{"title":"集成电子产品生产技术“，","authors":"W. Fuller","doi":"10.1109/TPEP.1963.1136400","DOIUrl":null,"url":null,"abstract":"Integrated components made by using thin film and semiconductor techniques have an important part in the design and fabrication of physically smaller, more reliable electronic systems. The general processes of materials preparation, metallizing, circuit pattern formation, materials modification, pattern modification, lead attachment and protection are presented for both thin film and semiconductor integrated components. Comparative evaluation indicates that a combination of the two technologies will be used to meet the requirements of the sixties.","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1963-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Production Techniques for Integrated Electronics\",\"authors\":\"W. Fuller\",\"doi\":\"10.1109/TPEP.1963.1136400\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Integrated components made by using thin film and semiconductor techniques have an important part in the design and fabrication of physically smaller, more reliable electronic systems. The general processes of materials preparation, metallizing, circuit pattern formation, materials modification, pattern modification, lead attachment and protection are presented for both thin film and semiconductor integrated components. Comparative evaluation indicates that a combination of the two technologies will be used to meet the requirements of the sixties.\",\"PeriodicalId\":313371,\"journal\":{\"name\":\"IEEE Transactions on Product Engineering and Production\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1963-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Product Engineering and Production\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TPEP.1963.1136400\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Product Engineering and Production","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TPEP.1963.1136400","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Integrated components made by using thin film and semiconductor techniques have an important part in the design and fabrication of physically smaller, more reliable electronic systems. The general processes of materials preparation, metallizing, circuit pattern formation, materials modification, pattern modification, lead attachment and protection are presented for both thin film and semiconductor integrated components. Comparative evaluation indicates that a combination of the two technologies will be used to meet the requirements of the sixties.
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