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2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)最新文献

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Signal integrity and EMC performance enhancement using 3D integrated circuits - A case study 使用3D集成电路增强信号完整性和EMC性能-一个案例研究
2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2013-12-01 DOI: 10.1109/EMCCOMPO.2013.6735164
E. Sicard, Jianfei Wu, Jiancheng Li
{"title":"Signal integrity and EMC performance enhancement using 3D integrated circuits - A case study","authors":"E. Sicard, Jianfei Wu, Jiancheng Li","doi":"10.1109/EMCCOMPO.2013.6735164","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2013.6735164","url":null,"abstract":"In this paper, the signal integrity (SI) and Electromagnetic Compatibility (EMC) performance of a microcontroller and memory are simulated in 2D and 3D assembly versions. Three types of configurations are investigated: conventional 2D routing on printed-circuit-board, stacked dies with wire bonding and stacked dies with Through-Silicon-Via (TSV). The study addresses signal integrity of the memory bus and the conducted emission of the microcontroller. An equivalent bus model is presented for order reduction and improved simulation efficiency. The benefits of 3D integration are highlighted, in terms of improved eye diagram and one decade reduction in parasitic emission.","PeriodicalId":302757,"journal":{"name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114366619","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
System-ESD validation of a microcontroller with external RC-filter 带有外部rc滤波器的微控制器的系统esd验证
2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2013-12-01 DOI: 10.1109/EMCCOMPO.2013.6735200
T. Steinecke, M. Unger, Stanislav Scheier, S. Frei, Josip Bačmaga, A. Barić
{"title":"System-ESD validation of a microcontroller with external RC-filter","authors":"T. Steinecke, M. Unger, Stanislav Scheier, S. Frei, Josip Bačmaga, A. Barić","doi":"10.1109/EMCCOMPO.2013.6735200","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2013.6735200","url":null,"abstract":"Although microcontrollers are generally well separated from ESD events happening on a fully equipped and mounted electronic control unit, special configurations expose some microcontrollers to these system-ESD events. In the BISS IC EMC Test Specification [1], several system-level disturbance tests are referenced. One of them is the unpowered system-ESD test according to the international standard ISO 10506 [2]. Automotive companies request that microcontrollers and other ICs shall withstand e.g. 6 kV system-ESD stress applied to IC-pins either directly or via discrete protection components. This paper describes the experience made with a 65 nm CMOS 32-bit microcontroller including an external ESD protection filter when exposed to normative system-ESD pulses. Although not expected, discrete SMD protection capacitors degraded or even showed short-circuits after being exposed to several ESD events.","PeriodicalId":302757,"journal":{"name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"118 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116506914","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Study of radiated immunity of an electronic system in a reverberating chamber 混响室中电子系统的辐射抗扰度研究
2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2013-12-01 DOI: 10.1109/EMCCOMPO.2013.6735176
L. Guibert, P. Millot, X. Ferrières, E. Sicard
{"title":"Study of radiated immunity of an electronic system in a reverberating chamber","authors":"L. Guibert, P. Millot, X. Ferrières, E. Sicard","doi":"10.1109/EMCCOMPO.2013.6735176","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2013.6735176","url":null,"abstract":"In this paper, we are interested in measuring the level of immunity of the radiated mode of an electronic system. The behavior of this system has been studied in a Mode Stirrer Reverberating Chamber (MSRC). Nowadays, many equipment manufacturers use the MSRC as a measurement facility to describe their electronic systems in the field of EMC. In the first part, we present the use of the MSRC for measuring EMC susceptibility. Then we present the electronic system under test (DUT) and the method allows us to characterize the functional electronic behavior. In a second part, we present a novel method that allows on the one hand measurement the level of immunity and on the other hand derivation of a model of the level of immunity of the electronic system studied.","PeriodicalId":302757,"journal":{"name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"77 10","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134426875","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Microcontroller emission simulation based on power consumption and clock system 基于功耗和时钟系统的单片机发射仿真
