoretic (DEP) force in the case of moving along the dielectric surface placed on the ground electrode. Numerical calculation results show electric field distribution in the channel between high voltage and ground electrodes with and without particle trap to clarify the particle motion under the electric field. Particle traps are fabricated with silicone and polyimide. The particle deactivation performance is observed for two types of particle traps. The experimental results show that the first type of trap can deactivate 53% and 87% of all experiment conditions for aluminum and stainless-steel particle, respectively. The first type and second type can trap aluminum particles at 10% and 80%, respectively. The particle’s velocity under an electric field is an important parameter in predicting the trap performance.","PeriodicalId":340768,"journal":{"name":"2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127981712","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Development of Antimicrobial Envelope for RFID Card RFID卡抗菌信封的研制

2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) Pub Date : 2023-05-09 DOI: 10.1109/ECTI-CON58255.2023.10153176

Sukritta Paripurana, N. Kittiamornkul, O. Watcharakitchakorn, Rapeepan Keawon

{"title":"Development of Antimicrobial Envelope for RFID Card","authors":"Sukritta Paripurana, N. Kittiamornkul, O. Watcharakitchakorn, Rapeepan Keawon","doi":"10.1109/ECTI-CON58255.2023.10153176","DOIUrl":"https://doi.org/10.1109/ECTI-CON58255.2023.10153176","url":null,"abstract":"This paper proposes the development of an RFID envelope coated with an antimicrobial material that can stop microorganisms’ growth while the card is still regularly used. Copper is chosen as the antimicrobial material for coating on an envelope made of polyethylene terephthalate (PET) by using DC sputtering. The antimicrobial ability of the proposed envelope is investigated against Escherichia coli (E. coli). The result shows that the survival time of E. coli on the proposed envelope is decreased compared with the PET envelope without the copper thin film coated on. Besides its antimicrobial quality, copper can let radio frequency pass through. Thus, the effectiveness of electromagnetic wave transmission through the proposed envelope coated with different thickness of a copper thin film is tested. To evaluate the performance of the proposed envelope, three experiments which cover the test of the antimicrobial ability of copper thin film, the resistance of copper thin film, and performance of RF transmission of RFID reader and tag are conducted. The results of the three experiments show that a copper thin film can prevent the microorganisms’ growth, the resistance of the copper thin film is decreasing while the thickness of the copper thin film is increasing, and the radio frequency can pass though the proposed envelope.","PeriodicalId":340768,"journal":{"name":"2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125927735","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Compact Spherical Near-field Scanning System for Antenna Radiation Pattern Measurement 天线辐射方向图测量的紧凑球面近场扫描系统

2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) Pub Date : 2023-05-09 DOI: 10.1109/ECTI-CON58255.2023.10153213

Kitiphon Sukpreecha, S. Kittiwittayapong, T. Lertwiriyaprapa, D. Torrungrueng, K. Phaebua

{"title":"Compact Spherical Near-field Scanning System for Antenna Radiation Pattern Measurement","authors":"Kitiphon Sukpreecha, S. Kittiwittayapong, T. Lertwiriyaprapa, D. Torrungrueng, K. Phaebua","doi":"10.1109/ECTI-CON58255.2023.10153213","DOIUrl":"https://doi.org/10.1109/ECTI-CON58255.2023.10153213","url":null,"abstract":"This paper presents a compact spherical near-field (NF) scanning system and near-field to far-field (NF-FF) transformation for antenna radiation pattern measurement. The low-cost stepping motors together with the Arduino controller R3 model are efficiently employed. The NF data of the antenna under test (AUT) is collected by using a dual-polarized circular open-ended waveguide probe. MATLAB graphic user interface (GUI) is implemented to control the NF scanner and interface to the network analyzer. NF-FF transformation algorithm is implemented by using the spherical wave expansion with numerical integration. The evaluation of an associated double integration in the proposed NF-FF transformation is performed by using the trapezoidal rule numerical integration instead of the conventional fast Fourier transform (FFT) algorithm. Validation, FF radiation patterns of AUT from the proposed system, and simulated far-field radiation pattern are compared. It is found that the simulated FF radiation pattern and the radiation pattern from the proposed system are in good agreement. The proposed system requires less measurement space and a low-cost RF anechoic chamber room compared with the conventional FF radiation pattern measurement technique.","PeriodicalId":340768,"journal":{"name":"2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)","volume":"112 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123749630","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Fall Detection Approach Using Variational Autoencoders with Self-Attention Features 基于自注意特征的变分自编码器的跌倒检测方法

2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) Pub Date : 2023-05-09 DOI: 10.1109/ECTI-CON58255.2023.10153189

