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Impact of Ingress Noise on the Communication on Hybrid Fiber-Coax (HFC) Networks 入口噪声对混合光纤-同轴(HFC)网络通信的影响
54th ARFTG Conference Digest Pub Date : 2000-12-01 DOI: 10.1109/ARFTG.1999.327379
Elke Claus, K. Haelvoet, L. Martens
{"title":"Impact of Ingress Noise on the Communication on Hybrid Fiber-Coax (HFC) Networks","authors":"Elke Claus, K. Haelvoet, L. Martens","doi":"10.1109/ARFTG.1999.327379","DOIUrl":"https://doi.org/10.1109/ARFTG.1999.327379","url":null,"abstract":"Hybrid fiber coax networks are excellent candidates for interactive multimedia services such as internet. However, due to their tree and branch structure, HFC networks are very susceptible to noise funneling. In this paper we present a measurement method and statistical post-processing for the upstream ingress noise that is independent of the modulation and access technique. The impact of ingress noise is evaluated for a TDMA/FDMA and CDMA access technique to illustrate this. The measurement and process software we used was completely developed in Labview¿.","PeriodicalId":284470,"journal":{"name":"54th ARFTG Conference Digest","volume":"91 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123834534","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Development of Vertical Interconnects for Mixed Substrate Technology 混合衬底垂直互连技术的发展
54th ARFTG Conference Digest Pub Date : 2000-12-01 DOI: 10.1109/ARFTG.1999.327373
A. Pham, A. Sutono, J. Laskar, V. Krishnamurthy, D. Lester, E. Balch, J. Rose
{"title":"Development of Vertical Interconnects for Mixed Substrate Technology","authors":"A. Pham, A. Sutono, J. Laskar, V. Krishnamurthy, D. Lester, E. Balch, J. Rose","doi":"10.1109/ARFTG.1999.327373","DOIUrl":"https://doi.org/10.1109/ARFTG.1999.327373","url":null,"abstract":"We present the design and development of a vertical interconnect for both multi-chip modules and print circuit board technologies at microwave frequencies. This vertical feed-through provides the electrical interconnects from the first to the second level packaging to allow the use of multiple board technologies for a system. The experimental results demonstrate that the vertical interconnect has ultra-low parasitic and achieves a return loss of greater than 20-dB at 4-GHz.","PeriodicalId":284470,"journal":{"name":"54th ARFTG Conference Digest","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130660352","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Measurement and Analysis of the Channel Characteristics of an In-Building Wireless Network 楼宇内无线网络信道特性的测量与分析
54th ARFTG Conference Digest Pub Date : 2000-12-01 DOI: 10.1109/ARFTG.1999.327382
Jung-Hyuck Jo, N. Jayant
{"title":"Measurement and Analysis of the Channel Characteristics of an In-Building Wireless Network","authors":"Jung-Hyuck Jo, N. Jayant","doi":"10.1109/ARFTG.1999.327382","DOIUrl":"https://doi.org/10.1109/ARFTG.1999.327382","url":null,"abstract":"In this paper, we report the results of a study characterizing the channel error environment provided by Lucent WaveLAN, a commercial product designed for 2Mbps inbuilding wireless networks. We evaluate the effects of signal strength attenuation due to distance and obstacles, on packet loss rate, burstiness of packet loss, and packet round trip time (RTT). The results show that the packet loss rate and burstiness of packet of this physical layer are comparable to those of wired links if we maintain good signal-to-noise ratio (SNR) (say, above 20dB). The packet RTT variations, however, show different values on the wireless network than those of wired network, which result from additional time taken by the retransmission based error control process in the physical layer. From the results of packet RTT variation, it is seen that the packet delay jitters should be taken into consideration in designing real time or interactive applications on the wireless network.","PeriodicalId":284470,"journal":{"name":"54th ARFTG Conference Digest","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122503027","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Analysis and Design of RF Circuits Including Non-linear Elements using the Multiresolution Time Domain Technique (MRTD) 基于多分辨率时域技术(MRTD)的非线性射频电路分析与设计
54th ARFTG Conference Digest Pub Date : 2000-12-01 DOI: 10.1109/ARFTG.1999.327383
M. Tentzeris
{"title":"Analysis and Design of RF Circuits Including Non-linear Elements using the Multiresolution Time Domain Technique (MRTD)","authors":"M. Tentzeris","doi":"10.1109/ARFTG.1999.327383","DOIUrl":"https://doi.org/10.1109/ARFTG.1999.327383","url":null,"abstract":"The Multiresolution Time-Domain Technique is applied to the analysis and design of RF circuits. The use of wavelets enables the implementation of a space- and time-adaptive gridding technique. Simulated results indicate considerable savings in memory and computational time in comparison to the conventional time-domain techniques.","PeriodicalId":284470,"journal":{"name":"54th ARFTG Conference Digest","volume":"124 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131994364","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
PC Board Characterization Using Accurate Hybrid Probing Techniques 使用精确的混合探测技术表征PC板
54th ARFTG Conference Digest Pub Date : 2000-12-01 DOI: 10.1109/ARFTG.1999.327372
S. Gross, L. Dunleavy, T. Weller, B. Schmitz, T. Winslow
{"title":"PC Board Characterization Using Accurate Hybrid Probing Techniques","authors":"S. Gross, L. Dunleavy, T. Weller, B. Schmitz, T. Winslow","doi":"10.1109/ARFTG.1999.327372","DOIUrl":"https://doi.org/10.1109/ARFTG.1999.327372","url":null,"abstract":"A systematic measurement and modeling strategy is described for complete characterization of a printed circuit board comprising a power amplifier circuit. Hybrid wafer probing is used in conjunction with TRL ¿on-board¿ calibration to derive precise characterization data for grounded coplanar waveguide lines as well as lumped surface mount components. Excellent agreement is shown between measurement based lumped component models, and transmission line structures as well as composite matching networks.","PeriodicalId":284470,"journal":{"name":"54th ARFTG Conference Digest","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117074458","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Sources of Error in Coplanar-Waveguide TRL Calibrations 共面波导TRL校准中的误差来源
