Xingran Zhao, Hong Li, Yuting Wang, Zhe Zhou, K. Sun, Zhengming Zhao
{"title":"A Temperature-dependent PSpice Short-circuit Model of SiC MOSFET","authors":"Xingran Zhao, Hong Li, Yuting Wang, Zhe Zhou, K. Sun, Zhengming Zhao","doi":"10.1109/WiPDAAsia.2019.8760311","DOIUrl":"https://doi.org/10.1109/WiPDAAsia.2019.8760311","url":null,"abstract":"A temperature-dependent PSpice short-circuit model of silicon carbide metal-oxide semiconductor field effect transistor (SiC MOSFET) is proposed in this paper, which can be used to study the short-circuit characteristic of SiC MOSFET by simulation. Based on the non-segmented model, the normal working model of SiC MOSFET is established first. The correctness of the normal working model is verified by comparing the simulation results with the characteristic curves in the SiC MOSFET’s datasheet. Then the thermal network model of case-to-junction is introduced to describe the changes of junction temperature during short-circuit condition, and the short-circuit current of SiC MOSFET is further fitted based on the junction temperature. Finally, the proposed temperature-dependent short-circuit model of SiC MOSFET is simulated in PSpice, and the simulation results show the effectiveness of the proposed model, which can work correctly under normal working condition and short-circuit condition. Furthermore, the correctness of the proposed short-circuit model is verified by comparing the simulation results with the experimental results provided in the literature. Therefore, the proposed model in this paper make it possible that designing and analyzing the SiC MOSFET short-circuit characteristics in simulation.","PeriodicalId":302736,"journal":{"name":"2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129600580","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Accuracy Analysis of Calorimetric Loss Measurement for Benchmarking Wide Bandgap Power Transistors under Soft-Switching Operation","authors":"Dominik Koch, Samuel Araujo, I. Kallfass","doi":"10.1109/WiPDAAsia.2019.8760332","DOIUrl":"https://doi.org/10.1109/WiPDAAsia.2019.8760332","url":null,"abstract":"A detailed accuracy analysis of calorimetric measurements for benchmarking wide bandgap power transistors under soft-switching operation is presented. This paper will present a deeper insight into this method and propose enhancements to ensure higher accuracy of the extracted switching energy by evaluating the whole measurement and calculation chain. Furthermore, the confidence level for the switching energy can be derived for each measurement and the most critical errors of the presented measurement chain can be identified. A benchmarking of the soft-switching energies of different SiC and GaN devices is presented, compared to other work and discussed.","PeriodicalId":302736,"journal":{"name":"2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)","volume":"380 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114889862","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Simultaneous Formation of Ni/Ti/Al/Ag Ohmic Contacts to both p- and n-type for 4H-SiC RSD","authors":"Xiaoxue Yan, Lin Liang, Ludan Zhang","doi":"10.1109/WiPDAAsia.2019.8760317","DOIUrl":"https://doi.org/10.1109/WiPDAAsia.2019.8760317","url":null,"abstract":"Semiconductor pulsed power switch SiC RSD (reversely switched dynistor) has difficulty in the preparation of its ohmic contact due to the nature of the material itself and the structure of alternating P+ and N+ regions at the anode. In order to solve the problem, an ohmic contact scheme considering both p-type and n-type semiconductors is proposed in this paper, and the effects of some process conditions on the ohmic contact during the manufacture are discussed, too. The ohmic contact characteristics can be evaluated by the contact resistance ρc which is measured by C-TLM method. Experimental results show that the ohmic contact of both p-type and n-type can be formed when the metal is Ni/Ti/Al/Ag (80/30/80/500 nm). The corresponding annealing condition is RTA at 1050°C in N2 atmosphere for 5 minutes. SiO2 protection before high temperature annealing can reduce ρc, while dry-wet oxidation before metal deposition has little improvement in ohmic contacts. The relationships between RMS and ρc are summarized in the end that neither too smooth nor too rough surface is good for the ohmic