IEEE Transactions on Product Engineering and Production最新文献

筛选
英文 中文
Techniques, Equipment and Procedures for Production Welding of Electronics 电子产品生产焊接技术、设备和程序
IEEE Transactions on Product Engineering and Production Pub Date : 1900-01-01 DOI: 10.1109/TPEP.1963.1136388
S. Francis
{"title":"Techniques, Equipment and Procedures for Production Welding of Electronics","authors":"S. Francis","doi":"10.1109/TPEP.1963.1136388","DOIUrl":"https://doi.org/10.1109/TPEP.1963.1136388","url":null,"abstract":"During the past five years we have seen a substantial upsurge in welding as a technique for fabrication of electronics. The term \"welding\" has been applied to a variety of techniques, each with its special applications and special equipment. This paper describes the many different types of welding and production equipment available, and discusses the special procedures required. These points are paramount: First, no one technique is universally applicable to system assembly and cordwood module fabrication, as well as to deposited film and integrated circuit manufacture. Secondly, though we do not have universal equipment, we do have universal problems. To be really successful with any technique, we must establish rigid control of materials, exhaustive engineering analysis of the weld schedule or setup, and strict maintenance of standards for machine and operator qualification and certi- fication.","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"80 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130720402","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Packaging Design Considerations Using Conventional Components 使用传统组件的包装设计注意事项
IEEE Transactions on Product Engineering and Production Pub Date : 1900-01-01 DOI: 10.1109/TPEP.1963.1136390
D. Grassi
{"title":"Packaging Design Considerations Using Conventional Components","authors":"D. Grassi","doi":"10.1109/TPEP.1963.1136390","DOIUrl":"https://doi.org/10.1109/TPEP.1963.1136390","url":null,"abstract":"","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114734855","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Assured Reliability in Soldered Connections: Solderability as Parameter of Assurance 焊接连接的可靠保证:可焊性作为保证的参数
IEEE Transactions on Product Engineering and Production Pub Date : 1900-01-01 DOI: 10.1109/TPEP.1963.1136391
L. Pessel
{"title":"Assured Reliability in Soldered Connections: Solderability as Parameter of Assurance","authors":"L. Pessel","doi":"10.1109/TPEP.1963.1136391","DOIUrl":"https://doi.org/10.1109/TPEP.1963.1136391","url":null,"abstract":"The reliability of any connecting process is statistically governed by the number of process parameters. Significantly, for reliable welding a multiplicity of parameters requires close control, but reliable soldering depends primarily upon one - solderability of the surfaces to be joined. The theoretical and practical implications of solderability and tests for its evaluation are discussed. An entirely new test is described which is rapid, simple, and significantly correlated with connection quality. The test is based upon an estimate of the contact angle between a molten solder preform and the metal surface. This concept is also linked theoretically with the surface tension-interfacial tension relationship controlling \"wetting\". This test has been used extensively in the evaluation of component lead wires and in measures to raise their solderability to the highest possible level, with remarkable effects upon connection quality. Formation of perfect fillets having mechanical and electrical redundancy becomes automatic, independent from the human element and little affected by variations of solder, flux, or procedure. Nonaggressive fluxes, and, in some cases, flux-less processes may be used. Highly reliable connections are obtainable with very low-melting and very highmelting solder alloys. Thus, controlled high solderability conveys to solder processes a reliability aspect which is unique and, in some respects, unsurpassed in other connecting processes.","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124628380","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Design of a Digital Telemetry Unit using Dot Components 基于点分量的数字遥测装置设计
IEEE Transactions on Product Engineering and Production Pub Date : 1900-01-01 DOI: 10.1109/TPEP.1963.1136389
J. Goodykoontz
{"title":"Design of a Digital Telemetry Unit using Dot Components","authors":"J. Goodykoontz","doi":"10.1109/TPEP.1963.1136389","DOIUrl":"https://doi.org/10.1109/TPEP.1963.1136389","url":null,"abstract":"It has long been apparent that uniformity of the body geometry and of the lead geometry and material of electronic parts is highly desirable. Dot or pellet component parts provide such uniformity to a high degree and thus lend themselves to the design of equipment of considerable sophistication. To demonstrate the technique a digital telemetry unit, previously packaged in the form of welded cordwood modules, was designed using dot components. The unit consists of some 1200 parts disposed on six card-shaped modules measuring 3\" x 6.7\" x 0.03\". Modules are made of molded epoxy and are color coded for assembly and trouble shooting purposes. Silkscreened conductive adhesive is used for intraconnections. All interconnections (i.e. external to modules) are brought out along one edge of the module in the form of flexible, multistranded wires. These wires are permanently soldered, book fashion, to an interconnection matrix consisting of an array of welded tubes. By treating the modules as pages in a book, all parts are accessible for inspection or replacement without disconnecting any section of the circuit. Foil-clad balsa wood spacers are provided for separation between adjacent modules. The modules and spacers are stacked and compressed by means of two rigid end plates and two screws, thus providing a compact, prestressed structure virtually immune to shock and vibration.","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"91 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121982710","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Control of Airborne Particulate Contamination 空气微粒污染的控制
IEEE Transactions on Product Engineering and Production Pub Date : 1900-01-01 DOI: 10.1109/TPEP.1963.1136387
F. Allison
{"title":"Control of Airborne Particulate Contamination","authors":"F. Allison","doi":"10.1109/TPEP.1963.1136387","DOIUrl":"https://doi.org/10.1109/TPEP.1963.1136387","url":null,"abstract":"","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132024056","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信