2021 IEEE 66th Holm Conference on Electrical Contacts (HLM)最新文献_第3页

Making Electrical Contact to Layered Surfaces 使电接触分层表面

2021 IEEE 66th Holm Conference on Electrical Contacts (HLM) Pub Date : 2021-10-24 DOI: 10.1109/HLM51431.2021.9671156

R. Malucci

引用次数: 3

Computational study for electronic interconnects and performance of solders and solder paste 电子互连及焊料和锡膏性能的计算研究

2021 IEEE 66th Holm Conference on Electrical Contacts (HLM) Pub Date : 2021-10-24 DOI: 10.1109/HLM51431.2021.9671144

Waliul Matin, M. Morrison, KhanFareed Ashraf

{"title":"Computational study for electronic interconnects and performance of solders and solder paste","authors":"Waliul Matin, M. Morrison, KhanFareed Ashraf","doi":"10.1109/HLM51431.2021.9671144","DOIUrl":"https://doi.org/10.1109/HLM51431.2021.9671144","url":null,"abstract":"The interconnect contacts consisting of solder act as bottleneck in terms of reliability in electronic chips. Computations have been performed to investigate the efficacy of solders considering traditional ones and solder paste. The study focuses on solders and solder paste that can operate at various thermal load and material structures. In this study, Quilt Packaging, QP, Thru Silicon Via, TSV, and Flip chip structures have been utilized to find the effectiveness of the solders. The electroless solder or solder pastes are applied in narrow interconnect as done in quilt packaging, whereas other solders are used in wide connections that can carry substantial currents as observed in traditional interconnects. The chip as well as the interconnects can generate heat during operation; specifically, in hot spots, it can produce large temperature gradient resulting in increased thermal stress. The simulation demonstrates structural deformation due to dielectric or resistive heating. With the available fatigue parameters for the solders, plastic strain and failure have been computed for the structures. Finally, with the mentioned constraints, the simulation results indicate the material parameters to focus on when selecting solders.","PeriodicalId":338653,"journal":{"name":"2021 IEEE 66th Holm Conference on Electrical Contacts (HLM)","volume":"120 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131695140","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

The Morton Antler Lecture: 2021 Morton Antler Lecture Awardee Peter Lee 莫顿鹿角讲座:2021年莫顿鹿角讲座获奖者彼得李

2021 IEEE 66th Holm Conference on Electrical Contacts (HLM) Pub Date : 2021-10-24 DOI: 10.1109/hlm51431.2021.9671206

引用次数: 0

IEEE Holm 2021 Steering Committee IEEE Holm 2021指导委员会

2021 IEEE 66th Holm Conference on Electrical Contacts (HLM) Pub Date : 2021-10-24 DOI: 10.1109/hlm51431.2021.9671199

引用次数: 0

The Ragner Holm Scientific Achievement Award [and other awards] 拉格纳·霍尔姆科学成就奖[及其他奖项]

2021 IEEE 66th Holm Conference on Electrical Contacts (HLM) Pub Date : 2021-10-24 DOI: 10.1109/hlm51431.2021.9671192

引用次数: 0

Impact of Signal Frequency on Passive Intermodulation in Coaxial Connectors 同轴连接器中信号频率对无源互调的影响

