Integrated fresnel zone plate in the SOI backend for improved laser to chip coupling efficiency

Marvin Henniges, S. Meister, H. Rhee, C. Theiss, H. Robers, M. Grehn, D. Stolarek, L. Zimmermann, U. Woggon
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Abstract

A zone plate, etched into the backend of a silicon-on-insulator chip, was designed to improve the optical coupling efficiency between grating couplers and non-perpendicular light sources with an elliptical beam profile. Measurements of a highly divergent light source showed efficiency improvements up to 8.7dB.
在SOI后端集成菲涅耳带板,提高了激光与芯片的耦合效率
为了提高椭圆型非垂直光源与光栅耦合器之间的光耦合效率,设计了刻蚀在绝缘体上硅芯片后端的带片。对高度发散光源的测量表明,效率提高了8.7dB。
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