2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2013-12-01 DOI: 10.1109/EMCCOMPO.2013.6735197
T. Steinecke
{"title":"Microcontroller emission simulation based on power consumption and clock system","authors":"T. Steinecke","doi":"10.1109/EMCCOMPO.2013.6735197","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2013.6735197","url":null,"abstract":"Various approaches exist to build simulation models for the electromagnetic emission (EME) of digital integrated circuits [1-6]. However, several drawbacks constrain their configuration and usage. A new modelling approach is described in this paper. It is based on the main EME-relevant parameters of digital circuits, i.e. dynamic power and clock rates. This information should be even available before the IC design phase starts. With this approach, the models can be created without any additional information about module size, functional patterns or embedded decoupling capacitors. Thus it can be used to perform design studies wrt. clock rate selection, clock modulation and impact of dynamic power consumption. The modelling and simulation software can even handle very complex ICs like high-end 32-bit microcontrollers. The program is named EMISoC which stands for “EMI simulation of systems-on-chip”. It has been validated for existing 65 nm CMOS designs and is currently used for emission estimations of future 40 nm microcontrollers for automotive applications. This paper describes the EMISoC modelling approach, features and limitations.","PeriodicalId":302757,"journal":{"name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123992005","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Noise analysis using on-chip waveform monitor in bandgap voltage references 用片上波形监测器进行带隙电压参考噪声分析
2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2013-12-01 DOI: 10.1109/EMCCOMPO.2013.6735205
Akitaka Murata, Shuji Agatsuma, D. Ikoma, K. Ichikawa, T. Tsuda, M. Nagata, K. Yoshikawa, Y. Araga, Yuji Harada
{"title":"Noise analysis using on-chip waveform monitor in bandgap voltage references","authors":"Akitaka Murata, Shuji Agatsuma, D. Ikoma, K. Ichikawa, T. Tsuda, M. Nagata, K. Yoshikawa, Y. Araga, Yuji Harada","doi":"10.1109/EMCCOMPO.2013.6735205","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2013.6735205","url":null,"abstract":"In this paper, the susceptibility of a CMOS bandgap voltage reference (BGR) to external noise was investigated using an on-chip waveform monitor circuit in conjunction with circuit simulations. A Direct RF Power Injection method was employed for the immunity test of the BGR. Also, we evaluated the performance of the on-chip waveform monitor and analyze the BGR immunity using the on-chip monitor. As the results, we have clarified the mechanism of the BGR malfunction. The output voltage drop of the BGR was caused by the offset of operational amplifier in BGR.","PeriodicalId":302757,"journal":{"name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115722343","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Automatic verification of EMC immunity by simulation 电磁兼容抗扰度仿真自动验证
2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2013-12-01 DOI: 10.1109/EMCCOMPO.2013.6735201
B. Vrignon, P. Caunegre, J. Shepherd, Jianfei Wu
{"title":"Automatic verification of EMC immunity by simulation","authors":"B. Vrignon, P. Caunegre, J. Shepherd, Jianfei Wu","doi":"10.1109/EMCCOMPO.2013.6735201","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2013.6735201","url":null,"abstract":"Immunity of analog circuit blocks is becoming a major design risk. This paper presents an automated methodology to simulate the susceptibility of a circuit during the design phase. More specifically, we propose a CAD tool which determines the fail/pass criteria of a signal under direct power injection (DPI). This contribution describes the function of the tool which is validated by a LDO regulator.","PeriodicalId":302757,"journal":{"name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"198200 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132642476","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Conducted immunity of three Op-Amps using the DPI measurement technique and VHDL-AMS modeling 利用DPI测量技术和VHDL-AMS建模对三个运放的传导抗扰度进行了研究
2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2013-12-01 DOI: 10.1109/EMCCOMPO.2013.6735172
S. Hairoud, T. Dubois, A. Tetelin, G. Duchamp
