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2017 IEEE Optical Interconnects Conference (OI)最新文献

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30 Gbit/s 1.7 pJ/bit common-cathode tunable 850-nm-VCSEL driver in 28 nm digital CMOS 30gbit /s 1.7 pJ/bit共阴极可调谐850nm - vcsel驱动
2017 IEEE Optical Interconnects Conference (OI) Pub Date : 2017-06-01 DOI: 10.1109/OIC.2017.7965526
László Szilágyi, Guido Belfiore, R. Henker, F. Ellinger
{"title":"30 Gbit/s 1.7 pJ/bit common-cathode tunable 850-nm-VCSEL driver in 28 nm digital CMOS","authors":"László Szilágyi, Guido Belfiore, R. Henker, F. Ellinger","doi":"10.1109/OIC.2017.7965526","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965526","url":null,"abstract":"A common-cathode VCSEL driver implemented in 28-nm digital CMOS, assembled with a commercial VCSEL is presented. Electro-optical measurements show 30-Gbit/s operation with 1.7-pJ/bit from 2.9-V supply. When operated at 15-Gbit/s the power can be reduced while maintaining the modulation amplitude. Power/datarate tunability is demonstrated.","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"135 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124222151","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
The benefit of mid-board optic and other flyover technology 中板光学和其他立交桥技术的好处
2017 IEEE Optical Interconnects Conference (OI) Pub Date : 2017-06-01 DOI: 10.1109/OIC.2017.7965509
F. Coppinger, David Langsam, Adam Page, M. Verdiell
{"title":"The benefit of mid-board optic and other flyover technology","authors":"F. Coppinger, David Langsam, Adam Page, M. Verdiell","doi":"10.1109/OIC.2017.7965509","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965509","url":null,"abstract":"As signal speed increases, flyover technology (with either optical fiber or twinax copper cable being used as the flyover material) is becoming a critical tool that simplifies the design of high speed boards. The technology significantly reduces the complexity of layout, avoids the high loss of the board high speed traces, and simplifies the requirements on the board material[1].","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129877295","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
VCSEL modulation capacity: Continued improvements or physical limits? VCSEL调制能力:持续改进还是物理限制?
2017 IEEE Optical Interconnects Conference (OI) Pub Date : 2017-06-01 DOI: 10.1109/OIC.2017.7965527
A. Larsson, J. Gustavsson, E. Haglund, E. Haglund, T. Lengyel, E. Simpanen, M. Jahed
{"title":"VCSEL modulation capacity: Continued improvements or physical limits?","authors":"A. Larsson, J. Gustavsson, E. Haglund, E. Haglund, T. Lengyel, E. Simpanen, M. Jahed","doi":"10.1109/OIC.2017.7965527","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965527","url":null,"abstract":"The short-reach optical interconnects used in datacenters and high-performance computing systems are dominated by VCSEL and multimode fiber (MMF) links1. The VCSEL-MMF technology is the most cost and power efficient and offers the smallest footprint. VCSELs operating at 25–28 Gbit/s are in production2 while research has extended the VCSEL modulation bandwidth to 30 GHz3 (Fig.1) and enabled OOK-NRZ data transmission up to 57 Gbit/s at 25°C4 and 50 Gbit/s at 85°C5, without equalization or forward-error-correction (FEC). A VCSEL energy dissipation below 100 fJ/bit has been demonstrated at 25–50 Gbit/s3 (Fig.1). The need for higher interconnect capacity raises the question whether the speed and dynamics of VCSELs can be further improved or whether physical limits preventing this have been reached. Higher speed VCSELs would enable higher lane rates and therefore reduced number of lanes and increased bandwidth density for a given aggregate interconnect capacity.","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127689804","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
A 48-Gb/s software defined optical transceiver using multi-tone PAM/CAP modulation 采用多音PAM/CAP调制的48gb /s软件定义光收发器
2017 IEEE Optical Interconnects Conference (OI) Pub Date : 2017-06-01 DOI: 10.1109/OIC.2017.7965523
Fan Yang, Wenjia Zhang, Zuyuan He
{"title":"A 48-Gb/s software defined optical transceiver using multi-tone PAM/CAP modulation","authors":"Fan Yang, Wenjia Zhang, Zuyuan He","doi":"10.1109/OIC.2017.7965523","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965523","url":null,"abstract":"A 48-Gb/s software defined optical transceiver based on the multi-tone PAM/CAP signalling is proposed and experimentally demonstrated over 10-km SSMF. BER below 7% FEC threshold is achieved with equalization, which is better than direct PAM4 transmission. OCIS codes: (060.4510) Optical communications; (200.4650) Optical interconnects.","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131551436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Attojoule optoelectronics-saving more energy with optics 阿焦耳光电子器件——利用光学器件节省更多能源
