{"title":"The mechanical reliability design of thin-film encapsulation for laminated-based flexible organic light emitting diodes using semi-analytical method","authors":"Sixin Huang, Haohui Long, Jianhui Li, Jianping Fang, Jiaying Gao","doi":"10.1109/IFETC53656.2022.9948535","DOIUrl":"https://doi.org/10.1109/IFETC53656.2022.9948535","url":null,"abstract":"The multi-layered flexible organic light emitting diodes (FOLEDs) are composed of a flexible substrate, organic/inorganic layers, and thin-film encapsulations (TFE), where the multi-barriers are useful to eliminate vapor and oxygen permeation and guarantee the long-term reliability of electronic devices. However, there will be defects (e.g., particle, pinhole, and delamination) in the manufacturing process, and the longitudinal tensile stress in the inner materials will result in cracks and crack propagations when the flexible electronic devices subject to transverse loads and bending moments. Therefore, it is worthy to evaluate the influence of internal stresses and different defects on reliability designs of FOLEDs. In this paper, the semi-analytical models are established to evaluate the mechanical behavior of the laminated-based FOLED devices. In material failure model, the displacement values of each layer combined with global interpolation functions are used to describe displacement filed of the entire structure, and the constitutive model of the FOLEDs is the superposition of each lamina’s constitutive equation. The governing equations of FOLEDs are derived through the principle of virtual displacements, and then the stress and strain distributions of FOLEDs along the thickness direction are obtained from displacement fields. This paper further investigates the fracture toughness and interfacial reliability of FOLEDs model with different defects using the strain energy release rate (SERR). The results are validated against those of the finite element analysis. Moreover, the computational efficiency and capability of development method are illustrated by comparing computing time of the finite element analysis. With fast semi-analytical method, the failure and fracture behaviors of thin-film encapsulation for laminated-based FOLEDs are estimated and discussed.","PeriodicalId":289035,"journal":{"name":"2022 IEEE International Flexible Electronics Technology Conference (IFETC)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124060164","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
G. Cantarella, Federica Catania, N. Münzenrieder, L. Petti
{"title":"Flexible, Scalable and Buckled Electronics based on Oxide Thin-Film Transistors","authors":"G. Cantarella, Federica Catania, N. Münzenrieder, L. Petti","doi":"10.1109/IFETC53656.2022.9948509","DOIUrl":"https://doi.org/10.1109/IFETC53656.2022.9948509","url":null,"abstract":"The field of flexible electronics has rapidly expanded over the last decades, providing a new class of electronic devices and systems with unique features, such as lightweight, mechanical flexibility, and biocompatibility. To evaluate the scalability of our thin-film technology for systems realization, as well as for the development of highly flexible devices, two parallel strategies are explored. First, the stability of oxide thin-film transistors (TFTs) is investigated under different environmental conditions (temperature and humidity variation). Afterwards, InGaZnO-based TFTs are integrated with Perovskite Light Emitting Diodes (PeLEDs), to evaluate the technological scalability for flexible active display. Secondly, the employment of stretchable Polydimethylsiloxane (PDMS), acting as a stretchable substrate, in combination with the induction of customized wrinkles in the electronics stack, is used to allow the realization of bendable and stretchable TFTs and circuits.","PeriodicalId":289035,"journal":{"name":"2022 IEEE International Flexible Electronics Technology Conference (IFETC)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122965180","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A distributed flexible optical fiber F-P battery temperature detection system based on thermo-optic effect","authors":"Xiao-kou Li, J. Tao, Yan Li","doi":"10.1109/IFETC53656.2022.9948492","DOIUrl":"https://doi.org/10.1109/IFETC53656.2022.9948492","url":null,"abstract":"Based on the thermo optic effect, a flexible optical fiber temperature sensor is developed, which is adhered to PDMS to provide accurate and fast measurement by measuring the response of F-P resonator to 1550nm DFB laser. The response range is 70 °C -90 °C, and the accuracy is 0.015nm/°C. The sensor not only has the advantages of high