Thanasis Chatziathanasiou , Christian Breite , Martin Diehl , Mahoor Mehdikhani , Yentl Swolfs
{"title":"In situ transverse single-fibre and bundle tests in synchrotron nano-tomography to unravel interfacial debonding in carbon and glass fibre-epoxy composites","authors":"Thanasis Chatziathanasiou , Christian Breite , Martin Diehl , Mahoor Mehdikhani , Yentl Swolfs","doi":"10.1016/j.compositesa.2025.109024","DOIUrl":"10.1016/j.compositesa.2025.109024","url":null,"abstract":"<div><div>Interfacial normal (mode I) properties are crucial for understanding and predicting the transverse failure behaviour of fibre-reinforced composites. The experimental methods to extract them, such as the Broutman and the transverse single-fibre tests, are typically coupled with 2D monitoring techniques to characterise the involved damage mechanisms. Inevitably, these techniques struggle to visualise the debond growth <em>in situ</em> and in 3D, which results in questionable values and the need for significant assumptions in models. This paper reports a state-of-the-art methodology integrating transverse single-fibre testing with synchrotron holo-tomography. This nano-imaging technique enables the <em>in situ</em> detection and monitoring of the 3D debond profile and its interaction with other damage mechanisms, such as matrix cracking. <em>In situ</em> tests were conducted for carbon and glass single-fibre epoxy specimens and a specimen with a transversely embedded carbon fibre bundle. By combining these different tests, novel insights were obtained into the influence of fibre type and packing on mode I interfacial damage initiation and propagation. Despite observing the same three damage phases — debond initiation, slow propagation, and tunnelling — in all specimens, our findings suggest that debond initiation occurs at lower stress levels in closely packed fibres while tunnelling is independent of fibre packing. The damage phases are quantitatively expressed via a series of parameters, offering direct input for numerical modelling of the transverse tensile failure of composites.</div></div>","PeriodicalId":282,"journal":{"name":"Composites Part A: Applied Science and Manufacturing","volume":"197 ","pages":"Article 109024"},"PeriodicalIF":8.1,"publicationDate":"2025-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144134383","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Michelle Rautmann, Edwin Rosario Gabriel, Byung Chul Kim
{"title":"Advanced continuous tow shearing process utilising in-line tow width control in fibre steering","authors":"Michelle Rautmann, Edwin Rosario Gabriel, Byung Chul Kim","doi":"10.1016/j.compositesa.2025.109025","DOIUrl":"10.1016/j.compositesa.2025.109025","url":null,"abstract":"<div><div>Although automated fibre placement (AFP) is one of the most advanced composite manufacturing technologies in the aerospace industry, it has critical limitations in fibre steering due to its principle of utilising the in-plane bending deformation of the tow. The Continuous Tow Shearing (CTS) process has effectively addressed fibre-steering defects by utilising the in-plane shear deformation of the tow. However, particularly when producing layups over a tool with complex geometry, both the AFP and CTS processes can generate geometry-induced defects, as the tool surface cannot be perfectly tessellated using finite-width tapes. These defects may significantly reduce the structural performance of the composite.</div><div>To eliminate both steering- and geometry-induced defects, a novel Tow Width Control (TWiC) mechanism was developed in this work. This mechanism allows for on-the-fly control of the tow’s cross-sectional aspect ratio without cutting fibres while maintaining a constant fibre volume fraction. The TWiC device was integrated into the Continuous Tow Shearing (CTS) process and its feasibility was experimentally investigated. To assess the steering quality and accuracy of this Advanced CTS (ACTS) process, the same fibre paths were laid using AFP and CTS processes and compared through optical and laser scanning methods. It was shown that the ACTS layup produces significantly less layup defects compared to AFP and CTS.