contacts.","PeriodicalId":302736,"journal":{"name":"2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121324179","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Single Phase AC-AC Solid State Transformer based on Single Conversion Stage","authors":"A. Rahman, Sheng-Kai Chen, H. Chiu","doi":"10.1109/WiPDAAsia.2019.8760310","DOIUrl":"https://doi.org/10.1109/WiPDAAsia.2019.8760310","url":null,"abstract":"Single phase solid state transformer (SST) has received great attention among researchers and engineers as an effort to replace the standard 50/60Hz low frequency (LF) transformer in certain applications where bulky and heavy low frequency transformer become prohibitive. The main challenge in SST research is how to achieve comparable efficiency (>98%) and high reliability of the traditional LF transformer. Based on that target, a single stage single phase SST was developed with separate high frequency converter link (HF-Link) and low frequency commutation bridge (LF-Bridge). The HF-Link was realized using full bridge SRC converter and the LF-Bridge was realized with two full bridges to perform the bipolar to unipolar folding and the unipolar to bipolar unfolding. In this paper, our experience in developing single phase SST will be presented along with the lesson learned during the development. A converter structure based on separate high frequency converter link and low frequency commutation bridge was studied, tested, and analyzed. From the experimental measurement, the prototype converter was able to provide clean sine wave power to the load with conversion efficiency at 94.65% at the 3kW maximum load.","PeriodicalId":302736,"journal":{"name":"2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125321654","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"WiPDA Asia 2019 Greetings from General Chair","authors":"","doi":"10.1109/wipdaasia.2019.8760320","DOIUrl":"https://doi.org/10.1109/wipdaasia.2019.8760320","url":null,"abstract":"","PeriodicalId":302736,"journal":{"name":"2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114580730","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Current Collapse Suppression in AlGaN/GaN HEMTs Using Silicon Substrate Removal Technique","authors":"Yueh-Ting Chen, Jian-jang Huang","doi":"10.1109/WiPDAAsia.2019.8760325","DOIUrl":"https://doi.org/10.1109/WiPDAAsia.2019.8760325","url":null,"abstract":"The electrical characteristics and current collapse phenomenon of AlGaN/GaN/Si HEMTs after local Si substrate removal are investigated. Our study shows that removal process has no obvious impact on 2DEG density. However, we observe mitigation of current collapse after Si substrate removal, which is in contrast with a severe current degradation when we gradually increase the negative gate bias at pulse condition on the HEMTs with Si substrate. A physical model which involves strain relaxation and GaN buffer/Si interface defect reduction is employed to explain the electrical behavior.","PeriodicalId":302736,"journal":{"name":"2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)","volume":"113 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116393779","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Experimental Verification of DC to Single-phase AC Converter with Power Decoupling Capability using 1.2 kV SiC-MOSFET Module","authors":"Hiroki Watanabe, J. Itoh, A. Iwabuchi","doi":"10.1109/WiPDAAsia.2019.8760328","DOIUrl":"https://doi.org/10.1109/WiPDAAsia.2019.8760328","url":null,"abstract":"This paper presents a DC to Single-phase AC converter with 1.2 kV SiC-MOSFET power module for PV power conditioning systems (PCSs). The authors are aiming to develop a SiC-MOSFET power module with low on-resister in order to improve the conversion efficiency. In addition, the active power decoupling topology with small buffer capacitor has been considered in order to improve the system reliability. the active power decoupling circuit compensates the double-line frequency power ripple by the small firm or ceramic capacitor. However, the high voltage rating devices is required due to the voltage ripple of the buffer capacitor. In this paper, a first proto type SiC-MOSFET power module is tested by the experiment. This module has the high voltage rating as 1.2 kV in order to reduce the buffer capacitor. As the experimental result, it was confirmed that the fundamental operation. In addition, the maximum efficiency of 95.0 % was obtained at the rated output power.","PeriodicalId":302736,"journal":{"name":"2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)","volume":"134 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132262497","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Hwa-Pyeong Park, Mina Kim, Hyun-Jun Choi, Jeehoon Jung, S. Cheon, C. Lee
