2021 IEEE Hot Chips 33 Symposium (HCS)最新文献

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Exynos 1080 High-performance, low-power CPU and GPU with AMIGO Exynos 1080高性能,低功耗的CPU和GPU与AMIGO
2021 IEEE Hot Chips 33 Symposium (HCS) Pub Date : 2021-08-22 DOI: 10.1109/HCS52781.2021.9567394
Taehee Lee, Dongkeun Kim, Joonseok Kim
{"title":"Exynos 1080 High-performance, low-power CPU and GPU with AMIGO","authors":"Taehee Lee, Dongkeun Kim, Joonseok Kim","doi":"10.1109/HCS52781.2021.9567394","DOIUrl":"https://doi.org/10.1109/HCS52781.2021.9567394","url":null,"abstract":"This work presents Exynos 1080, mobile SOC which is productized in Samsung 5nm EUV technology. It is extremely power-efficient SOC which possesses four Cortex-A78 and four Cortex-A55. A Cortex-A78 is clocked at 2.8GHz and three Cortex-A78 cores are clocked at 2.6GHz. Four Cortex-A55 cores run at 2 GHz and handle light tasks. It also features the Mali-G78 MP10 GPU supporting Full HD+ displays with a 144Hz refresh rate or QHD+ displays with a 90Hz refresh rate. High-performance and low-power CPU and GPU in this work empower performance hungry mobile application. We demonstrate the architecture change to improve CPU and GPU performance compared to previous mobile processor, Exynos 980. CPU and GPU are implemented for optimal power efficiency by careful balancing of voltages and leakages, with considering heavy load scenarios. When a game scene is getting heavier, the utilization of CPU, GPU and memory controller increases and each DVFS driver changes their frequency with own policy to handle the work. Each can try to increase performance without considering other’s behavior. It leads total power increase. To solve this problem, we create AMIGO (Advanced Multi-IP Governor). It collects CPU, GPU, and memory controller data and analyzes collected data. It then decides which IP shall be boosted or suppressed to achieve target FPS or optimizes power usages of CPU, GPU, and memory controller. Amigo achieves the game power reduction by 15% on average. With high-performance CPU and GPU, Exynos 1080’s Antutu score is 89% higher than Exynos 980. The smart phones with Exynos 1080 were successfully launched in DEC 2020.","PeriodicalId":246531,"journal":{"name":"2021 IEEE Hot Chips 33 Symposium (HCS)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125269605","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Heterogeneous computing to enable highest level of safety 异构计算以实现最高级别的安全性
2021 IEEE Hot Chips 33 Symposium (HCS) Pub Date : 2021-08-22 DOI: 10.1109/HCS52781.2021.9567602
Ramanujan Venkatadri
{"title":"Heterogeneous computing to enable highest level of safety","authors":"Ramanujan Venkatadri","doi":"10.1109/HCS52781.2021.9567602","DOIUrl":"https://doi.org/10.1109/HCS52781.2021.9567602","url":null,"abstract":"AURIX™ TC4xx offers tremendous computational power boost compared to previous generation deploying new applications with complex computing needs Optimized SoC with high speed connectivity, data routing engine, hypervisor for isolation to enable next generation EE architectures Scalable and flexible Parallel Processing Unit (PPU) enables affordable artificial intelligence with its high performance SIMD architecture Holistic functional safety concept with improved safety mechanisms, Security cluster supporting security standards and with significantly enhanced performance AURIX™ TC4xx offers a scalable platform from low end to high devices enabled with rich software ecosystem to support the next generation of mobility","PeriodicalId":246531,"journal":{"name":"2021 IEEE Hot Chips 33 Symposium (HCS)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132692761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
XeHPC Ponte Vecchio 旧甲板
2021 IEEE Hot Chips 33 Symposium (HCS) Pub Date : 2021-08-22 DOI: 10.1109/HCS52781.2021.9567038
D. Blythe