{"title":"Conducted immunity of three Op-Amps using the DPI measurement technique and VHDL-AMS modeling","authors":"S. Hairoud, T. Dubois, A. Tetelin, G. Duchamp","doi":"10.1109/EMCCOMPO.2013.6735172","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2013.6735172","url":null,"abstract":"This paper presents an application of the ICIM-CI model to the prediction of the susceptibility of ICs (Integrated Circuits) to environmental disturbances in avionic boards. The method is illustrated by the obsolescence study of three commercial operational amplifiers (Op-Amps) showing quasi-identical electrical characteristics and pin-to-pin compatibility, through the comparison of their respective conducted immunities. The model is developed in VHDL-AMS language, and the simulation results are validated through comparison with Direct Power Injection measurements.","PeriodicalId":302757,"journal":{"name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127037436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Broadband detection of radiating moments using the TEM-cell and a phase-calibrated oscilloscope 利用tem单元和相位校准示波器进行宽带辐射矩检测
2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2013-12-01 DOI: 10.1109/EMCCOMPO.2013.6735167
R. Gillon, N. Bako, A. Barić
{"title":"Broadband detection of radiating moments using the TEM-cell and a phase-calibrated oscilloscope","authors":"R. Gillon, N. Bako, A. Barić","doi":"10.1109/EMCCOMPO.2013.6735167","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2013.6735167","url":null,"abstract":"The differential and common-mode signals across the TEM-cell ports are known to be correlated with magnetic and electric dipoles respectively. Historically, the absence of phase information in the measurements complicated the identification procedure for radiating moments. Using a phase-calibrated scope, this paper demonstrates a broadband and effective method for the extraction of radiating moments.","PeriodicalId":302757,"journal":{"name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122936350","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EMC immunity of integrated smart power transistors in a non-50Ω environment non-50Ω环境下集成智能功率晶体管的抗EMC性能
2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2013-12-01 DOI: 10.1109/EMCCOMPO.2013.6735203
Hermann Nzalli, W. Wilkening, R. Jansen
{"title":"EMC immunity of integrated smart power transistors in a non-50Ω environment","authors":"Hermann Nzalli, W. Wilkening, R. Jansen","doi":"10.1109/EMCCOMPO.2013.6735203","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2013.6735203","url":null,"abstract":"The Direct Power Injection (DPI) standard, widely used for the susceptibility analysis of integrated circuits (IC), specifies an ideal 50Ω-environment for the investigations. This constant load assumption does not fully cover latter stages or the IC final operating environment, where ICs are subjected to various load impedances, especially at pins which are connected to wiring harnesses. We present variable-load DPI measurements and large-signal simulations for new circuit blocks, namely a simplified high-side driver and an ESD structure. The results extend the applicability of small-signal simplification methods beyond a low-side driver formerly reported by the same authors.","PeriodicalId":302757,"journal":{"name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114523645","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Spread spectrum clocking for emission reduction of charge pump applications 扩频时钟用于减少电荷泵的发射
2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2013-12-01 DOI: 10.1109/EMCCOMPO.2013.6735185
B. Deutschmann
{"title":"Spread spectrum clocking for emission reduction of charge pump applications","authors":"B. Deutschmann","doi":"10.1109/EMCCOMPO.2013.6735185","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2013.6735185","url":null,"abstract":"Spread spectrum clock generation (SSCG) techniques are widely used in digital systems as the digital clock signals are considered as one of the major sources for conducted and radiated electromagnetic emission. Although spread spectrum techniques can nowadays be found in many clocked digital system, they are rarely found in clock signals for automotive power systems such as power switches or bridges. In this paper the ability of using SSCG techniques for automotive charge pump applications is investigated. It is shown how this technique can be used to reduce the electromagnetic emission that is caused by the high frequency switching activity of charge pumps. Additionally the assets and drawbacks when using this technique are explained. Based on conducted electromagnetic emission measurements of a charge pump EMC test chip it is shown how typical spread spectrum parameters like frequency deviation, modulation frequency and modulation signal can be optimized in order to maximize the electromagnetic emission reduction in certain frequency ranges.","PeriodicalId":302757,"journal":{"name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115188050","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
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