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2009 IEEE Workshop on Signal Propagation on Interconnects最新文献

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Low-impedance and high-Q transmission line for mmw VCO 毫米波压控振荡器用低阻抗高q传输线
2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089864
Y. Nomiyama, W. Chaivipas, K. Okada, A. Matsuzawa
{"title":"Low-impedance and high-Q transmission line for mmw VCO","authors":"Y. Nomiyama, W. Chaivipas, K. Okada, A. Matsuzawa","doi":"10.1109/SPI.2009.5089864","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089864","url":null,"abstract":"A transmission line with low impedance and high quality factor is presented in this paper. This transmission line has a ground shield and metal slits unlike conventional transmissions line which has either a ground shield or metal slits. Simulation results shows that the floating metal slits lowers the impedance of the transmission line while maintaining a high quality factor. This transmission line is employed as a resonator of a millimeter voltage controlled oscillator to lower the phase noise.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125920542","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Identifying Bands of passivity violations for scattering-based macromodels by a half-size test matrix 利用半尺寸测试矩阵识别基于散射的宏观模型的无源违规带
2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089859
B. Gustavsen
{"title":"Identifying Bands of passivity violations for scattering-based macromodels by a half-size test matrix","authors":"B. Gustavsen","doi":"10.1109/SPI.2009.5089859","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089859","url":null,"abstract":"It is common practice to assess the passivity properties of rational macromodels via the eigenvalues of a particular Hamiltonian matrix that is established from the model's state-space representation. The size of the test matrix is equal to twice the number of states, which can make the eigenvalue computation time consuming in the case of large models. In this paper we explore the application of a half-size test matrix that was recently introduced for use with scattering (S-) parameter models. The new test matrix is shown to reduce the computation time by a factor of about eight, and it avoids the need for thresholding when processing the eigenvalues.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125057295","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Passivity verification and enforcement of delayed rational function macromodels from networks characterized by tabulated data 表列数据网络中延迟有理函数宏模型的无源验证与实现
2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089848
A. Charest, M. Nakhla, R. Achar, Changzhong Chen
{"title":"Passivity verification and enforcement of delayed rational function macromodels from networks characterized by tabulated data","authors":"A. Charest, M. Nakhla, R. Achar, Changzhong Chen","doi":"10.1109/SPI.2009.5089848","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089848","url":null,"abstract":"Passivity has become a critical issue while modeling high-speed networks characterized by tabulated data. For modules containing long delays, macromodeling based on delayed rational functions has been gaining popularity in recent years. However, there are currently no passivity verification or enforcement methods available for such macromodels. To address this issue, this paper proposes passivity verification and enforcement algorithms for delayed rational function macromodels of high-speed modules, characterized by tabulated data. Necessary theoretical foundation and validating examples are presented.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125556691","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
On the quantification and improvement of the models for surface roughness 表面粗糙度模型的量化与改进
2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089851
B. Curran, I. Ndip, S. Guttowski, H. Reichl
{"title":"On the quantification and improvement of the models for surface roughness","authors":"B. Curran, I. Ndip, S. Guttowski, H. Reichl","doi":"10.1109/SPI.2009.5089851","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089851","url":null,"abstract":"Predictability of transmission line parameters is very important for microelectronics packaging. Surface roughness can cause a drastic deviation in transmission line parameters from the ideal theoretically calculated values. State-of-the-art analytical and full-wave surface roughness models have been helpful in closing this gap but they have considerable limitations, especially when applied to certain types of thin-film structures. This work analyzes some state-of-the-art surface roughness models and quantifies their limitations. A new approach to surface roughness characterization is then presented.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127572628","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
Characterization and modeling of the power delivery networks of memory chips 存储芯片供电网络的表征与建模
2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089835
I. Stievano, I. Maio, Luca Rigazio, F. Canavero, R. Izzi, A. Girardi, T. Lessio, A. Conci, T. Cunha, H. Teixeira, J. Pedro
{"title":"Characterization and modeling of the power delivery networks of memory chips","authors":"I. Stievano, I. Maio, Luca Rigazio, F. Canavero, R. Izzi, A. Girardi, T. Lessio, A. Conci, T. Cunha, H. Teixeira, J. Pedro","doi":"10.1109/SPI.2009.5089835","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089835","url":null,"abstract":"This paper focuses on the power delivery characterization of high-speed IC memories by means of on-chip measurements. A systematic analysis of the measurement setup, of the effects of chip biasing and of the use of the measured responses to develop models defined by simplified circuit equivalents is given. All the results collected in the paper are based on real measurements carried out on a commercial 90nm flash memory.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126699445","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
SPI proceedings: Investigation of the interactions between vias and the power-bus SPI会议录:调查过孔和电源总线之间的相互作用
2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089841
G. Heinrich, S. Dickmann
{"title":"SPI proceedings: Investigation of the interactions between vias and the power-bus","authors":"G. Heinrich, S. Dickmann","doi":"10.1109/SPI.2009.5089841","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089841","url":null,"abstract":"Physics-based models are widely used for the description of vias in multilayer PCBs. In this paper, such a lumped model for a via in a 4-layer PCB and the extraction of its elements are described. Furthermore, the undesired interactions between the via and the power-bus in a 4-layer PCB are investigated using the calculation of a combined lumped model and measurements of S-parameters.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"96 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133205210","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Signal integrity analysis of carbon nanotube on-chip interconnects 碳纳米管片上互连的信号完整性分析
2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089842
A. Chiariello, A. Maffucci, G. Miano
{"title":"Signal integrity analysis of carbon nanotube on-chip interconnects","authors":"A. Chiariello, A. Maffucci, G. Miano","doi":"10.1109/SPI.2009.5089842","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089842","url":null,"abstract":"The paper deals with the signal integrity performances of a nanoscale on-chip interconnect made by using the carbon nanotube technology. As conventional copper does, this material can be used for fabricating both horizontal traces and vertical vias. Carbon nanotubes interconnects outperform copper ones in terms of electrical, thermal and mechanical properties. However their inductance is much higher compared to that of conventional material, due to inertial effects. Usually this inductance is neglected in the circuit equivalent representation of carbon nanotube interconnects. Here we use a recently proposed circuit model to study the effects of the inductance on the signal integrity. The analysis is carried out by referring to a realistic configuration foreseen for the future 22 nm technology.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"191 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134474911","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
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