2021 IEEE 66th Holm Conference on Electrical Contacts (HLM) Pub Date : 2021-10-24 DOI: 10.1109/HLM51431.2021.9671108

Lingyu Bi, G. Flowers, Jinchun Gao, Junyu Luo, Wenjia Wang

{"title":"Impact of Signal Frequency on Passive Intermodulation in Coaxial Connectors","authors":"Lingyu Bi, G. Flowers, Jinchun Gao, Junyu Luo, Wenjia Wang","doi":"10.1109/HLM51431.2021.9671108","DOIUrl":"https://doi.org/10.1109/HLM51431.2021.9671108","url":null,"abstract":"Passive intermodulation (PIM) from coaxial connectors can be a significant problem in the transmission of high frequency signals. A major source of this effect is nonlinearity resulting from magnetic materials in the connector fabrication. The PIM performance of a given coaxial connector is, generally, different at different frequencies. As communication frequency bands become denser, developing a better understanding of the passive intermodulation characteristics of coaxial connectors at different frequency bands and using that knowledge to improve connector designs becomes a critical concern. Accordingly, this research seeks to provide a theoretical basis for evaluating PIM performance in coaxial connectors at different frequency bands. In this study, passive intermodulation was analyzed from the perspective of material nonlinearity, with the magnetic material in the coaxial connector coatings considered as the source of the nonlinearity that drives this effect. The current flowing through the magnetic region in a sample coaxial connector configuration was simulated by finite element analysis for a variety of frequency bands. Combined with skin effect theory, the impact of signal frequency on PIM in coaxial connectors was investigated and modeled. The results from this model were validated with experimental tests. Specifically, a multi-band PIM test system was used to measure the third-order intermodulation product power of sample coaxial connectors with input signals from different frequency bands. The corresponding model results and the experimental results show good agreement.","PeriodicalId":338653,"journal":{"name":"2021 IEEE 66th Holm Conference on Electrical Contacts (HLM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128812682","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Effect of Direction of Motion on Fretting Corrosion Behaviour 运动方向对微动腐蚀行为的影响

2021 IEEE 66th Holm Conference on Electrical Contacts (HLM) Pub Date : 2021-10-24 DOI: 10.1109/HLM51431.2021.9671220

Haomiao Yuan, Dirk Hilmert, Abhay Shukla, Jian Song

引用次数: 0

Study of the movable contact fallback phenomenon in MCCB 断路器动触头回退现象的研究

2021 IEEE 66th Holm Conference on Electrical Contacts (HLM) Pub Date : 2021-10-24 DOI: 10.1109/HLM51431.2021.9671104

Xiaofeng Bai, Zijie Liao, Qian Wang, Jianning Yin, Xingwen Li

引用次数: 0

Impact of Mechanical Parameters on Switching Results of Electro-Mechanical Contactors 机械参数对机电接触器开关效果的影响

2021 IEEE 66th Holm Conference on Electrical Contacts (HLM) Pub Date : 2021-10-24 DOI: 10.1109/HLM51431.2021.9671118

Timo Mützel, C. Hubrich, Johannes Tasch

引用次数: 2

Deterioration and Breakdown Mechanisms in force-fitted current-carrying Connections between Aluminum and Tin 铝和锡之间强行装配的载流连接的劣化和击穿机制

2021 IEEE 66th Holm Conference on Electrical Contacts (HLM) Pub Date : 2021-10-24 DOI: 10.1109/HLM51431.2021.9671165

M. Oberst, Christian Hildmann, Stephan Schlegel

{"title":"Deterioration and Breakdown Mechanisms in force-fitted current-carrying Connections between Aluminum and Tin","authors":"M. Oberst, Christian Hildmann, Stephan Schlegel","doi":"10.1109/HLM51431.2021.9671165","DOIUrl":"https://doi.org/10.1109/HLM51431.2021.9671165","url":null,"abstract":"Crimped connections between aluminum and tin-plated conductors have a stable long-term behavior when installed correctly. In contrast, current-carrying connections between aluminum and tin-plated conductors without an intense deformation at assembly, e.g. bolted joints with busbars, do not exhibit this kind of long-term reliability. Previous research has shown that the resistance of these connections begins to deteriorate immediately after assembly even without an electrical load or an elevated temperature. The reason for this is oxygen that is enclosed in the interface. Upon joining, it starts to react with the aluminum surface to form highly resistive Al2O3. In order to examine the processes in the interface more closely, experiments were conducted on a model geometry consisting of a bare aluminum cylinder and a tincoated copper counter-part with a pointed end. The contact resistance was measured at constant temperature, at constant DC current, and at constant source voltage. The results give new insights into the impact of the growth of the aluminum oxide layer, as well as its electrical and thermal breakdown. Additionally, the Al2O3-film in an aged Al-Sn-contact was examined using transmission electron microscopy. Differences between the stable long-term behavior of crimped connections and the instability of force-fitted connections are discussed.","PeriodicalId":338653,"journal":{"name":"2021 IEEE 66th Holm Conference on Electrical Contacts (HLM)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127424230","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0