Jeong-Cheol Lee, Myung-woon Hwang, Seokyong Hong, Moonkyung Ahn, S. Jeong, Y. Oh, Seungbum Lim, Hyunha Cho, Je-cheol Moon, Jong-Ryul Lee, Sangwoo Han, Che Handa, T. Fujie, Katsuya Hashimoto, Kengo Tamukai
{"title":"A 1.2V 57mW mobile ISDB-T SoC in 90nm CMOS","authors":"Jeong-Cheol Lee, Myung-woon Hwang, Seokyong Hong, Moonkyung Ahn, S. Jeong, Y. Oh, Seungbum Lim, Hyunha Cho, Je-cheol Moon, Jong-Ryul Lee, Sangwoo Han, Che Handa, T. Fujie, Katsuya Hashimoto, Kengo Tamukai","doi":"10.1109/ASSCC.2009.5357166","DOIUrl":"https://doi.org/10.1109/ASSCC.2009.5357166","url":null,"abstract":"This paper presents a 1.2 V 57 mW SoC using a 90 nm CMOS process in mobile ISDB-T application. This achieves −98.5 dBm sensitivity at QPSK, CR = −2/3 with 2.5 dB NF of RF tuner block and 5.6 dB C/N of OFDM block at UHF-band. To integrate RF tuner and OFDM in a small single die, a wideband single LC-VCO operating from 1.8 GHz to 3.3 GHz is proposed and OFDM is designed by hard-wired logic.","PeriodicalId":263023,"journal":{"name":"2009 IEEE Asian Solid-State Circuits Conference","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131656059","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Digitally controlled low-EMI switching converter with random pulse position modulation","authors":"Jui-Chi Wu, Chin-Wei Mu, Chun-Hung Yang, Chien-Hung Tsai","doi":"10.1109/ASSCC.2009.5357164","DOIUrl":"https://doi.org/10.1109/ASSCC.2009.5357164","url":null,"abstract":"A fully digital controlled low-EMI switching converter combining RPPM (Random Pulse Position Modulation), our improved version of Hybrid DPWM (Digital Pulse Width Modulator) and AEDPWM (Area-Efficient DPWM) schemes is proposed to achieve low-EMI (Electromagnetic Interference) with reduced area and power consumption. A FPGA-controlled prototype buck converter operating at 1 MHz switching frequency with 1.8 V input voltage and 0.6–1.2V output voltage is presented to demonstrate the technique. The resulting switching noise suppression capability is up to 18 dB in average.","PeriodicalId":263023,"journal":{"name":"2009 IEEE Asian Solid-State Circuits Conference","volume":"36 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134259166","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"CMOS low-VT preamplifier for 0.5-V gigabit-DRAM arrays","authors":"A. Kotabe, Y. Yanagawa, S. Akiyama, T. Sekiguchi","doi":"10.1109/ASSCC.2009.5357144","DOIUrl":"https://doi.org/10.1109/ASSCC.2009.5357144","url":null,"abstract":"A novel CMOS low-VT preamplifier suitable for low-voltage and high-speed mid-point sensing was developed for gigabit DRAM. This preamplifier consists of a low-VT NMOS cross couple, a low-VT PMOS cross couple and a high-VT CMOS latch. The sensing speed of the proposed preamplifier at dataline voltage of 0.5 V is 62% higher than that of a conventional preamplifier. By activating the low-VT NMOS and PMOS cross couples temporarily during write operation, writing time is 72% shorter compared to the case with the high-VT CMOS latch only. Data-line charging current of a memory cell array with the proposed preamplifier is reduced by 26% by decreasing dataline voltage from 0.8 to 0.5V.","PeriodicalId":263023,"journal":{"name":"2009 IEEE Asian Solid-State Circuits Conference","volume":"212 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132441071","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Y. Takamatsu, R. Fujimoto, T. Yasuda, T. Sekine, T. Hirakawa, M. Ishii, M. Hayashi, N. Itoh