sensitivity, intrinsic safety, corrosion resistance, high temperature resistance and low cost, but also supports multi-point detection and is suitable for battery temperature detection.","PeriodicalId":289035,"journal":{"name":"2022 IEEE International Flexible Electronics Technology Conference (IFETC)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131768567","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A deformable fingertip sensor assists the manipulator in distinguishing the hardness of the object","authors":"Nengmin Liang, Chao Shang, Qunhui Xu, Yinghong Li, Zhengchun Peng","doi":"10.1109/IFETC53656.2022.9948519","DOIUrl":"https://doi.org/10.1109/IFETC53656.2022.9948519","url":null,"abstract":"In this work, we propose and fabricate a deformable and arrayed fingertip sensor to assist the manipulator in sensing the hardness of objects. The sensor consists of a semi-cylindrical Ecoflex and an array of electronic skin, which is attached to a robotic gripper for griping objects of different hardness. The electrical signals generated by the fingertip sensor vary depending on the hardness of the gripped object. After analyzing the signals, with a fixed gripping force, we found that the harder the object, the greater the average intensity of the signals collected by the sensor. This is consistent with the regularity shown by the finite element analysis method. The data collected by the sensors were used to train the deep neural network and classify ten different hardness objects, and the results showed that the recognition accuracy was as high as 91.6%.","PeriodicalId":289035,"journal":{"name":"2022 IEEE International Flexible Electronics Technology Conference (IFETC)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133485956","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Implementation of Binary Neural Network with Low Temperature Polycrystalline Silicon TFT SRAM Array","authors":"Mengqian Zou, Jun Li, Xiaojun Guo","doi":"10.1109/IFETC53656.2022.9948493","DOIUrl":"https://doi.org/10.1109/IFETC53656.2022.9948493","url":null,"abstract":"Integration of signal pre-processing functions with the thin-film transistor (TFT) sensor array on the same substrate would be able to reduce the required hardware resource and power consumption for the data movement and subsequent processing. In this work, a 64×64 static random-access memory (SRAM) array is designed based on the low temperature polycrystalline silicon (LTPS) TFT for implementation of binary neural network (BNN), which is then used for recognition task with the MNIST dataset. The simulation results prove that a combination of the binary-operated SRAM and the noise-tolerant BNN would be able to alleviate the influence of device performance fluctuation to pattern recognition accuracy.","PeriodicalId":289035,"journal":{"name":"2022 IEEE International Flexible Electronics Technology Conference (IFETC)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115703605","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Mitigating the Impact of Thermoplastic Polyurethane Films on the Performance of Electronic Textiles","authors":"Tiancheng Xu, I. Goldthorpe","doi":"10.1109/IFETC53656.2022.9948436","DOIUrl":"https://doi.org/10.1109/IFETC53656.2022.9948436","url":null,"abstract":"When printing electronics onto textiles, a thermoplastic polyurethane (TPU) layer is typically used, which unfortunately interferes with many desirable properties of textiles. To minimize this impact of the TPU, the effect of different TPU types and lamination conditions on the electronic textile properties are investigated. It is found that for optimal conductivity, the TPU film thickness should be ~ 100 µm, but thicker films should be avoided as they increase stiffness and worsen breathability. Less dense (less crystalline) TPU is found to be preferable. There is trade-off with some lamination parameters, with higher temperatures and longer times increasing stiffness but improving printed ink conductivity; however, a lower lamination pressure is preferable in either case.","PeriodicalId":289035,"journal":{"name":"2022 IEEE International Flexible Electronics Technology Conference (IFETC)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116418740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Active-Matrix Digital Microfluidics Chip for Efficient Droplets Manipulation","authors":"D. Wang, Q. Huang, L. Xu, S. Hu, H. Ma","doi":"10.1109/IFETC53656.2022.9948481","DOIUrl":"https://doi.org/10.1109/IFETC53656.2022.9948481","url":null,"abstract":"The emerging microfluidic tools bring new methods for miniaturized analytical systems and droplets manipulation. This