Tomorn Soontornnapar, T. Ploysuwan

引用次数: 0

Lifetime of Surge Protection Device Analysis and Monitoring 电涌保护装置寿命分析与监测

2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) Pub Date : 2023-05-09 DOI: 10.1109/ECTI-CON58255.2023.10153319

Phuttinan Montha, Natthapong Thawin, N. Phansiri, T. Chaiyatham, Pawarut Kongsombatsuk, W. Khanngern

{"title":"Lifetime of Surge Protection Device Analysis and Monitoring","authors":"Phuttinan Montha, Natthapong Thawin, N. Phansiri, T. Chaiyatham, Pawarut Kongsombatsuk, W. Khanngern","doi":"10.1109/ECTI-CON58255.2023.10153319","DOIUrl":"https://doi.org/10.1109/ECTI-CON58255.2023.10153319","url":null,"abstract":"This article presents the service life analysis of surge protection device that uses a Raspberry Pi to manage data for equipment in an intelligent ground monitoring system. The system analyzes and validates the service life of surge protection devices (SPDs) based on the number of lightning strikes and the magnitude of current flowing through them. The system uses RS485 format data transmission to store information on a cloud database and uses SCADA software to display the status of the equipment in the system. The system also uses AC Class II SPDs for AC power and SPD DC Class II for DC power to estimate the service life of SPDs, enabling planning of operation, maintenance and enhancement of lightning protection performance and reliability. The article presents an evaluation of the service life of a SPD by analyzing the results of the relationship between the number of times and the magnitude of current flowing through it and compares it with data obtained from the SPD test according to the IEC 61643-11 standard.","PeriodicalId":340768,"journal":{"name":"2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)","volume":"44 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115552140","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

System Performance Investigation of OFDM Channel Qualization for 5G using Least Squares with Various Interpolation Methods 基于最小二乘和各种插值方法的5G OFDM信道鉴定系统性能研究

2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) Pub Date : 2023-05-09 DOI: 10.1109/ECTI-CON58255.2023.10153132

K. Puntsri, Wuttichai Partipralam

引用次数: 0

Impact of V2G in microgrid systems with PFC V2G对PFC微电网系统的影响

2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) Pub Date : 2023-05-09 DOI: 10.1109/ECTI-CON58255.2023.10153286

B. Yosrueangsak, C. Summatta, P. Prabpal, N. Thaitae, S. Sonasang

引用次数: 0

Observation of Quantum Hall effect in GaAs/AlGaAs heterostructure at temperature dependence 4.2 K of Quantum Resistance Standard 4.2 K量子电阻标准下GaAs/AlGaAs异质结构中量子霍尔效应的观察

2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) Pub Date : 2023-05-09 DOI: 10.1109/ECTI-CON58255.2023.10153265

Jutarat Tanarom, C. Kurupakorn, Supachai Tangsupaktada, Piyaporn Detudom, C. Jassadajin, M. Homklintian

{"title":"Observation of Quantum Hall effect in GaAs/AlGaAs heterostructure at temperature dependence 4.2 K of Quantum Resistance Standard","authors":"Jutarat Tanarom, C. Kurupakorn, Supachai Tangsupaktada, Piyaporn Detudom, C. Jassadajin, M. Homklintian","doi":"10.1109/ECTI-CON58255.2023.10153265","DOIUrl":"https://doi.org/10.1109/ECTI-CON58255.2023.10153265","url":null,"abstract":"This research examines the quantum Hall effect of a GaAs/AlGaAs heterostructure sample at the temperature of 4.2 K and measures the longitudinal Rxx and Hall resistance RH at $I = 10 mu mathrm{A}$. The corresponding Hall plateaus are represented by the depicted longitudinal Rxx and Hall resistance RH curves, however, the Hall resistance RH’s characteristics are not complete. The odd number’s plateau index i was not observed. At $i = 2$ and $i = 4$, the longitudinal resistance characteristic Rxx approaches zero. Comparing the measurement results at 1.5 K (theoretical) and 4.2 K, it was discovered that there were deviations of $1.5 mathrm{m}Omega / Omega$ ($i = 2$) and $5 mathrm{m}Omega / Omega (i =4)$, respectively. The effect of rising temperature is a factor contributing to the quantum Hall effect’s incompleteness. We can identify abnormalities while measuring or determining the time period of operation from the characteristics of the measured results. Moreover, the external magnetic field is measured around the Quantum Hall Resistance (QHR) standard system. It will be able to securely evaluate the effects of magnetic field generation produced by the superconducting magnet in the cryostat system. From the results, there is a small external magnetic field around the QHR system.","PeriodicalId":340768,"journal":{"name":"2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122326060","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0