{"title":"Trends in recording and control technologies and evolution of subsystem architectures for data storage","authors":"C. Bajorek","doi":"10.1109/CMPEUR.1989.93329","DOIUrl":"https://doi.org/10.1109/CMPEUR.1989.93329","url":null,"abstract":"The author describes past progress in technologies important to data storage and their application in the latest products. He examines future storage trends and the key technical challenges involved in extending recording technologies. He also briefly contrasts magnetic and optical storage devices and suggests how they can be best applied. It is suggested that optical storage technology will initially establish itself in applications which can capitalize on a single removal disk with very high capacity. In a broader sense, both technologies will coexist, with magnetic recording remaining the dominant technology for the foreseeable future.<<ETX>>","PeriodicalId":304457,"journal":{"name":"Proceedings. VLSI and Computer Peripherals. COMPEURO 89","volume":"405 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129195957","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Interworking in a heterogeneous environment","authors":"H. Schmutz, G. Muller","doi":"10.1109/CMPEUR.1989.93451","DOIUrl":"https://doi.org/10.1109/CMPEUR.1989.93451","url":null,"abstract":"The authors introduce the components which are necessary to extend a communication subsystem to a comprehensive support system for distributed processing in a heterogeneous multivendor environment. Major components are services for distributed invocation, for directors, and for security. Known solutions are discussed, and some open problems are identified. Particular attention is given to the distributed academic computing network operating system (DACNOS), a comprehensive architecture and implementation of a support environment for distributed applications in a heterogeneous environment. The main goal of DACNOS was the development of a systematic approach to resource sharing and distributed processing in a heterogeneous environment. Users can access remote files, databases, programs, and other resources from within their local environment. Without learning alien interfaces, users can share information and resources with the users of different operating systems. DACNOS is a running prototype supporting real applications.<<ETX>>","PeriodicalId":304457,"journal":{"name":"Proceedings. VLSI and Computer Peripherals. COMPEURO 89","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127578322","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
F. Drees, Hartmut Dr Ing Grethen, R. Nisius, W. Pekruhn
{"title":"Performances of thermal transfer printing and their improvement by model calculations","authors":"F. Drees, Hartmut Dr Ing Grethen, R. Nisius, W. Pekruhn","doi":"10.1109/CMPEUR.1989.93368","DOIUrl":"https://doi.org/10.1109/CMPEUR.1989.93368","url":null,"abstract":"The thermodynamic behavior of a thin-film multilayer structure is calculated under stress of a periodical powered electrical heat source. The model is used to optimize the print quality, lifetime, and efficiency of a thermal-transfer printhead. The modeling task involves the adaptation of the printing conditions (pulse power, timing, and mechanical forces) to the thermal and mechanical properties of the printhead, with the aim of good print quality, high printing speed, low power consumption, and a high lifetime of the printhead. The calculations were done in one dimension on the basis of the heat-transfer equation. Numerical solutions were found with Euler's method, while the material constants were taken from literature. The results are shown to be in good agreement with IR-microscope measurements. The technology has been realised in the Siemens PT 34 thermal transfer page printer.<<ETX>>","PeriodicalId":304457,"journal":{"name":"Proceedings. VLSI and Computer Peripherals. COMPEURO 89","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114185922","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Powder EL displays","authors":"A. Vecht, S. S. Chadha","doi":"10.1109/CMPEUR.1989.93365","DOIUrl":"https://doi.org/10.1109/CMPEUR.1989.93365","url":null,"abstract":"The development and application of electroluminescent (EL) powder phosphors in display technology are reviewed. The structure, preparation, and properties of EL devices are presented, and their application in display hardware is described. The future potential of large EL matrix displays is discussed. Although the uses of AC EL powder phosphor devices are at present confined to large-area fixed legend displays, the advent of better thin-film transistor (TFT) technology may well change the possible application areas. DC EL powder technology allows a display comprising 2000 characters, compatible with PC format.<<ETX>>","PeriodicalId":304457,"journal":{"name":"Proceedings. VLSI and Computer Peripherals. COMPEURO 89","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132323268","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Present status of optical storage professional market applications and future developments","authors":"A. Hulst, J. J. Stevens","doi":"10.1109/CMPEUR.1989.93346","DOIUrl":"https://doi.org/10.1109/CMPEUR.1989.93346","url":null,"abstract":"The authors discuss the present status of the application of optical systems as computer peripherals. A few infrastructural criteria are defined to assess the present applications in the market: distribution and storage of information. A short review is given of the different types of memory, CD-ROM, videodisk, and write-once and rewritable optical systems. The main physical and chemical storage principles are mentioned, and a survey is given of a few important applications. The position of optical systems is then assessed using the criteria mentioned. This leads to the conclusion that the infrastructure required for further growth of the technology is largely in place. Finally, expectations are given for the direction of technical and market growth in the near future.