</div></div>","PeriodicalId":282,"journal":{"name":"Composites Part A: Applied Science and Manufacturing","volume":"196 ","pages":"Article 109025"},"PeriodicalIF":8.1,"publicationDate":"2025-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143943312","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A model to describe transient transverse deformation during prepreg consolidation","authors":"Pavel Simacek , Shu Minakuchi , Suresh G. Advani","doi":"10.1016/j.compositesa.2025.109021","DOIUrl":"10.1016/j.compositesa.2025.109021","url":null,"abstract":"<div><div>In automated tape placement or other prepreg layup methods, one of the manufacturing flaws manifests when the gap between adjacent tapes or prepreg sheets cause concave deformation on top of the gap during the consolidation step. Our previous model addressed the development of the gap as applied to tape placement process and predicted final deformation state was compared with experimental measurements after tape consolidation was complete. The transient deformation behavior could not be verified as it was not possible to measure at that time. Since then, a unique fiber optic shape sensor was developed that measures the in-situ deformation of a cross-ply thermosetting composite laminate containing gaps of various widths in the middle layer during the entire consolidation process. The related experimental work showed that our previous model assumption of elastic behavior of prepreg plies bridging the gap are invalid. To address this shortcoming, elastic stress relaxation was introduced into the model. To address wider gaps, it also proved necessary to add the contact between the bridging layers and substrate under the gap. In addition, transient viscosity model was also implemented as the necessary data for its characterization was also available.</div><div>The extended model parameters were found by successfully fitting the transient deformation to one experimental result. The transient results were then compared to the fiber optic in-situ sensor data obtained in additional cases. The comparison of model predictions with experimental data proved favorable.</div></div>","PeriodicalId":282,"journal":{"name":"Composites Part A: Applied Science and Manufacturing","volume":"197 ","pages":"Article 109021"},"PeriodicalIF":8.1,"publicationDate":"2025-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143948295","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Influence of the Ni transition layer on the SiCp/Fe-Cu sandwich structure: Promoting interfacial bonding and synergistically enhancing strength and ductility","authors":"Wen-quan Li , Zheng-yu Zhong , Ying Guo , Shuo Yin , Chao Zhang","doi":"10.1016/j.compositesa.2025.109020","DOIUrl":"10.1016/j.compositesa.2025.109020","url":null,"abstract":"<div><div>To obtain the material with excellent comprehensive properties, SiCp-reinforced iron-copper (SiCp/Fe-Cu) sandwich-structured composites were fabricated by spark plasma sintering. A Ni transition layer was added into the sandwich structure to enhance interfacial bonding. The results indicated that the Ni transition layer formed an amorphous interfacial product with Fe layer, resulting in tighter interfacial bonding. The introduced Cu layer significantly improved material’s thermal conductivity, with the sintered SiCp/Fe-Cu sandwich structure achieving 211.20% of the thermal conductivity of SiCp/Fe, and the SiCp/Fe-Ni-Cu sandwich structure reaching 232.32% of SiCp/Fe. The Ni transition layer brought the SiCp/Fe-Ni-Cu structure exceptional ductility, surpassing the SiCp/Fe-Cu structure by 180%. In both sandwich structures, phenomena of non-coordinated plastic deformation were observed; while the Cu layer exhibited through-cracks, the SiCp/Fe layer experienced local cracking. Each layer in the sandwich structures displayed different failure mechanisms: the Cu layer underwent shear fracture, while the SiCp/Fe layer experienced tensile fracture.</div></div>","PeriodicalId":282,"journal":{"name":"Composites Part A: Applied Science and Manufacturing","volume":"196 ","pages":"Article 109020"},"PeriodicalIF":8.1,"publicationDate":"2025-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143931922","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Xiwen Yang , Hang Luo , Sheng Chen , Jiajun Peng , Guanghu He , Ru Guo , Dou Zhang
