2009 IEEE Workshop on Signal Propagation on Interconnects最新文献_第2页

High frequency characterization and modeling of high density TSV in 3D integrated circuits 三维集成电路中高密度TSV的高频特性与建模

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089840

C. Bermond, L. Cadix, A. Farcy, T. Lacrevaz, P. Leduc, B. Fléchet

引用次数: 61

Compromised impedance match design for signal integrity of pogo pins structures with different signal-ground patterns 不同信号地模式弹簧脚结构信号完整性的折衷阻抗匹配设计

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089838

Ruey-Bo Sun, R. Wu, Shih-Wei Hsiao

引用次数: 9

Fast analysis of power distribution networks using waveform relaxation 用波形松弛法快速分析配电网

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089834

R. Achar, M. Nakhla, A. Sridhar, Harjot S. Dhindsa, D. Paul

引用次数: 3

Identification of interconnect failure mechanisms using RF impedance analysis 利用射频阻抗分析识别互连失效机制

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089855

Daeil Kwon, M. Azarian, M. Pecht

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引用次数: 13

Analysis of EMI dependence on signal duty and supplied voltage 电磁干扰对信号占空率和电源电压的依赖性分析

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089869

Pilsoo Lee, J. Wee, Kyoo-Yeong Lee, Inchae Song, Boo‐Gyoun Kim

引用次数: 2

Supply voltage drop study considering on-chip self inductance of a 32-bit processor's power grid 考虑片上自感的32位处理器电网供电压降研究

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089853

D. Andersson, Bjorn Nilsson, J. Pihl, L. Svensson, P. Larsson-Edefors

引用次数: 10

Modeling the interconnection of a pseudo-differential link using a wide return conductor 采用宽回路导线的伪差分链路互连建模

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089862

F. Broydé, E. Clavelier

引用次数: 2

An equivalent circuit model for the identification of the stub resonance due to differential vias on PCB 基于等效电路模型的差分过孔短段谐振辨识方法

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089839

V. Ricchiuti, F. de Paulis, A. Orlandi

引用次数: 3

Fast passivity enforcement technique for common-pole S-parameter multiport systems 共极s参数多端口系统的快速无源增强技术

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089857

D. Deschrijver, T. Dhaene

引用次数: 0

Vector Fitting vs. Levenberg-Marquardt : Some experiments 向量拟合vs. Levenberg-Marquardt:一些实验

2009 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2009-05-12 DOI: 10.1109/SPI.2009.5089858

L. Knockaert, F. Ferranti, T. Dhaene

引用次数: 12