2009 IEEE Workshop on Signal Propagation on Interconnects最新文献_第3页

Measurement and simulation correlation of backplane serdes channel 背板伺服通道的测量与仿真相关

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089870

P. Qu

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引用次数: 2

On the construction of uniformly stable multivariate interconnect macromodels 一致稳定多元互联宏观模型的构造

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089856

P. Triverio, S. Grivet-Talocia, M. Nakhla

引用次数: 2

Experimental validation of the RC-interconnect effect equalization with negative group delay active circuit in planar hybrid technology 平面混合技术中负群延迟有源电路rc互连效应均衡的实验验证

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089836

B. Ravelo, A. Pérennec, M. Le Roy

引用次数: 23

Signal integrity of femtosecond pulses patterns in a 500Gb/s all-optical demultiplexer for otdm interconnections by using nonlinearities in semiconductor optical amplifiers 利用半导体光放大器的非线性分析飞秒脉冲模式在500Gb/s otdm全光解复用器中的信号完整性

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089844

C. Crognale, A. Di Giansante

{"title":"Signal integrity of femtosecond pulses patterns in a 500Gb/s all-optical demultiplexer for otdm interconnections by using nonlinearities in semiconductor optical amplifiers","authors":"C. Crognale, A. Di Giansante","doi":"10.1109/SPI.2009.5089844","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089844","url":null,"abstract":"This paper numerically investigates the problematic of preserving the signal integrity in a board equipped with Semiconductor Optical Amplifiers (SOAs), optically interconnected to perform optical signal demultiplexing at several hundreds of Gb/s. First, the extreme features of the nonlinear optical gain saturation dynamics in SOAs inputted with dense femtosecond optical pulses signals have been derived by means of a proper theoretical model, suitable for calculating - in a self-consistent way - the quasi-Fermi levels and the carriers temperatures from the instantaneous values of the carrier density and the energy densities in both valence and conduction bands. Then, the results obtained have been used to investigate the potential performances of an interferometric SOA-based pump-probe scheme working as an all-optical ultrafast demultiplexing structure. Simulations have revealed how, with a proper management of the SOAs nonlinear optical gain dynamics, this architecture could extract any 100Gb/s channel from a 500Gb/s pattern, with a high value of its extinction ratio, a negligible amount of optical losses, and no degradation due to the SOA optical gain pattern dependence.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125761030","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Integral power net integrity analysis of a packaged u-Controller system including the u-Controller on-chip power net distribution 包含u-Controller片上电网分配的盒装u-Controller系统整体电网完整性分析

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089866

E. Miersch, M. Goekcen, T. Steinecke

引用次数: 1

Black-box identification of delay-based macromodels from measured terminal responses 从实测终端响应中识别基于延迟的宏模型

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089846

P. Triverio, S. Grivet-Talocia, A. Chinea

引用次数: 3

Differential to common mode conversion due to asymmetric ground via configurations 差分到共模转换，由于不对称的地通孔配置

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089852

R. Rímolo-Donadío, X. Duan, H. Bruns, C. Schuster

引用次数: 11

Equivalent victim model of the coupled interconnects for simulating crosstalk induced glitches and delays 用于模拟串扰引起的故障和延迟的耦合互连等效受害模型

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089850

S. Hasan, A. K. Palit, W. Anheier

引用次数: 8

Conductor modeling with the surface admittance operator of triangles 用三角形表面导纳算子进行导体建模

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089860

T. Demeester, D. De Zutter

引用次数: 0

Polarization mode basis functions for modeling insulator-coated through-silicon via (TSV) interconnections 模拟绝缘子涂层硅通孔(TSV)互连的极化模式基函数

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089849

K. Han, M. Swaminathan

引用次数: 18