{"title":"Boosted high-temperature capacitive energy storage in D-A-D type semiconductor/polymer composite via constructing physical cross-linking and electronic trapping","authors":"Xiwen Yang , Hang Luo , Sheng Chen , Jiajun Peng , Guanghu He , Ru Guo , Dou Zhang","doi":"10.1016/j.compositesa.2025.109019","DOIUrl":"10.1016/j.compositesa.2025.109019","url":null,"abstract":"<div><div>Nowadays, with the development of hybrid electric vehicles, aerospace, underground oil and gas exploration, and other fields, the demand for high-temperature dielectric energy storage equipment has rapidly increased. Although engineering aromatic polymers with high glass transition temperatures (<em>T</em><sub>g</sub>) have been developed, it is extremely urgent to solve the problem of the sharp decline in energy storage performance caused by the exponentially increased leakage current under high temperatures and electric fields. This work incorporates a semiconductor molecule with donor–acceptor-donor configuration (DPP-S) into the PEI matrix to achieve significantly enhanced high-temperature capacitive performance. The dense physical cross-linking networks are formed by the electrostatic interaction between the positively charged phenyl group in PEI and the electron-donating thiophene group in DPP-S, as well as the hydrogen bonding interaction between the amide group in DPP-S and the −C=O group in the PEI chain. This molecular interface effect improves mechanical strength to boost the breakdown strength and introduces trap sites capturing charge carriers to suppress leakage current. Consequently, excellent energy storage performance is achieved in PEI-DPP-S-0.2 wt%, e.g., discharge energy density of 4.87 J cm<sup>−3</sup> at 150 °C and 3.45 J cm<sup>−3</sup> at 200 °C with high discharge efficiency of 90 %, surpassing lots of high-temperature energy storage polymers. Finally, PEI-DPP-S-0.2 wt% exhibits stable performances during ultralong 10<sup>5</sup> charge–discharge cycles in harsh environments (200 MV m<sup>−1</sup> and 200 °C) and prospects for large-scale preparation. This work further deepens the insight of high-temperature dielectric energy storage enhanced by molecular interface engineering.</div></div>","PeriodicalId":282,"journal":{"name":"Composites Part A: Applied Science and Manufacturing","volume":"196 ","pages":"Article 109019"},"PeriodicalIF":8.1,"publicationDate":"2025-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143943219","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
ZhiWei Ling , Qiuchen Wang , Bin Wu, Ru Xia, Jiasheng Qian
{"title":"Dual-engineered heat transfer pathways via ice-templating and hot-pressing for enhanced anisotropic thermal conductivity","authors":"ZhiWei Ling , Qiuchen Wang , Bin Wu, Ru Xia, Jiasheng Qian","doi":"10.1016/j.compositesa.2025.109023","DOIUrl":"10.1016/j.compositesa.2025.109023","url":null,"abstract":"<div><div>The ability to dissipate accumulated heat in integrated circuits determines the performance, safety, and service life of electronic devices. The regulation of orderly heat transfer pathways in composites is a breakthrough to improve the heat dissipation performance. Herein, the heat transfer property of PI-based composites along the horizontal direction was realized by twice regulation of ice-templating and hot-pressing on the transfer pathways composed of boron nitride-coated silver wires (AgNWs@BN-NH<sub>2</sub>). The in-plane thermal conductivity (4.14 W m<sup>−1</sup> K<sup>−1</sup>) of nearly 15 times greater than the through-plane thermal conductivity (0.28 W m<sup>−1</sup> K<sup>−1</sup>) manifested the anisotropic heat dissipation capacity of the AgNWs@BN-20/PI<sub>10</sub>. The heat transfer behavior of composites under pressure was further analyzed by finite element simulation. The change of the pressure value mapped in the model structure indicated that the secondary regulation achieved the optimal horizontal heat transfer effect. Due to the insulating and flame-retardant nature of BN-NH<sub>2</sub>, AgNWs@BN-20/PI<sub>10</sub> exhibited volume resistivity of over 10<sup>14</sup> Ω, limited oxygen index of ∼ 38 %, and peak heat release rate of less than 20 W g<sup>−1</sup>. This strategy offers a promising idea for the development of multifunctional polymer-based thermal management materials with directional heat transfer performance in the electronic applications.</div></div>","PeriodicalId":282,"journal":{"name":"Composites Part A: Applied Science and Manufacturing","volume":"196 ","pages":"Article 109023"},"PeriodicalIF":8.1,"publicationDate":"2025-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143937522","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Lightweight nano-metallized wood: Toward high-performance electromagnetic interference shielding with multifunctional attributes","authors":"Aizhen Wei, Chenchen Wang, Chuanshuang Hu, Xiuyi Lin, Yonghui Zhou, Xi Lin, Jiangtao Xu","doi":"10.1016/j.compositesa.2025.109012","DOIUrl":"10.1016/j.compositesa.2025.109012","url":null,"abstract":"<div><div>The proliferation of electronic devices has