Development of Vertical Interconnects for Mixed Substrate Technology

Abstract

We present the design and development of a vertical interconnect for both multi-chip modules and print circuit board technologies at microwave frequencies. This vertical feed-through provides the electrical interconnects from the first to the second level packaging to allow the use of multiple board technologies for a system. The experimental results demonstrate that the vertical interconnect has ultra-low parasitic and achieves a return loss of greater than 20-dB at 4-GHz.