{"title":"A general framework for probabilistic low-power design space exploration considering process variation","authors":"A. Srivastava, D. Sylvester","doi":"10.1109/ICCAD.2004.1382686","DOIUrl":"https://doi.org/10.1109/ICCAD.2004.1382686","url":null,"abstract":"Increasing levels of process variation in current process technologies make it extremely important that design and process decisions be made while considering their impact. This work presents a convex optimization based approach to select supply and threshold voltages to minimize power dissipation in generic multi-Vdd/Vth CMOS designs while considering process variation. We use this probabilistic approach to compare the optimization of different statistical parameters of power dissipation (e.g., mean or high percentile points), and quantify the impact of rising process variations on these power minimization techniques.","PeriodicalId":255227,"journal":{"name":"IEEE/ACM International Conference on Computer Aided Design, 2004. ICCAD-2004.","volume":"114 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117309720","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Physical design at 90nm and beyond [Tutorial 2]","authors":"A. Kahng, P. J. Osler","doi":"10.1109/ICCAD.2004.1382524","DOIUrl":"https://doi.org/10.1109/ICCAD.2004.1382524","url":null,"abstract":"Description: Process variations, leakage, and scalability of runtime and QOR present critical challenges to IC physical design at the 90nm node and beyond. Many established paradigms, such as sequenced synthesis, place, and route flows, will have to be replaced by new physical design methodologies and tool paradigms. This tutorial will cover five key shifts at 90nm and beyond. We will discuss necessary algorithmic and flow changes that underlie manufacturingaware cell-based place-and-route methodologies. Next, we will discuss methods and infrastructure for statistical and parameterized static timing analysis. Then we will discuss the benefits and challenges of integrated routing/placement/synthesis. Next, we will discuss nextgeneration thermal and leakage power-centric analysis and optimization flows that respond to the power and leakage issues. Finally, a view is provided on the long-term methodological trends that will govem the evolution of physical design.","PeriodicalId":255227,"journal":{"name":"IEEE/ACM International Conference on Computer Aided Design, 2004. ICCAD-2004.","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121066937","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Physical placement driven by sequential timing analysis","authors":"A. Hurst, P. Chong, A. Kuehlmann","doi":"10.1109/ICCAD.2004.1382605","DOIUrl":"https://doi.org/10.1109/ICCAD.2004.1382605","url":null,"abstract":"Traditional timing-driven placement considers only combinational delays and does not take into account the potential of subsequent sequential optimization steps. As a result, the potential of re-balancing path delays through post-placement applications of clock skew scheduling and in-place retiming cannot be fully realized. In this paper we describe a new placement algorithm that is based on a tight integration of sequential timing analysis in the inner loop of an analytic solver. Instead of minimizing the maximum path delay, our approach minimizes the maximum mean delay on any circuit loop, thus enabling the full optimization potential of clock skew scheduling and in-place retiming. We present two versions of the new algorithm: one approximates sequential criticality and weights wires accordingly (Cong and Lim, 2000), the other extends this with the inclusion of explicit wire-length constraints for loops that limit the final clock period. Our algorithms are implemented using a hybrid, GORDlAN-style sequence of analytical placement steps interleaved with cell partitioning (Kleinhans et al., 1988). Our experiments on a set of large industrial designs demonstrate that the presented placement algorithm can minimize the contribution of interconnection delays to the clock period on average by 23.5% compared to a solution based on combinational delays.","PeriodicalId":255227,"journal":{"name":"IEEE/ACM International Conference on Computer Aided Design, 2004. ICCAD-2004.","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116984023","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Adaptive sampling and modeling of analog circuit performance parameters with pseudo-cubic splines","authors":"Glenn Wolfe, Mengmeng Ding, R. Vemuri","doi":"10.1109/ICCAD.2004.1382709","DOIUrl":"https://doi.org/10.1109/ICCAD.2004.1382709","url":null,"abstract":"Many approaches to analog performance parameter macro modeling have been investigated by the research community. These models are typically derived from discrete data obtained from circuit simulation using numerous input combinations of component sizes for a given circuit topology. The simulations are computationally intensive, therefore it is advantageous to reduce the number of simulations necessary to build an accurate macro model. We present a new algorithm for adaptively sampling multi-dimensional black box functions based on Duchon pseudo-cubic splines. The splines readily and accurately model high dimensional functions based on discrete unstructured data and require no tuning of parameters as seen in many other interpolation methods. The adaptive sampler, in conjunction with pseudo-cubic splines, is used to accurately model various analog performance parameters for an operational amplifier topology using fewer sample points than traditional gridded and quasi-random sampling methodologies.","PeriodicalId":255227,"journal":{"name":"IEEE/ACM International Conference on Computer Aided Design, 2004. ICCAD-2004.","volume":"2015 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121400366","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Process and environmental variation impacts on ASIC timing","authors":"P. Zuchowski, P. Habitz, J. Hayes, J. Oppold","doi":"10.1109/ICCAD.2004.1382597","DOIUrl":"https://doi.org/10.1109/ICCAD.2004.1382597","url":null,"abstract":"With each semiconductor process node, the impacts on performance of environmental and semiconductor process variations become a larger portion of the cycle time of the product. Simple guard-banding for these effects leads to increased product development times and uncompetitive products. In addition, traditional static timing methodologies are unable to cope with the large number of permutations of process, voltage, and temperature corners created by these independent sources of variation. In this paper we will discuss the sources of variation; by introducing the concepts of systematic inter-die variation, systematic intra-die variation and intra-die random variation. We will show that by treating these forms of variations differently, we can achieve design closure with less guard-banding than traditional methods.","PeriodicalId":255227,"journal":{"name":"IEEE/ACM International Conference on Computer Aided Design, 2004. ICCAD-2004.","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121700482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Soft