heightened the demand for effective electromagnetic interference (EMI) shielding materials with lightweight and sustainable properties. This study presents the development of lightweight, nano-metallized wood with superior EMI shielding effectiveness, water repellency, and infrared shielding capabilities. <em>Balsa</em> wood was subjected to magnetron sputtering to deposit ultra-thin Cu and Ni metal films, achieving a total thickness of 100 nm. The Cu-Wood-Cu (Cu-W-Cu) structured material demonstrated the highest EMI shielding performance, with an average shielding effectiveness of 31.73 dB, surpassing commercial requirements. The material’s hydrophobicity was significantly enhanced, with water contact angles reaching up to 103.2°, attributed to the increased surface roughness. Infrared shielding performance was also notable, with the Cu-W-Cu material reflecting a majority of incident infrared radiation, reducing the surface temperature by 36.9 °C compared to the heating source. The study elucidates the material’s potential in practical EMI shielding applications, showcasing its effectiveness in blocking electromagnetic signals from a Tesla coil and mobile phone signals. The findings underscore the promise of these sustainable, lightweight wood-based materials in addressing multifaceted protection needs, including EMI shielding, water resistance, and thermal management.</div></div>","PeriodicalId":282,"journal":{"name":"Composites Part A: Applied Science and Manufacturing","volume":"196 ","pages":"Article 109012"},"PeriodicalIF":8.1,"publicationDate":"2025-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143947179","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Lin Mei , Wenchong Ouyang , Fan Zhou , Zhuochao Pan , Limin Xu , Yu Bai , Quanming Lu , Tianzhi Luo , Zhengwei Wu
{"title":"Low-cost multifunctional antimony-doped tin oxide/polyacrylamide-chitosan double-network hydrogels with good mechanical properties and excellent electromagnetic interference shielding performance in terahertz band","authors":"Lin Mei , Wenchong Ouyang , Fan Zhou , Zhuochao Pan , Limin Xu , Yu Bai , Quanming Lu , Tianzhi Luo , Zhengwei Wu","doi":"10.1016/j.compositesa.2025.109018","DOIUrl":"10.1016/j.compositesa.2025.109018","url":null,"abstract":"<div><div>Researchers have recently developed various methods to incorporate conductive fillers into hydrogel matrices, including metal-based fillers, carbon nanotubes, and two-dimensional materials like MXenes, significantly enhancing their electromagnetic interference (EMI) shielding properties. However, due to the high cost of these fillers, balancing the high EMI shielding (SE), excellent mechanical performance, and low production costs remains a significant challenge, hindering the widespread industrial application of such hydrogels. In this study, we fabricated antimony-doped tin oxide (ATO)/polyacrylamide (PAAm)-chitosan (CS) hydrogels using sodium citrate (Cit) for salting-out, forming double networks and molecular entanglement. The introduction of ATO and the salting-out effect of Cit not only endowed the hydrogel with excellent mechanical properties (strength > 1.5 MPa) but also enhanced its conductivity and EMI shielding effectiveness while maintaining overall low production costs. The hydrogel achieved a 60.2 dB of EMI SE in the 0.1–1.0 THz range, with the price per milliliter of conductive filler being approximately 0.2 % of that in hydrogels incorporating MXenes or reduced graphene oxide. Notably, the hydrogel also demonstrated excellent strain-sensing capabilities. Combining the outstanding properties above, the gel presents a promising candidate for next-generation flexible electronic device shielding applications. It has significant potential for industrial adoption as a cost-effective EMI shielding material.</div></div>","PeriodicalId":282,"journal":{"name":"Composites Part A: Applied Science and Manufacturing","volume":"196 ","pages":"Article 109018"},"PeriodicalIF":8.1,"publicationDate":"2025-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143937519","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Itamar Tulpan, Sahar Halevi, Amnon Shirizly, Galit Katarivas Levy
