IEEE Transactions on Product Engineering and Production最新文献_第3页

IEEE Transactions on Product Engineering and Production Pub Date : 1963-07-01 DOI: 10.1109/TPEP.1963.1136399

T. Fox, C. Patterson

引用次数: 0

Vacuum Deposition Techniques in an Engineering Laboratory Facility for Producing Thin Film Integrated Circuits 真空沉积技术在工程实验室设备生产薄膜集成电路

IEEE Transactions on Product Engineering and Production Pub Date : 1963-07-01 DOI: 10.1109/TPEP.1963.1136403

R. Kraus

引用次数: 2

Product Reliability through Integrated Packaging and Handling 产品可靠性通过集成包装和处理

IEEE Transactions on Product Engineering and Production Pub Date : 1963-07-01 DOI: 10.1109/TPEP.1963.1136398

B. Baker

{"title":"Product Reliability through Integrated Packaging and Handling","authors":"B. Baker","doi":"10.1109/TPEP.1963.1136398","DOIUrl":"https://doi.org/10.1109/TPEP.1963.1136398","url":null,"abstract":"Space Scientists and Engineers are under continuing pressure to establish increasingly rigid performance parameters in product design. The ever changing technical \"state of the art\" of space products dictates companion changes in the \"state of the art\" of supporting technical endeavors such as industrial engineering. One vital area in which industrial engineering must react in close concert with technical changes is material handling and packaging engineering. Material handling and packaging engineers must devise techniques, devices and systems to protect product performance parameters. In many instances, elements of the space industry have used a piecemeal approach to solve protective packaging and handling problems - with piecemeal results. A practical concept is needed to enable application of optimum industrial engineering to problems related to protection of space product reliability. This concept embraces recognition that space product manufacturers are part of a vast invention complex - and that this complex, in turn, is nothing more or less than an involved material flow. Accordingly, to enhance chances of space products to reliably perform; thoroughly integrated, cradle-to-grave protective packaging and handling systems and programs must be devised to cover every segment of the material flow - from raw materials to consumption. The manner of adoption of this concept by Lockheed's Missiles and Space Company and its efforts to bring to fruition practical results is presented.","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"124 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1963-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127412904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Production Techniques for Integrated Electronics 集成电子产品生产技术“，

IEEE Transactions on Product Engineering and Production Pub Date : 1963-07-01 DOI: 10.1109/TPEP.1963.1136400

W. Fuller

引用次数: 0

A Ten-Minute Safety Check for the Production Manager 生产经理十分钟安全检查

IEEE Transactions on Product Engineering and Production Pub Date : 1963-07-01 DOI: 10.1109/TPEP.1963.1136402

W. Happ

引用次数: 0

Chemical Processes as Manufacturing Tools for the Electronics Industry 作为电子工业制造工具的化学过程

IEEE Transactions on Product Engineering and Production Pub Date : 1963-04-01 DOI: 10.1109/TPEP.1963.1136397

L. Stearns

引用次数: 0

Elephantine Electronics --- A New Circuit Packaging Problem 大象电子——一个新的电路封装问题

IEEE Transactions on Product Engineering and Production Pub Date : 1963-04-01 DOI: 10.1109/TPEP.1963.1136393

R. Blessing, A. Poiré

{"title":"Elephantine Electronics --- A New Circuit Packaging Problem","authors":"R. Blessing, A. Poiré","doi":"10.1109/TPEP.1963.1136393","DOIUrl":"https://doi.org/10.1109/TPEP.1963.1136393","url":null,"abstract":"Very high voltage-high power electronic equipment packaging techniques present new and unique problems in the field of product engineering and packaging. New electronic systems in this category consist of a number of subunits, but all of the systems utilize a high voltage power supply as the basic unit. In the case of conventional electronic systems, the power supply components have standard shapes and are packaged in accepted configurations. Components performing these same functions in high voltage high power supplies, deviate tremendously from the norm. The power transformer may occupy the same space as a weekend cabin, the filter capacitors may be as large as a railroad car, the rectifiers may give the impression of factory chimney stacks. For reasons of size alone these components require special structural considerations. For reasons of their high voltage-high power operation they also require special configuration considerations. The packaging of equipment in this category involves the packaging of bulky components into an assembly, while considering ease of construction, ease of transportation and the ease of removal of components for maintenance purposes. The components along with the hardware utilized for the support structure, must then constitute a package that provides the most economical utilization of space, and at the same time, provide voltage clearances that may be several orders of magnitude greater than those normally encountered when packaging lower voltage components. In general, this equipment is not contained within a cabinet or rack as is normal in lower voltage circuitry. These equipments usually utilize one or more buildings either in existence or specially designed and constructed for the purpose. Consequently, considerable thought must be given to operator convenience and human engineering. The packaging, integration and manufacturing of a typical system including operational, safety and maintenance considerations will be described.","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1963-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129264242","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Semiconductor Part Handling for Automatic Manufacturing and Testing 半导体零件自动制造和测试处理

IEEE Transactions on Product Engineering and Production Pub Date : 1963-04-01 DOI: 10.1109/TPEP.1963.1136396

R. Schwarze

引用次数: 0

Electron Beam Cutting Techniques for Electronic Applications 电子束切割技术的电子应用

IEEE Transactions on Product Engineering and Production Pub Date : 1963-04-01 DOI: 10.1109/TPEP.1963.1136395

F. Schollhammer

引用次数: 1

Industrial Audio-Visual Applications 工业视听应用

IEEE Transactions on Product Engineering and Production Pub Date : 1963-04-01 DOI: 10.1109/TPEP.1963.1136394

J. Duer

引用次数: 0