{"title":"铁氧体铁芯瞬态热阻抗的测量","authors":"K. Detka, K. Górecki","doi":"10.23919/EMPC.2017.8346912","DOIUrl":null,"url":null,"abstract":"The aim of the paper is to characterise thermal proprieties of ferrite cores with the use of the compact thermal model. The method of measurements of transient thermal impedance of such cores is proposed. Some results of measurements of waveforms of transient thermal impedance of the selected ferrite cores of different dimensions are shown and discussed.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Measurements of transient thermal impedance of ferrite cores\",\"authors\":\"K. Detka, K. Górecki\",\"doi\":\"10.23919/EMPC.2017.8346912\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The aim of the paper is to characterise thermal proprieties of ferrite cores with the use of the compact thermal model. The method of measurements of transient thermal impedance of such cores is proposed. Some results of measurements of waveforms of transient thermal impedance of the selected ferrite cores of different dimensions are shown and discussed.\",\"PeriodicalId\":329807,\"journal\":{\"name\":\"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/EMPC.2017.8346912\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/EMPC.2017.8346912","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Measurements of transient thermal impedance of ferrite cores
The aim of the paper is to characterise thermal proprieties of ferrite cores with the use of the compact thermal model. The method of measurements of transient thermal impedance of such cores is proposed. Some results of measurements of waveforms of transient thermal impedance of the selected ferrite cores of different dimensions are shown and discussed.