2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition最新文献_第5页

Integration of screen-printed electroluminescent matrix displays in smart textile items — Implementation and evaluation 智能纺织品中丝网印刷电致发光矩阵显示器的集成。实施和评价

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346873

A. Ivanov, M. Wurzer

引用次数: 7

Measurements of transient thermal impedance of ferrite cores 铁氧体铁芯瞬态热阻抗的测量

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346912

K. Detka, K. Górecki

引用次数: 0

Method and laboratory set-up for testing of RFID systems in static and dynamic states 在静态和动态状态下测试RFID系统的方法和实验室装置

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346914

J. Potencki, M. Skoczylas

引用次数: 0

Measurements and simulations of silicon carbide current-controlled transistors 碳化硅电流控制晶体管的测量与仿真

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346923

J. Patrzyk, D. Bisewski

引用次数: 1

An electronic nose based on the semiconducting and electrochemical gas sensors 基于半导体和电化学气体传感器的电子鼻

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346895

G. Jasinski, P. Kalinowski, L. Wozniak, P. Kościński, P. Jasiński

{"title":"An electronic nose based on the semiconducting and electrochemical gas sensors","authors":"G. Jasinski, P. Kalinowski, L. Wozniak, P. Kościński, P. Jasiński","doi":"10.23919/EMPC.2017.8346895","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346895","url":null,"abstract":"The practical application of human nose for fragrance recognition is severely limited by the fact that our sense of smell is subjective and gets tired easily. Consequently, there is a significant need for an instrument that can be a substitution of the human sense of smell. Development of an electronic nose devices is an active area of research starting from pioneering research of Dodd and Persuad in the mid-1980s. Such systems are used in growing number of applications. They comprise an array of several electrochemical gas sensors with partial specificity and a pattern recognition algorithms. Since most of the existing types of sensors are characterized by low selectivity, they can all be used in the construction of electronic noses. Most electronic nose systems are based only on one type of gas sensors. However, different types of sensors have different advantages and disadvantages. In this article, an electronic nose system for the purpose of incorporating different types of sensors has been proposed developed. Such approach allows to benefit from advantages of different type of sensors, and thus improve the operation of the entire system.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124165935","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact pcb中异构集成组件的嵌入技术——一种具有环境影响的创新模块化方法

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346879

D. Manessis, J. Pawlikowski, A. Ostmann, K. Schischke, R. Aschenbrenner, M. Schneider-Ramelow, T. Krivec, G. Podhradsky, K. Lang

{"title":"Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact","authors":"D. Manessis, J. Pawlikowski, A. Ostmann, K. Schischke, R. Aschenbrenner, M. Schneider-Ramelow, T. Krivec, G. Podhradsky, K. Lang","doi":"10.23919/EMPC.2017.8346879","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346879","url":null,"abstract":"The paper presents in the frame of an EU Project “Sustainably SMART” the first results on the development of ecofriendly PCB embedding technologies toward advanced electronic modularization and miniaturization. It focuses on the further development of embedding technologies deploying accurate “face-down” assembly techniques, lamination in epoxy prepreg layers and state-of-the-art PCB processes for the breakdown of complex electronic systems in functional modules with discrete functionalities that can be at the end assembled flexibly with non-permanent interconnection techniques on the mainboard. These embedding technologies offer the advantage of the heterogeneous integration of components — with different functionalities, thicknesses and already existing in the market as pre-packaged components with solder terminations (e.g BGA, CSP)- in the inner layer of PCBs as assembled components and then the redistribution of their signals in the outer layers through copper electroplated microvias and drilled through vias. Based on this concept, the digital voice recorder (DVR) of end user Speech has been split in base and functional modules. The new designs of the USB, power, and DSP modules will be presented and the manufacturing processes and results of the digital signal processing (DSP) module will be discussed in detail. This paper demonstrates miniaturized DSP modules, 15mm×15mm×2.8mm comprising 68 components with DSP and quartz crystals to be embedded and flash memory and passives to be assembled as SMT components on top. The creation of such modules with the right adjustment of their termination pads will lead to a reduction of the backbone from 6 to 4 or even 2 layers with a conspicuous positive economic and environmental impact.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127570472","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

The importance of shear thinning, thixotropic and viscoelastic properties of thick film pastes to predict effects on printing performance 厚膜浆料的剪切减薄、触变和粘弹性对预测印刷性能的影响具有重要意义

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346831

K. Reinhardt, Nancy Hofmann, M. Eberstein

{"title":"The importance of shear thinning, thixotropic and viscoelastic properties of thick film pastes to predict effects on printing performance","authors":"K. Reinhardt, Nancy Hofmann, M. Eberstein","doi":"10.23919/EMPC.2017.8346831","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346831","url":null,"abstract":"Highly concentrated ceramic polymer suspensions (thick film pastes) are used in many fields of hybrid technology and micro systems packaging. Thereby, in dependence of the used printing technologies like screen printing or micro-dispensing, different requirements are set on the ceramic suspensions. For example, to reach similar structural resolutions for both technologies the suspensions can differ strongly in their solid content, their organic polymer suspension and, above all, in their viscosity. This results in the fact that it is enormously important for paste development to study the requirements and for successful deposition to adjust them by means of targeted variation of the paste components. These components are for a typical ceramic suspension: a solvent, a polymer and inorganic fillers. Such complex fluids exhibit a broad spectrum of rheological features attributable to the various components and making effective controls over their printing properties a formidably challenging task. However, understanding the rheological properties is crucial for setting an optimal high-precision printing. Previous works have tried to correlate rheological properties of commercial thick film pastes [1,2] to screen printing behavior, but these results didn't allow correlations to the particular components and no specific adjustments for the formulation of suspensions are possible. This study will show how rheological parameters can be adjusted by specific paste composition variations in order to adjust the deposition behavior according to the printing technology. Results of the pastes development, in which the particle type, shape, size, but also the polymer-solvent system were systematically varied, are shown in order to deposit high-resolution structural functional layers. Both shear thinning and thixotropic as well as viscoelastic properties of the paste systems are considered and correlated with their effects on printing performance.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127915087","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Finite element study of chip package induced mechanical and corrosive failure modes complementing microstructural root cause analyses 芯片封装诱发的机械和腐蚀失效模式的有限元研究补充了微观结构的根本原因分析

