A Temperature-dependent PSpice Short-circuit Model of SiC MOSFET

Xingran Zhao, Hong Li, Yuting Wang, Zhe Zhou, K. Sun, Zhengming Zhao
{"title":"A Temperature-dependent PSpice Short-circuit Model of SiC MOSFET","authors":"Xingran Zhao, Hong Li, Yuting Wang, Zhe Zhou, K. Sun, Zhengming Zhao","doi":"10.1109/WiPDAAsia.2019.8760311","DOIUrl":null,"url":null,"abstract":"A temperature-dependent PSpice short-circuit model of silicon carbide metal-oxide semiconductor field effect transistor (SiC MOSFET) is proposed in this paper, which can be used to study the short-circuit characteristic of SiC MOSFET by simulation. Based on the non-segmented model, the normal working model of SiC MOSFET is established first. The correctness of the normal working model is verified by comparing the simulation results with the characteristic curves in the SiC MOSFET’s datasheet. Then the thermal network model of case-to-junction is introduced to describe the changes of junction temperature during short-circuit condition, and the short-circuit current of SiC MOSFET is further fitted based on the junction temperature. Finally, the proposed temperature-dependent short-circuit model of SiC MOSFET is simulated in PSpice, and the simulation results show the effectiveness of the proposed model, which can work correctly under normal working condition and short-circuit condition. Furthermore, the correctness of the proposed short-circuit model is verified by comparing the simulation results with the experimental results provided in the literature. Therefore, the proposed model in this paper make it possible that designing and analyzing the SiC MOSFET short-circuit characteristics in simulation.","PeriodicalId":302736,"journal":{"name":"2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WiPDAAsia.2019.8760311","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

A temperature-dependent PSpice short-circuit model of silicon carbide metal-oxide semiconductor field effect transistor (SiC MOSFET) is proposed in this paper, which can be used to study the short-circuit characteristic of SiC MOSFET by simulation. Based on the non-segmented model, the normal working model of SiC MOSFET is established first. The correctness of the normal working model is verified by comparing the simulation results with the characteristic curves in the SiC MOSFET’s datasheet. Then the thermal network model of case-to-junction is introduced to describe the changes of junction temperature during short-circuit condition, and the short-circuit current of SiC MOSFET is further fitted based on the junction temperature. Finally, the proposed temperature-dependent short-circuit model of SiC MOSFET is simulated in PSpice, and the simulation results show the effectiveness of the proposed model, which can work correctly under normal working condition and short-circuit condition. Furthermore, the correctness of the proposed short-circuit model is verified by comparing the simulation results with the experimental results provided in the literature. Therefore, the proposed model in this paper make it possible that designing and analyzing the SiC MOSFET short-circuit characteristics in simulation.
SiC MOSFET的温度相关PSpice短路模型
本文提出了碳化硅金属氧化物半导体场效应晶体管(SiC MOSFET)的温度相关PSpice短路模型,该模型可用于模拟研究SiC MOSFET的短路特性。在非分段模型的基础上,首先建立了SiC MOSFET的正常工作模型。通过将仿真结果与SiC MOSFET数据表中的特性曲线进行比较,验证了正常工作模型的正确性。然后引入壳到结的热网络模型来描述短路状态下结温的变化,并根据结温进一步拟合出SiC MOSFET的短路电流。最后,在PSpice中对所提出的SiC MOSFET温度相关短路模型进行了仿真,仿真结果表明了所提出模型的有效性,在正常工况和短路工况下均能正常工作。此外,通过将仿真结果与文献中提供的实验结果进行比较,验证了所提短路模型的正确性。因此,本文提出的模型为在仿真中设计和分析SiC MOSFET的短路特性提供了可能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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