2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems最新文献_第9页

Thermal analysis of micro-hotplates for catalytic gas microsensors 催化气体微传感器微热板热分析

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103094

A. Kozlov

{"title":"Thermal analysis of micro-hotplates for catalytic gas microsensors","authors":"A. Kozlov","doi":"10.1109/EUROSIME.2015.7103094","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103094","url":null,"abstract":"The analytical method is presented to conduct thermal analysis of micro-hot plates for catalytic gas microsensors. The 2D structure of a micro-hotplate is divided into the regions, the temperature distribution in which is found by the eigenfunction method. To take into account the temperature dependencies parameters the iteration procedure is used. The values of the parameters are determined using the weighted mean temperature in each region. The application of this method is considered on the example of the catalytic gas microsensors based on the square plates supported by two cantilever beams in various places: at centre of two opposite sides; at two opposite corners; at two adjacent corners. For these micro-hotplates the following characteristics were determined: the dependencies of the weighted mean overheating temperature, the difference between the maximum and minimum temperatures and the ratio of the weighted mean overheating temperature to the difference between the maximum and minimum temperatures on the length of the cantilever beams, the dimensions of the micro-hotplate and the supply voltage of the microsensor.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130049796","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Latching MEMS switch matrices for telecommunication applications 用于电信应用的锁存MEMS开关矩阵

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103079

D. Dellaert, J. Doutreloigne

引用次数: 1

Statistical energy study for 28nm FDSOI devices 28nm FDSOI器件的统计能量研究

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103149

Rida Kheirallah, J. Gallière, A. Todri-Sanial, N. Azémard, G. Ducharme

引用次数: 0

Modelling and characterization of circular microplate electrostatic actuators for micropump applications 微泵应用的圆形微板静电致动器的建模和表征

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103121

E. Bertarelli, Alice Colnago, R. Ardito, G. Dubini, A. Corigliano

引用次数: 5

Challenges in the reliability of 3D integration using TSVs 使用tsv进行3D集成的可靠性挑战

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103129

M. Stiebing, D. Vogel, W. Steller, M. Wolf, B. Wunderle

{"title":"Challenges in the reliability of 3D integration using TSVs","authors":"M. Stiebing, D. Vogel, W. Steller, M. Wolf, B. Wunderle","doi":"10.1109/EUROSIME.2015.7103129","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103129","url":null,"abstract":"One of the possible target applications of 3D-integration is the high performance computing (HPC). The improved performance of 3D-integrating can base on an Interposer with heterogeneous integration of special high performance fluidic cooling, individual power supply next to the microprocessor and a tailored packaging approach. This paper focuses on the reliability assessment of the interposer regarding the interaction of TSV, wiring and fluid channel integration based on current publications in correlation with the selected specifications for Interposer manufacturing. A further part is the correlation with initial results of stress simulation and measurements applied to the Interposer design specifications of cavities and interconnect features (used for sealing the cooling channels and as electrical interconnect). We give an overview of a new level of complexity of 3D integration and discuss certain failure mechanisms that can influence the performance of 3D integrated devices. We show that the prediction of failure locations becomes possible by the method of finite element modeling but with the necessity to obtain process specific material data as an input for the simulation. An overview shows the possibilites of residual stresses analyses on test vehicles by using special methods of Raman spectroscopy and fibDAC including interpretation challenges of gathered measurement data. Furthermore the application of a new method for fatigue testing is proposed and discussed.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"109 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133519328","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Reliability assessment of copper ball bonds by combination of simulation and accelerated mechanical testing 仿真与加速力学试验相结合的铜球键可靠性评估

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103137

M. Lederer, A. Lassnig, G. Khatibi, M. Delshadmanesh

引用次数: 2

Reliability investigation and design of high power rectifier modules based on material characterization, simulation and experimental verification 基于材料特性、仿真和实验验证的大功率整流模块可靠性研究与设计

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103128

E. Merten, T. von Essen, F. Luczack, A. Otto, A. Lunding, P. Lurkens, M. Bast, M. Abo Ras, S. Rzepka

引用次数: 2

Current load capacity of electrical conductor tracks evaluated by simulation and thermographic imaging 用模拟和热成像技术评价电导体轨道的电流负载能力

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103133

T. Tetzlaff, U. Witkowski

{"title":"Current load capacity of electrical conductor tracks evaluated by simulation and thermographic imaging","authors":"T. Tetzlaff, U. Witkowski","doi":"10.1109/EUROSIME.2015.7103133","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103133","url":null,"abstract":"Today's LEDs operate with high current, causing a significant increase in the device's temperature despite the LEDs being highly energy efficient. Important for having a long LED lifetime is accurate temperature management which requires sensing the device temperature and knowing the temperature distribution. The underlying aim of the project is to simulate the temperature distribution in LED devices mounted on printed circuit boards and to compare the data with simulation results. The focus of this paper is the modelling and simulation of PCB tracks of different widths that are typically used in board designs and device interconnections. Based on the finite element method, the surface temperature of electrical tracks is simulated using the tool COMSOL. For comparison with real world measurements, the simulated structures have been fabricated and analysed via contact-free infrared thermography. The main challenge is the mechanical modelling of the track structure and the setup of the material parameters to have a good match between simulation results and measurements. In a future step, the simulation results will be used to allow for integrated temperature management of LED devices which include power supply structures to avoid overheating at the p-n junctions and at the light conversion material on top of the LED.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"443 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131641848","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

B-Spline X-Ray Diffraction Imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips b样条x射线衍射成像技术在全封装封装芯片内的模具翘曲和应力监测

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103166

P. McNally

引用次数: 3

The influence of PBGAs post-manufacturing warpage simulation, viscoelastic material properties and evaluation methodology on accuracy of solder joints damage prediction 研究了PBGAs制造后翘曲模拟、粘弹性材料特性及评价方法对焊点损伤预测精度的影响

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103083

M. Kuczynska, N. Schafet, M. Spraul, U. Becker

{"title":"The influence of PBGAs post-manufacturing warpage simulation, viscoelastic material properties and evaluation methodology on accuracy of solder joints damage prediction","authors":"M. Kuczynska, N. Schafet, M. Spraul, U. Becker","doi":"10.1109/EUROSIME.2015.7103083","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103083","url":null,"abstract":"Two Plastic Ball Grid Array (PBGA) designs were stressed with Temperature Cycles (TC) in the Board Level Reliability (BLR) test, and simulated using FEM. The test result for one of the PBGAs was not in line with original expectation, but it was confirmed by FE-simulation. The simulation incorporated manufacturing process (the real post-cure shape verified by measurement) and viscoelastic material properties. The impact of model simplifications (i.e. omitting manufacturing process simulation or viscoelastic material properties) on the thermo-mechanical load of the solder joints was investigated. The opportunities and restrictions of these simplifications are shown and discussed. The current work also describes an improvement of the strategy for evaluation of the simulation results. The correlation between the test result (crack lengths observed via cross sections) and the local damage-related state variables from the FE-simulation was improved when effects of hydrostatic stress and cross section direction were included in the evaluation.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129329425","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7