<<ETX>>","PeriodicalId":304457,"journal":{"name":"Proceedings. VLSI and Computer Peripherals. COMPEURO 89","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126679228","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Thin film transistors for addressing LC-flat panel displays","authors":"T. Kallfass","doi":"10.1109/CMPEUR.1989.93364","DOIUrl":"https://doi.org/10.1109/CMPEUR.1989.93364","url":null,"abstract":"Thin-film transistors (TFTs) are exceptionally qualified for addressing large-area liquid-crystal displays. The TFT circuits and the requirements for operating the picture elements in the displays are described. Further comments focus on the staggered structure of the TFTs and the materials a-Si:H and poly-CdSe used as semiconductors and Ta/sub 2/O/sub 5/, SiO/sub 2/, and SiN for gate isolators. The electrical data (such as mobility and off-current) of the TFTs determine the optical performance of the displays, characterized by a high contrast and a wide viewing angle.<<ETX>>","PeriodicalId":304457,"journal":{"name":"Proceedings. VLSI and Computer Peripherals. COMPEURO 89","volume":"85 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126761710","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Advanced CAD tools for ASIC testing","authors":"D. Liu","doi":"10.1109/CMPEUR.1989.93473","DOIUrl":"https://doi.org/10.1109/CMPEUR.1989.93473","url":null,"abstract":"The author describes a set of CAD tools for supporting the testing of application-specific integrated circuits (ASICs) designed with a scan-path technique. The tool set includes a project-specific design-rule checker, a scan designer generator, and a hardware-accelerated automatic test-pattern generation program. The tool set contains the following unique features: it supports a generalized scan-path design methodology; it makes it easy for a novice designer to do a scan design; and it generates test patterns which detect faults closely related to the failure in silicon.<<ETX>>","PeriodicalId":304457,"journal":{"name":"Proceedings. VLSI and Computer Peripherals. COMPEURO 89","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126559411","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"DISK-an object-oriented design tool for the synthesis and evaluation of digital circuits","authors":"T.K. Kropf, F. Feldbusch","doi":"10.1109/CMPEUR.1989.93476","DOIUrl":"https://doi.org/10.1109/CMPEUR.1989.93476","url":null,"abstract":"The authors present an approach to the representation of design data that is based on an object-oriented programming paradigm. It is shown that this provides a powerful mechanism for handling circuit descriptions even at higher levels of the design hierarchy. In particular, it is possible to represent structural and behavioral data in a natural way, which facilitates the transformation of design data from a behavioral to a structural description, and vice versa. MOOD, an object-oriented data structure, is described as the first result of a prototype implementation together with DISK, a framework for using it with various design tools.<<ETX>>","PeriodicalId":304457,"journal":{"name":"Proceedings. VLSI and Computer Peripherals. COMPEURO 89","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128141998","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Advanced system design concepts facilitating silicon based VLSI chip packaging and interconnection techniques","authors":"A. Blum, M. Briska, K. Najmann, M. Schmidt","doi":"10.1109/CMPEUR.1989.93486","DOIUrl":"https://doi.org/10.1109/CMPEUR.1989.93486","url":null,"abstract":"Potentially, the silicon-based VLSI chip packaging and interconnection technology (hybrid wafer-scale integration, HWSI) provides for several thousand high-speed interconnections between individual VLSI chips, allowing an electrically homogeneous chip-boundary-transparent clustering of a tremendous amount of digital circuitry. Therefore, the abstract-structured logic-design methodology can also be efficiently used for more complex system structures, such as an entire central electronic complex of a supermini-computer, which may comprise a multitude of VLSI chips executing heterogeneous system functions. A brief introduction to an abstract-structured digital design utilizing increased intercommunication resources between functional logic modules is given, along with a description of several potential realization concepts of the silicon-based VLSI chip-interconnection technology, which provides an extraordinarily high pin count. In addition, the key aspects of the technology are outlined, and their potential use in system-level design is illustrated by several intercommunication-intensive implementation examples.<<ETX>>","PeriodicalId":304457,"journal":{"name":"Proceedings. VLSI and Computer Peripherals. COMPEURO 89","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115218691","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Technology changes in the field of sensors","authors":"C. Weyrich","doi":"10.1109/CMPEUR.1989.93324","DOIUrl":"https://doi.org/10.1109/CMPEUR.1989.93324","url":null,"abstract":"Summary form only given. The history and current status of sensor technology are reviewed. It is predicted that modern technologies such as thin- or thick-film fabrication or silicon process technology will initiate evolutional processes rather than a revolution of silicon sensors, with classical sensors and their silicon counterparts sharing future applications (the latter for mass applications: the former for special purposes where delicate specifications or environmental conditions cannot be met by the physical properties of silicon).<<ETX>>","PeriodicalId":304457,"journal":{"name":"Proceedings. VLSI and Computer Peripherals. COMPEURO 89","volume":"90 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1989-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122724505","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}