{"title":"Synchronous Rectification Method for High Frequency CLLC Resonant Cnverter","authors":"Hwa-Pyeong Park, Mina Kim, Hyun-Jun Choi, Jeehoon Jung, S. Cheon, C. Lee","doi":"10.1109/WiPDAAsia.2019.8760308","DOIUrl":"https://doi.org/10.1109/WiPDAAsia.2019.8760308","url":null,"abstract":"CLLC resonant converter employing wide bandgap devices requires a synchronous rectification (SR) to obtain high power conversion efficiency. Conventional SR methods for the CLLC resonant converter have a duty loss to prevent turn-on and-off switching failure in the SR operation. Especially, turn-on duty loss cannot be avoided to prevent the turn-on switching failure during the discontinuous conduction mode (DCM) operation. The proposed SR method uses the transformer voltage reflected on the third winding and the forward voltage drop of the rectifier, which can minimize the duty loss during the turn-on period. In addition, it can operate during the continuous conduction mode (CCM) as well as the DCM. The operational principles are introduced to design and to implement the proposed SR circuit. Simulation and experimental results verify the performance of the proposed SR method a 40 W prototype bidirectional CLLC resonant converter.","PeriodicalId":302736,"journal":{"name":"2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)","volume":"141 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126179263","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Hongjing Zhang, J. Imaoka, M. Noah, Y. Ishikura, Masayoshi Yamamoto
{"title":"Study on the Imbalanced Voltage of Series-connected Active Power Semiconductor Devices in Power Conversion Systems","authors":"Hongjing Zhang, J. Imaoka, M. Noah, Y. Ishikura, Masayoshi Yamamoto","doi":"10.1109/WiPDAAsia.2019.8760316","DOIUrl":"https://doi.org/10.1109/WiPDAAsia.2019.8760316","url":null,"abstract":"MOSFETs have been utilized in many applications for several electronic devices as switching power devices. However, the limited drain-source breakdown voltage makes it difficult to use one single MOSFET in high voltage power conversion systems. One of the attractive solutions to solve this issue is to connect MOSFETs in series, therefore, the applied voltage can be shared among the power devices to achieve higher efficiency and lower cost. Nonetheless, this circuit topology suffers from imbalance drain-source voltage (VDS) sharing among the series connected MOSFETs. The purpose of this paper is to investigate the imbalance voltage distribution caused by varied characteristics components between 3 kinds of most commonly used MOSFETs-Si, SiC and GaN.","PeriodicalId":302736,"journal":{"name":"2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126768061","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"GaN Based DC-DC Converter for 48 V Automotive Applications","authors":"E. Jones, M. D. de Rooij, S. Biswas","doi":"10.1109/WiPDAAsia.2019.8760327","DOIUrl":"https://doi.org/10.1109/WiPDAAsia.2019.8760327","url":null,"abstract":"Enhancement-mode GaN transistors (eGaN®) are a key enabling technology for high-performance bi-directional power conversion, a component of the emerging 48 V / 12 V bus architecture in mild-hybrid electric vehicles. With GaN, a conventional half-bridge topology can be scaled to multiple phases and achieve high power density at efficiencies exceeding 97%. Design considerations include switching frequency, inductor selection, control, sensing, and thermal design. This paper will discuss a five-phase fully regulated bi-directional 48 V to 12 V DC-DC converter built using GaN FETs. A hardware prototype was constructed and experimentally verified to achieve a peak efficiency greater than 97%, and a full power efficiency greater than 96% at 3 kW. A high-performance scaleable thermal design was implemented that maintained a FET temperature rise of less than 10 °C above the heatsink. Plans for a new prototype will also be discussed, with higher density power modules and interchangeable inductor boards for further optimization.","PeriodicalId":302736,"journal":{"name":"2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114607643","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}