焊接连接的可靠保证:可焊性作为保证的参数

L. Pessel
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引用次数: 1

摘要

任何连接过程的可靠性在统计上由过程参数的数量决定。值得注意的是,为了实现可靠的焊接,需要严格控制多个参数,但可靠的焊接主要取决于待连接表面的可焊性。讨论了可焊性的理论和实际意义以及可焊性评价的测试方法。描述了一种全新的测试方法,该方法快速、简单,且与连接质量显著相关。该测试是基于熔化的焊料预成型和金属表面之间的接触角的估计。这一概念在理论上也与控制“润湿”的表面张力-界面张力关系联系在一起。该测试已广泛用于组件引线的评估和提高其可焊性到最高水平的措施,对连接质量有显著影响。具有机械和电气冗余的完美圆角的形成是自动的,不受人为因素的影响,几乎不受焊料、助焊剂或工艺变化的影响。非侵蚀性助焊剂,在某些情况下,可使用无助焊剂工艺。非常低熔点和非常高熔点的焊料合金可获得高度可靠的连接。因此,可控的高可焊性给焊接工艺带来了独特的可靠性,在某些方面,在其他连接工艺中是无与伦比的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Assured Reliability in Soldered Connections: Solderability as Parameter of Assurance
The reliability of any connecting process is statistically governed by the number of process parameters. Significantly, for reliable welding a multiplicity of parameters requires close control, but reliable soldering depends primarily upon one - solderability of the surfaces to be joined. The theoretical and practical implications of solderability and tests for its evaluation are discussed. An entirely new test is described which is rapid, simple, and significantly correlated with connection quality. The test is based upon an estimate of the contact angle between a molten solder preform and the metal surface. This concept is also linked theoretically with the surface tension-interfacial tension relationship controlling "wetting". This test has been used extensively in the evaluation of component lead wires and in measures to raise their solderability to the highest possible level, with remarkable effects upon connection quality. Formation of perfect fillets having mechanical and electrical redundancy becomes automatic, independent from the human element and little affected by variations of solder, flux, or procedure. Nonaggressive fluxes, and, in some cases, flux-less processes may be used. Highly reliable connections are obtainable with very low-melting and very highmelting solder alloys. Thus, controlled high solderability conveys to solder processes a reliability aspect which is unique and, in some respects, unsurpassed in other connecting processes.
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