2017 IEEE Optical Interconnects Conference (OI) Pub Date : 2017-06-01 DOI: 10.1109/OIC.2017.7965510
D. Miller
{"title":"Attojoule optoelectronics-saving more energy with optics","authors":"D. Miller","doi":"10.1109/OIC.2017.7965510","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965510","url":null,"abstract":"Energy in short interconnects inside machines dominates scaling of information processing and communication. Low-energy integrated optoelectronics can eliminate much energy in links themselves and, with space-multiplexing in 2D arrays, could eliminate link circuit energies, allowing 10–100fJ/bit for all links from 1cm to 10m.","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121578005","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Integrated fresnel zone plate in the SOI backend for improved laser to chip coupling efficiency 在SOI后端集成菲涅耳带板，提高了激光与芯片的耦合效率
2017 IEEE Optical Interconnects Conference (OI) Pub Date : 2017-06-01 DOI: 10.1109/OIC.2017.7965512
Marvin Henniges, S. Meister, H. Rhee, C. Theiss, H. Robers, M. Grehn, D. Stolarek, L. Zimmermann, U. Woggon
{"title":"Integrated fresnel zone plate in the SOI backend for improved laser to chip coupling efficiency","authors":"Marvin Henniges, S. Meister, H. Rhee, C. Theiss, H. Robers, M. Grehn, D. Stolarek, L. Zimmermann, U. Woggon","doi":"10.1109/OIC.2017.7965512","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965512","url":null,"abstract":"A zone plate, etched into the backend of a silicon-on-insulator chip, was designed to improve the optical coupling efficiency between grating couplers and non-perpendicular light sources with an elliptical beam profile. Measurements of a highly divergent light source showed efficiency improvements up to 8.7dB.","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129610239","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Characterization of systematic process variation in a silicon photonic platform 硅光子平台系统工艺变化的表征
2017 IEEE Optical Interconnects Conference (OI) Pub Date : 2017-06-01 DOI: 10.1109/OIC.2017.7965506
Nicholas A. Boynton, A. Pomerene, A. Starbuck, A. Lentine, C. DeRose
{"title":"Characterization of systematic process variation in a silicon photonic platform","authors":"Nicholas A. Boynton, A. Pomerene, A. Starbuck, A. Lentine, C. DeRose","doi":"10.1109/OIC.2017.7965506","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965506","url":null,"abstract":"We present a quantitative analysis of the correlation of resonant wavelength variation with process variables, and find that 50% of the resonant wavelength variation for microrings is due to systematic process conditions. We also discuss the improvement of device uniformity by mitigating these systematic variations.","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125630073","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Application regime and distortion metric for multivariate RF photonics 多变量射频光子学的应用制度和畸变度量
2017 IEEE Optical Interconnects Conference (OI) Pub Date : 2017-06-01 DOI: 10.1109/OIC.2017.7965513
A. Tait, T. Ferreira de Lima, M. Chang, M. Nahmias, B. Shastri, P. Prucnal
{"title":"Application regime and distortion metric for multivariate RF photonics","authors":"A. Tait, T. Ferreira de Lima, M. Chang, M. Nahmias, B. Shastri, P. Prucnal","doi":"10.1109/OIC.2017.7965513","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965513","url":null,"abstract":"Photonic weight banks employing multivariate statistical techniques could extend performance limits of multiantenna radio systems. We characterize the aggregate bandwidth penalty imposed by a silicon microring weight bank and assess application regimes for multivariate RF photonics.","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131448240","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Intermodulation crosstalk of graphene-enabled electro-optic microring modulators for DWDM interconnects 用于DWDM互连的石墨烯使能电光微环调制器的互调串扰
2017 IEEE Optical Interconnects Conference (OI) Pub Date : 2017-06-01 DOI: 10.1109/OIC.2017.7965502
N. Abrams, M. Bahadori, C. Phare, M. Lipson, K. Bergman
{"title":"Intermodulation crosstalk of graphene-enabled electro-optic microring modulators for DWDM interconnects","authors":"N. Abrams, M. Bahadori, C. Phare, M. Lipson, K. Bergman","doi":"10.1109/OIC.2017.7965502","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965502","url":null,"abstract":"The intermodulation crosstalk of graphene modulators integrated on silicon nitride is experimentally characterized for the first time on 1 Gb/s signals. We show that 25 GHz channel spacings are supported with < 0.1 dB penalty for DWDM applications.","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129288328","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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