{"title":"Beyond layered limitations: A novel multi-thermal optimization framework of 3D-printed short carbon fiber-reinforced polyether-ether-ketone (SCF-PEEK)","authors":"Itamar Tulpan, Sahar Halevi, Amnon Shirizly, Galit Katarivas Levy","doi":"10.1016/j.compositesa.2025.108948","DOIUrl":"10.1016/j.compositesa.2025.108948","url":null,"abstract":"<div><div>Short carbon fiber-reinforced polyether-ether-ketone (SCF-PEEK) is a high-performance composite with excellent mechanical and thermal properties, making it a prime candidate for advanced applications in biomedical, aerospace, and automotive. However, fabricating 3D-printed SCF-PEEK using fused deposition modeling (FDM) is hindered by challenges such as poor interlayer adhesion, mechanical anisotropy, and suboptimal process parameters. This study introduces a novel multi-thermal parameter optimization framework leveraging an open-source FDM printer equipped with a direct annealing system (DAS). By systematically optimizing printing temperature, DAS temperature, and post-process heat treatment, the optimal parameters (printing: 440 °C, DAS: 440 °C, heat-treatment: 200 °C) yielded remarkable enhancements in interlayer adhesion and mechanical performance. Compression and tensile testing, along with density and differential scanning calorimetry analyses, confirmed consistent density (1.29–1.31 g⋅cm<sup>−3</sup>) and degree of crystallinity (26–36 %) across all fabrication conditions. DAS transformed the compression failure mechanism from a single shear fracture to a micro-buckling with interlayer and intralayer damage, while upright tensile fractures shifted from smooth to rough surfaces with thicker crystalline spherulites, indicating improved interlayer adhesion. Anisotropic mechanical behavior was evaluated in upright, 45°, and flat orientations under compression and tensile loads. Flat-oriented tensile samples exhibited the highest UTS and elastic modulus, while upright-oriented compressive samples had the highest UCS, and flat-oriented compressive samples showed the highest elastic modulus, attributed to fiber alignment. This study establishes a new benchmark for SCF-PEEK fabrication via FDM, highlighting the critical role of thermal optimization in enhancing mechanical durability and interlayer bonding while providing insights into the effects of orientation and fiber–matrix interactions on failure behavior.</div></div>","PeriodicalId":282,"journal":{"name":"Composites Part A: Applied Science and Manufacturing","volume":"196 ","pages":"Article 108948"},"PeriodicalIF":8.1,"publicationDate":"2025-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143937520","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Haibin Tang , Yingjie Yang , Shuxiang Zhang , Zhangxing Chen , Tingting Liu
{"title":"Laser powder bed fusion of high-performance carbon fiber reinforced PEEK composites: Process design and orthotropic behavior analysis","authors":"Haibin Tang , Yingjie Yang , Shuxiang Zhang , Zhangxing Chen , Tingting Liu","doi":"10.1016/j.compositesa.2025.109013","DOIUrl":"10.1016/j.compositesa.2025.109013","url":null,"abstract":"<div><div>Poly-ether-ether-ketone (PEEK) and PEEK-based composites are emerging as key materials in laser powder bed fusion (LPBF) techniques fabricated via selective laser sintering (SLS). In the current work, the process parameters and scanning strategies for LPBF of carbon fiber reinforced PEEK composites (LPBF-CF/PEEK) with a fiber weight fraction of 20 % are studied. The effect of nano-scale SiO<sub>2</sub> flow agent content on the powder flowability and the mechanical property of LPBF-CF/PEEK composites is analyzed. Using optimal process parameters, LPBF-CF/PEEK composites with the ultimate tensile strength of 142 MPa and modulus of 11.3 GPa are successfully 3D printed. Further, the orthotropic behaviors of LPBF-CF/PEEK composites are evaluated. Uniaxial tension, compression, and pure shear tests are conducted along three principal directions, i.e., the powder spreading direction, transverse direction, and building direction for LPBF-CF/PEEK composites. Excellent mechanical performance is observed along all loading conditions, except for the tension in the building direction. A macro-scale constitutive model, combining the Liu-Huang-Stout yield criterion and the associated flow rule, is developed to characterize the elastoplastic behaviors of LPBF-CF/PEEK composites. The model is calibrated using the uniaxial loading data of LPBF-CF/PEEK composites, and validated with the LPBF-CF/PEEK structures featuring triply periodic minimal surface (TPMS).</div></div>","PeriodicalId":282,"journal":{"name":"Composites Part A: Applied Science and Manufacturing","volume":"196 ","pages":"Article 109013"},"PeriodicalIF":8.1,"publicationDate":"2025-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143928395","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}