54th ARFTG Conference Digest Pub Date : 2000-12-01 DOI: 10.1109/ARFTG.1999.327367
R. F. Kaiser, Dylan F. Williams
{"title":"Sources of Error in Coplanar-Waveguide TRL Calibrations","authors":"R. F. Kaiser, Dylan F. Williams","doi":"10.1109/ARFTG.1999.327367","DOIUrl":"https://doi.org/10.1109/ARFTG.1999.327367","url":null,"abstract":"This paper explores the impact of five sources of systematic error in coplanar-waveguide thru-reflect-line calibrations. We develop expressions that predict systematic measurement error and test them experimentally by deliberately introducing error into real measurement data.","PeriodicalId":284470,"journal":{"name":"54th ARFTG Conference Digest","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121391437","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
The effect of load variations on on-wafer lumped element based calibrations 负载变化对晶圆上集总元件校准的影响
54th ARFTG Conference Digest Pub Date : 2000-12-01 DOI: 10.1109/ARFTG.1999.327368
P. Kirby, L. Dunleavy, T. Weller
{"title":"The effect of load variations on on-wafer lumped element based calibrations","authors":"P. Kirby, L. Dunleavy, T. Weller","doi":"10.1109/ARFTG.1999.327368","DOIUrl":"https://doi.org/10.1109/ARFTG.1999.327368","url":null,"abstract":"We present a study of DC and RF measured variations in the resistance of loads that are to be used for on-wafer calibrations on GaAs substrates. The impact on measurement-based calibration definitions, and the calibration errors arising from neglecting the variations will be explored. Promising solutions for accommodating the variations into accurate on-wafer calibration strategies are advanced based on the use of the dc resistance of the load standard to aid in the calibration standard definition process.","PeriodicalId":284470,"journal":{"name":"54th ARFTG Conference Digest","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114853094","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
A Novel De-embedding Technique for Millimeter-wave Package Characterization 毫米波封装表征中一种新的去嵌入技术
54th ARFTG Conference Digest Pub Date : 2000-12-01 DOI: 10.1109/ARFTG.1999.327374
H. Liang, J. Laskar, M. Hyslop, R. Panicker
{"title":"A Novel De-embedding Technique for Millimeter-wave Package Characterization","authors":"H. Liang, J. Laskar, M. Hyslop, R. Panicker","doi":"10.1109/ARFTG.1999.327374","DOIUrl":"https://doi.org/10.1109/ARFTG.1999.327374","url":null,"abstract":"This paper describes a novel de-embedding technique for millimeter-wave BGA package characterization using accurate 2-port measurement. By calculating the S-matrix of the discontinuity between the probes and the DUT, the procedure can overcome the difficulties of designing a broadband reflection standard in TRL calibration due to the large distance between probing pad and the interface with the DUT. The method presented is self-consistent and can be easily applied to S-parameter calculation and de-embedding of general discontinuities.","PeriodicalId":284470,"journal":{"name":"54th ARFTG Conference Digest","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133787332","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Extraction of S-Parameters from TDR/TDT Measurements using Rational Functions 利用有理函数提取TDR/TDT测量中的s参数
54th ARFTG Conference Digest Pub Date : 2000-12-01 DOI: 10.1109/ARFTG.1999.327362
S. Pannala, M. Swaminathan
{"title":"Extraction of S-Parameters from TDR/TDT Measurements using Rational Functions","authors":"S. Pannala, M. Swaminathan","doi":"10.1109/ARFTG.1999.327362","DOIUrl":"https://doi.org/10.1109/ARFTG.1999.327362","url":null,"abstract":"This paper discusses the extraction of broad band S-parameter response from transient reflection and transmission measurements. The method discussed uses the Generalized Pencil-of-Function method, recursive deconvolution and time referencing to develop models using rational functions. A low loss printed circuit board plane and a lossy thin film plane have been characterized using this method to extract the two-port S-parameters. These models are SPICE compatible and can be used to simulate the frequency or transient response. The results have been compared with network analyzer measurements to show the accuracy.","PeriodicalId":284470,"journal":{"name":"54th ARFTG Conference Digest","volume":"81 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126998801","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Integral measurement system design using HP's Advanced Design System 利用惠普先进设计系统设计整体测量系统
54th ARFTG Conference Digest Pub Date : 2000-12-01 DOI: 10.1109/ARFTG.1999.327378
P. Valk, J. Tauritz
{"title":"Integral measurement system design using HP's Advanced Design System","authors":"P. Valk, J. Tauritz","doi":"10.1109/ARFTG.1999.327378","DOIUrl":"https://doi.org/10.1109/ARFTG.1999.327378","url":null,"abstract":"The specification, realization and test of digital communication system components, presupposes an intimate knowledge of the impact of system demands on component requirements. This non-trivial task can be significantly simplified when simulation and measurement can be combined in a unified software package. An implementation strategy has been developed for introducing microwave instruments as models into Hewlett-Packard EEsof¿s Advanced Design System. One can configure a measurement system by dragging and dropping components on a design template. Using this implementation, measurements can be driven directly from ADS. In this paper we discuss the flexibility of this implementation with respect to Load-Pull measurements using a Maury Automatic Tuner System. This approach ensures flexibility in design and implementation of measurement systems and easy verification of simulations with measurements.","PeriodicalId":284470,"journal":{"name":"54th ARFTG Conference Digest","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127820691","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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