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346891

G. Lorenz, M. Simon-Najasek, A. Lindner

{"title":"Finite element study of chip package induced mechanical and corrosive failure modes complementing microstructural root cause analyses","authors":"G. Lorenz, M. Simon-Najasek, A. Lindner","doi":"10.23919/EMPC.2017.8346891","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346891","url":null,"abstract":"In automotive applications microelectronic components have to meet very strict reliability requirements. Additionally mechanical or thermomechanical stresses resulting from manufacturing processes or application conditions, as well as chemical influences have to be considered due to the exposure to harsh environmental conditions. In complex mounting situations or the use in harsh environments, e.g. humidity and corrosive compounds, even relatively simple devices (e.g. Hall sensors) can face complex failure modes. In these cases Finite-Element-Analyses (FEA) can support microstructural failure diagnostic methods and help to understand potential failure risks resulting from chip-package interaction effects (e.g. mechanical stresses resulting from the packaging process or different mounting situations). Such mechanical stresses do not only determine the risk of deformation-induced failure and cracking but can also affect the diffusion kinetics of chemical substances. This paper addresses chip-package interaction effects that determine the risk of chip damage by several failure modes. Results from microstructural failure analyses like scanning acoustic microscopy SAM, scanning electron microscopy (SEM) combined with energy dispersive X-ray spectroscopy (EDX) where combined with FEA in order to understand the influence of different process parameters, mounting steps or material inhomogeneity's regarding the components reliability.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121067638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Small form-factor, liquid-cooled SiPM module for PET/MRI applications 小尺寸，液冷SiPM模块用于PET/MRI应用

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346828

R. Dohle, T. Rittweg, I. Sacco

{"title":"Small form-factor, liquid-cooled SiPM module for PET/MRI applications","authors":"R. Dohle, T. Rittweg, I. Sacco","doi":"10.23919/EMPC.2017.8346828","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346828","url":null,"abstract":"We present recent advances in the technology for small form factor hybrid circuits with one water cooled LTCC substrate, Silicon Photomultipliers (SiPMs) and highest-performance ASICs for application in scintillator detectors for time-of-flight (TOF) Positron Emission Tomography / Magnetic Resonance Imaging applications. One of the biggest challenges is the development of miniaturized sensor modules that are highly functional and MRI compatible. The SiPM modules with an area of 32.8 by 32.0 mm2 contain 12 × 12 SiPMs in a pitch of 2.5 mm2. The readout of the 144 channels is performed by four PETA6 ASICs. The LTCC substrate with 2.1 mm thickness has been manufactured using the most advanced technologies developed at MSE. The liquid cooling channels inside the LTCC substrate provide excellent cooling for the ASICs, the SiPMs, and thermal insulation between ASICs and SiPMs and allow a very compact design of the detector modules, reducing their height by 50% compared with other technical solutions. The 12 SiPM arrays with 2×6 geometry are wire bonded only at the edges of the SiPMs to the LTCC, enabling the use of nearly the whole detector area for photon detection. At the opposite side of the substrate, four ASICs for the readout electronic with 272 μm bump pitch are flip-chip solder assembled to the LTCC substrate and underfilled and a few SMD components are mounted. LTCC substrates and all components are fully MRI compatible, which allows integration of PET with magnetic resonance imaging without mutual interference. A scintillator crystal array on top of the SiPMs converts gamma-rays produced by the decay of positrons into light. With measurements on prototypes the best coincidence resolving times (CRTs) for pairs of identical detectors in combination with high spatial resolution have been obtained.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122388247","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Mechanical properties and life time of high Pb-containing solder joints 高含铅焊点的力学性能和使用寿命

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346898

G. Khatibi, A. Betzwar Kotas

{"title":"Mechanical properties and life time of high Pb-containing solder joints","authors":"G. Khatibi, A. Betzwar Kotas","doi":"10.23919/EMPC.2017.8346898","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346898","url":null,"abstract":"High lead-containing soft solders with melting points of above 300°C are still widely used in power semiconductors for high temperature applications due to lack of reliable and cost effective lead-free alternative solutions. In this study the influence of aging on stress-strain response and fatigue life of solder joints prepared with two types of high-Pb solder alloys with different Sn content was investigated. Tensile experiments were carried out by using model solder joints prepared with Cu or Ni strips as substrates. Multi-layered samples consisting of Ni-coated Si chips soldered on metallized ceramic substrates were used for isothermal bending fatigue studies. The growth rate of the Cu-Sn interfacial intermetallic compound (IMC) was found to be considerably higher than that of Ni-Sn IMC. Independent from the substrate material a higher IMC growth rate was always observed in the solder joints prepared with a higher Sn content. On the other hand, these joints showed a clear improvement of tensile and fatigue properties. The moderate fatigue response of the PbSnAg solder joints with a lower Sn content could be related to the occurrence of interfacial delamination. Furthermore, it was found that not only the Sn concentration of the solder but also the thickness of the wettable substrate affects the spalling and delamination of the interfacial IMC layer. Finally, it is demonstrated that accelerated isothermal bending fatigue testing can be used for rapid evaluation of large area solder joints in electronics.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"109 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122835075","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0