{"title":"A tunable low-noise amplifier for digital TV applications","authors":"Y. Takamatsu, R. Fujimoto, T. Yasuda, T. Sekine, T. Hirakawa, M. Ishii, M. Hayashi, N. Itoh","doi":"10.1109/ASSCC.2009.5357258","DOIUrl":"https://doi.org/10.1109/ASSCC.2009.5357258","url":null,"abstract":"This paper presents a tunable low-noise amplifier (LNA) for digital TV (ISDB-T) applications. To receive all channels from 470MHz to 770MHz and to relax distortion characteristics of following circuit blocks such as an RF variable-gain amplifier and a mixer, tunable techniques for LNAs are required. A novel output matching configuration for tunable LNAs is proposed, and an input matching technique is also described. A tunable LNA using the proposed tunable techniques is fabricated using 90nm CMOS technology. Measured results show the proposed techniques are suitable for the LNAs for the ISDB-T.","PeriodicalId":263023,"journal":{"name":"2009 IEEE Asian Solid-State Circuits Conference","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128920785","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"An integrated linear regulator with fast output voltage transition for SRAM yield improvement","authors":"Chun-Yen Tseng, Po-Chiun Huang, Li-Wen Wang","doi":"10.1109/ASSCC.2009.5357161","DOIUrl":"https://doi.org/10.1109/ASSCC.2009.5357161","url":null,"abstract":"This work presents a fully integrated linear regulator design that can dynamically assign the SRAM cell voltage to increase the read/write margin. To minimize the timing overhead between read/write mode switches, this design adopts two separate feedback loops for bias and load regulations. Individual optimization for each loop makes fast reference tracking and load regulation possible. To verify this concept, a prototype LDO is realized with a 1.8-V 0.18μm CMOS. The output voltage can be freely set between 0.9 and 1.7-V. The measured transition speed is 48ns/0.3V. The maximum current efficiency is 94.7% under a 20mA current loading.","PeriodicalId":263023,"journal":{"name":"2009 IEEE Asian Solid-State Circuits Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128190710","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Kuan-Chao Liao, Po-Sheng Huang, W. Chiu, Tsung-Hsien Lin
{"title":"A 400-MHz/900-MHz/2.4-GHz multi-band FSK transmitter in 0.18-μm CMOS","authors":"Kuan-Chao Liao, Po-Sheng Huang, W. Chiu, Tsung-Hsien Lin","doi":"10.1109/ASSCC.2009.5357168","DOIUrl":"https://doi.org/10.1109/ASSCC.2009.5357168","url":null,"abstract":"A multi-band FSK transmitter (Tx) is presented in this paper. The Tx is designed to operate at the ISM frequency bands at 433/868/915 MHz, 2.4 GHz, and MICS band at 402~405 MHz, and supports a data rate well over 1 Mbps. The Tx adopts an analog modulator which allows a deviation frequency ranging from 714 kHz to 3.2 MHz. In addition, this work proposes an inductor-less wideband mixer and a voltage-controlled oscillator to save the chip area. Fabricated in a 0.18-μm CMOS process, the proposed Tx consumes 8.9 mA to 12 mA from a 1.8-V supply voltage at different frequency bands. The measured FSK errors range from 13.9 % to 15.4 %, which are adequate for most low-cost wireless applications. The proposed multi-band Tx occupies an area of 1.6 mm × 1.9 mm.","PeriodicalId":263023,"journal":{"name":"2009 IEEE Asian Solid-State Circuits Conference","volume":"751 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126946637","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A DTR UWB transmitter/receiver pair for wireless endoscope","authors":"Chul Kim, S. Nooshabadi","doi":"10.1109/ASSCC.2009.5357169","DOIUrl":"https://doi.org/10.1109/ASSCC.2009.5357169","url":null,"abstract":"This paper introduces an ultra-wideband (UWB) system and its integrated circuit design for biotelemetry in-vivo wireless endoscope application that enables real-time diagnosis with high resolution images. The implemented UWB transmitter (Tx)/receiver (Rx) pair is a non-coherent differential transmit-reference (DTR) architecture. All-digital pulse generator (PG) Tx, and merged radio frequency (RF) Rx frond end including the low noise amplifier (LNA), mixer and low-pass filter (LPF) have been implemented along with the analog baseband using a 0.18um digital CMOS