self-synchronising codes for self-calibrating communication","authors":"F. Worm, P. Ienne, Patrick Thiran","doi":"10.1109/ICCAD.2004.1382617","DOIUrl":"https://doi.org/10.1109/ICCAD.2004.1382617","url":null,"abstract":"Self-calibrating designs are gaining momentum in both the computation and communication worlds. Instead of relying on the worst-case characterisation of design parameters, self calibrating systems determine autonomously the boundary of correct behaviour, and set design parameters accordingly. We focus on the communication task. We model errors due to over-aggressive operation and derive a channel model. We show that self-synchronising codes achieve completely reliable communication over this channel model, and study a known example, LEDR (level encoded 2-phase dual-rail), which is an improvement of the well-known dual-rail code. Then, we introduce a family of coding schemes which are a generalisation of LEDR, and study their performance over our channel model. We observe that the wiring overhead can be significantly reduced at the expense of a limited loss in reliability. Finally, we extend our channel model to include additive noise, and show that in this more general situation a specific instance of our coding scheme has similar or better performance than LEDR, at a smaller wiring overhead.","PeriodicalId":255227,"journal":{"name":"IEEE/ACM International Conference on Computer Aided Design, 2004. ICCAD-2004.","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116560971","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Simultaneous escape routing and layer assignment for dense PCBs","authors":"Muhammet Mustafa Ozdal, Martin D. F. Wong","doi":"10.1109/ICCAD.2004.1382689","DOIUrl":"https://doi.org/10.1109/ICCAD.2004.1382689","url":null,"abstract":"As die sizes are shrinking, and circuit complexities are increasing, the PCB routing problem becomes more and more challenging. Traditional routing algorithms can not handle these challenges effectively, and many high-end designs in the industry require manual routing efforts. In this paper, we propose a problem decomposition that distinguishes routing within dense components from routing in the intermediate area. In particular, we propose an effective methodology to find the escape routing solution for multiple components simultaneously such that the number of crossings in the intermediate area is minimized. For this, we model the problem as a longest path with forbidden pairs (LPFP) problem, and propose two algorithms for it. The first is an exact polynomial-time algorithm that is guaranteed to find the maximal planar routing solution on one layer. The second is a randomized algorithm that has good scalability characteristics for large circuits. Then we use these algorithms to assign the maximal subset of planar nets to each layer, and then distribute the remaining nets at the end. We demonstrate the effectiveness of these algorithms through experiments on industrial circuits.","PeriodicalId":255227,"journal":{"name":"IEEE/ACM International Conference on Computer Aided Design, 2004. ICCAD-2004.","volume":"90 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116010940","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Design/process learning from electrical test","authors":"B. Koenemann","doi":"10.1109/ICCAD.2004.1382673","DOIUrl":"https://doi.org/10.1109/ICCAD.2004.1382673","url":null,"abstract":"Modern design-for-test (DFT) practices not only simplify test generation but also make it much easier to diagnose problems uncovered in electrical test. In fact, many diagnostics steps can be automated enough to enable batch processing of large quantities of fail data captured during production test. Hidden in these fail data is very valuable information about the product design, manufacturing process, and interactions between the two. The embedded tutorial provides an overview of some of the analysis methods that are being used and/or prototyped in the industry, as well as the underlying data sharing between the design and manufacturing areas that is required for and enabled by the analyses.","PeriodicalId":255227,"journal":{"name":"IEEE/ACM International Conference on Computer Aided Design, 2004. ICCAD-2004.","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126604649","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"SPIN-TEST: automatic test pattern generation for speed-independent circuits","authors":"Feng Shi, Y. Makris","doi":"10.1109/ICCAD.2004.1382703","DOIUrl":"https://doi.org/10.1109/ICCAD.2004.1382703","url":null,"abstract":"SPIN-TEST is a simulation-based gate-level ATPG system for speed-independent circuits. Its core engine is an A* search algorithm which employs an accurate fault simulator and an efficient cost function to guide a deterministic test pattern generation phase. A random test pattern generation phase is also available in order to improve run time. The key ATPG challenge in speed-independent circuits is the generation of patterns that are valid independently of the relative timing and the order of arrival of signals. SPIN-TEST addresses this challenge by guaranteeing fault sensitization with hazard/race-free patterns and response observation that is not affected by oscillations or non-deterministic circuit states. Experimental results on benchmark circuits demonstrate the efficiency of SPIN-TEST in terms of both high fault coverage and low test generation time.","PeriodicalId":255227,"journal":{"name":"IEEE/ACM International Conference on Computer Aided Design, 2004. ICCAD-2004.","volume":"90 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126232273","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Techniques for improving the accuracy of geometric-programming based analog circuit design optimization","authors":"Jintae Kim, Jaeseo Lee, L. Vandenberghe","doi":"10.1109/ICCAD.2004.1382695","DOIUrl":"https://doi.org/10.1109/ICCAD.2004.1382695","url":null,"abstract":"We present techniques for improving the accuracy of geometric-programming (GP) based analog circuit design optimization. We describe major sources of discrepancies between the results from optimization and simulation, and propose several methods to reduce the error. Device modeling based on convex piecewise-linear (PWL) function fitting is introduced to create accurate active and passive device models. We also show that in selected cases GP can enable nonconvex constraints such as bias constraints using monotonicity, which help reduce the error. Lastly, we suggest a simple method to take the modeling error into account in GP optimization, which results in a robust design over the inherent errors in GP device models. Two-stage operational amplifier and on-chip spiral inductor designs are given as examples to demonstrate the presented ideas.","PeriodicalId":255227,"journal":{"name":"IEEE/ACM International Conference on Computer Aided Design, 2004. ICCAD-2004.","volume":"14 46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132223642","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}