study presents an active-matrix digital microfluidic platform for efficient droplets generation and manipulation. The microfluidic chip was fabricated by amorphous silicon (a-Si) thin-film transistor (TFT) technology. The active device contains 4096 electrodes that can be independently addressed to perform multiple and simultaneous droplets manipulation, which demonstrates extension of the ubiquitous TFT technology from displays to bio-applications, and leverage the well-established a-Si TFT manufacturing facilities and excess capacity. This work paves new ways for conducting low-cost and high-throughput applications in single cells manipulation.","PeriodicalId":289035,"journal":{"name":"2022 IEEE International Flexible Electronics Technology Conference (IFETC)","volume":"508 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116555994","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
M. Ciocca, C. Febo, F. Massoumi, A. Altana, G. Cantarella, P. Lugli, L. Petti
{"title":"3D bio-printed light-sensitive cell scaffolds based on polymer nanoparticles for bio-photonics applications","authors":"M. Ciocca, C. Febo, F. Massoumi, A. Altana, G. Cantarella, P. Lugli, L. Petti","doi":"10.1109/IFETC53656.2022.9948487","DOIUrl":"https://doi.org/10.1109/IFETC53656.2022.9948487","url":null,"abstract":"Biotechnology has been rapidly growing in recent years with unprecedent achievements in regenerative medicine and tissue engineering. 3D bio-printing is one of the latest technologies used to develop complex structures mimicking organs and tissues, as well as functional 3D cell scaffolds. Engineered cell scaffolds supplemented with organic materials can be used as bio‐electronic interfaces and biomedical sensing. In this work, a novel 3D bioprinted cell scaffold enhanced with light-responsive organic semiconducting polymer nanoparticles is presented. The lightsensitive cell scaffold can be used for light control and modulation of cellular activities with several applications in neural engineering and regenerative medicine.","PeriodicalId":289035,"journal":{"name":"2022 IEEE International Flexible Electronics Technology Conference (IFETC)","volume":"143 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123246528","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Liquid Metal for Soft-Hard Interface in Stretchable Electronics","authors":"Ru Su, Qingsong Li, Qiong Tian, Zhiyuan Liu","doi":"10.1109/IFETC53656.2022.9948501","DOIUrl":"https://doi.org/10.1109/IFETC53656.2022.9948501","url":null,"abstract":"The complete stretchable electrode device includes stretchable electrode material and rigid data processing module. However, due to the mismatched modulus of the two parts, the stability of the soft-hard interface is unsatisfying, which in turn limits the signal transmission quality. Here, we introduce liquid metal into the circuit and use the fluidity of liquid metal as a contact material for the soft and hard interface. The interface shows good stability under both direct current (DC) and alternating current (AC) during stretching, which provides a reference for the soft and hard interface of flexible materials.","PeriodicalId":289035,"journal":{"name":"2022 IEEE International Flexible Electronics Technology Conference (IFETC)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126128319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Hui Qiu, Huajing Qin, Jiahao Liu, Liang Zhou, L. Chang, Jun Zhou
{"title":"Embedded Low Power Heart Rate Estimation Processor for Flexible Applications","authors":"Hui Qiu, Huajing Qin, Jiahao Liu, Liang Zhou, L. Chang, Jun Zhou","doi":"10.1109/IFETC53656.2022.9948467","DOIUrl":"https://doi.org/10.1109/IFETC53656.2022.9948467","url":null,"abstract":"In this work, a photoplethysmography (PPG)-based heart rate (HR) estimation processor is designed and implemented for embedded signal processing of flexible heart rate monitoring devices. Compared with the exiting embedded signal processing solutions using Microcontrollers, this customized hardware solution is able to achieve much lower power consumption for long-term wearable health monitoring. Evaluated using the SPC dataset of 12 and 22 PPG recordings, the proposed design achieves a low mean absolute error (MAE) of 1.12 BPM and 2.14 BPM respectively. It consumes only 34.7 μW with a low processing latency of 6.2 ms, which is suitable for long-term wearable health monitoring.","PeriodicalId":289035,"journal":{"name":"2022 IEEE International Flexible Electronics Technology Conference (IFETC)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126369948","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}