process. The PG operates at 200Mbps at an ultra low 27pJ/bit transmit energy.","PeriodicalId":263023,"journal":{"name":"2009 IEEE Asian Solid-State Circuits Conference","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121890252","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Green future: IC packaging opportunities abound","authors":"H. Tong","doi":"10.1109/ASSCC.2009.5357242","DOIUrl":"https://doi.org/10.1109/ASSCC.2009.5357242","url":null,"abstract":"Today, as global environmental regulations are being tightened, both IC and package technologies are also becoming far more complicated. More Moore and more than Moore, which manifest themselves in system-on-chip (SoC) and system-in-a-package (SiP), respectively, are being used more in combination to meet the ever-more-stringent cost and time-to-market requirements of consumer products with more functions built in them. In this presentation, I will review the challenges and opportunities to IC packaging as a direct outcome of the above trends to ensure SoC and SiP based IC packages meet the needs of the present generation without compromising the ability of future generations.","PeriodicalId":263023,"journal":{"name":"2009 IEEE Asian Solid-State Circuits Conference","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129752223","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A 45nm 0.5V 8T column-interleaved SRAM with on-chip reference selection loop for sense-amplifier","authors":"M. Sinangil, N. Verma, A. Chandrakasan","doi":"10.1109/ASSCC.2009.5357219","DOIUrl":"https://doi.org/10.1109/ASSCC.2009.5357219","url":null,"abstract":"8T bit-cells hold great promise for overcoming device variability in deeply scaled SRAMs and enabling aggressive voltage scaling for ultra-low-power. This paper presents an array architecture and circuits with minimal area overhead to allow column-interleaving while eliminating the half-select problem. This enables sense-amplifier sharing and soft-error immunity. A reference selection loop is designed and implemented in the column circuitry. By choosing one of the two reference voltages for each sense-amplifier in a pseudo-differential scheme, selection loop effectively reduces input offset. 8T test array fabricated in 45nm CMOS achieves functionality from 1.1V to below 0.5V. Test chip operates at 450MHz at 1.1V and 5.8MHz at 0.5V while consuming 12.9mW and 46μW respectively.","PeriodicalId":263023,"journal":{"name":"2009 IEEE Asian Solid-State Circuits Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130850384","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A quantization error minimization using DDS-DAC for wideband fractional-N frequency synthesizer","authors":"Yi-Da Wu, Po-Chiun Huang","doi":"10.1109/asscc.2009.5357181","DOIUrl":"https://doi.org/10.1109/asscc.2009.5357181","url":null,"abstract":"This work presents a quantization error minimization technique for a fractional-N frequency synthesizer. By using a direct digital synthesis phase accumulator as the fractional divider and a DAC as pulse conversion, the quantization error can be much smaller than the one by conventional Σ-Δ modulated multi-modulus divider. With small quantization error, dedicated compensation mechanism is no longer necessary for wide loop bandwidth applications. To demonstrate this concept, a prototype chip is realized with the 0.18μm CMOS. The synthesizer consumes 31mA under a single 1.8V supply. With 1MHz closed-loop bandwidth, the in-band noise is −94dBc/Hz and the 3MHz offset noise is −118dBc/Hz for the 1.8GHz output. The output exhibits 27dB phase noise reduction. The settling time is 2μs under a 35MHz frequency step.","PeriodicalId":263023,"journal":{"name":"2009 IEEE Asian Solid-State Circuits Conference","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126153401","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}