{"title":"XeHPC Ponte Vecchio","authors":"D. Blythe","doi":"10.1109/HCS52781.2021.9567038","DOIUrl":"https://doi.org/10.1109/HCS52781.2021.9567038","url":null,"abstract":"500X Increase In Compute Performance Scalable Compute & Memory Packaging & Interconnect For Density & Scale Full Software Stack/Programming Model","PeriodicalId":246531,"journal":{"name":"2021 IEEE Hot Chips 33 Symposium (HCS)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133434402","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
EDGE Q 5G with an EDGE EDGE Q 5G带EDGE
2021 IEEE Hot Chips 33 Symposium (HCS) Pub Date : 2021-08-22 DOI: 10.1109/HCS52781.2021.9567324
Sriram Rajagopal
{"title":"EDGE Q 5G with an EDGE","authors":"Sriram Rajagopal","doi":"10.1109/HCS52781.2021.9567324","DOIUrl":"https://doi.org/10.1109/HCS52781.2021.9567324","url":null,"abstract":"- System Architect for Advanced Wireless Systems - 10+ Issued Patents and 5 Conference Publications - Distinguished Engineer at Altiostar Networks - Head of PHY Layer Systems at Beceem Communications - Stanford University (MSEE) | Univ of Madras (BE)","PeriodicalId":246531,"journal":{"name":"2021 IEEE Hot Chips 33 Symposium (HCS)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116549429","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
The ΛNTON 3 ASIC: a Fire-Breathing Monster for Molecular Dynamics Simulations ΛNTON 3 ASIC:用于分子动力学模拟的喷火怪物
2021 IEEE Hot Chips 33 Symposium (HCS) Pub Date : 2021-08-22 DOI: 10.1109/HCS52781.2021.9567084
Peter Adams, Brannon Batson, Alistair Bell, Jhanvi Bhatt, J. A. Butts, Timothy Correia, B. Edwards, Peter Feldmann, Christopher H. Fenton, Anthony Forte, Joseph Gagliardo, Gennette Gill, M. Gorlatova, Brian Greskamp, J. P. Grossman, Jeremy Hunt, B. Jackson, Mollie M. Kirk, J. Kuskin, Roy Mader, R. McGowen, Adam McLaughlin, Mark A. Moraes, Mohamed Nasr, Lawrence J. Nociolo, Lief O'Donnell, A. Parker, Jon L. Peticolas, Terry Quan, T. C. Schwink, Keun Sup Shim, Naseer Siddique, Jochen Spengler, M. Theobald, Brian Towles, Williams Vick, Stanley C. Wang, M. Wazlowski, Madeleine J. Weingarten, J. Williams, David E.Shaw
{"title":"The ΛNTON 3 ASIC: a Fire-Breathing Monster for Molecular Dynamics Simulations","authors":"Peter Adams, Brannon Batson, Alistair Bell, Jhanvi Bhatt, J. A. Butts, Timothy Correia, B. Edwards, Peter Feldmann, Christopher H. Fenton, Anthony Forte, Joseph Gagliardo, Gennette Gill, M. Gorlatova, Brian Greskamp, J. P. Grossman, Jeremy Hunt, B. Jackson, Mollie M. Kirk, J. Kuskin, Roy Mader, R. McGowen, Adam McLaughlin, Mark A. Moraes, Mohamed Nasr, Lawrence J. Nociolo, Lief O'Donnell, A. Parker, Jon L. Peticolas, Terry Quan, T. C. Schwink, Keun Sup Shim, Naseer Siddique, Jochen Spengler, M. Theobald, Brian Towles, Williams Vick, Stanley C. Wang, M. Wazlowski, Madeleine J. Weingarten, J. Williams, David E.Shaw","doi":"10.1109/HCS52781.2021.9567084","DOIUrl":"https://doi.org/10.1109/HCS52781.2021.9567084","url":null,"abstract":"• Understand biomolecular systems through their motions •Numerical integration of Newton's laws of motion — Model atoms as point masses — Compute forces on every atom based on current positions — Update atom velocities and positions in discrete time steps of a few femtoseconds • Force computation described by a model: the force field","PeriodicalId":246531,"journal":{"name":"2021 IEEE Hot Chips 33 Symposium (HCS)","volume":"204 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121114936","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Samsung Neural Processing Unit : An AI accelerator and SDK for flagship mobile AP 三星神经处理单元:旗舰移动AP的AI加速器和SDK
2021 IEEE Hot Chips 33 Symposium (HCS) Pub Date : 2021-08-22 DOI: 10.1109/HCS52781.2021.9567119
Jun-Seok Park, Heonsoo Lee, Dongwook Lee, Jewoo Moon, S. Kwon, Sanghyuck Ha, MinSeong Kim, Ju-ha Park, J. Bang, Sukhwan Lim, Inyup Kang
{"title":"Samsung Neural Processing Unit : An AI accelerator and SDK for flagship mobile AP","authors":"Jun-Seok Park, Heonsoo Lee, Dongwook Lee, Jewoo Moon, S. Kwon, Sanghyuck Ha, MinSeong Kim, Ju-ha Park, J. Bang, Sukhwan Lim, Inyup Kang","doi":"10.1109/HCS52781.2021.9567119","DOIUrl":"https://doi.org/10.1109/HCS52781.2021.9567119","url":null,"abstract":"NPU Scheduler Tiling memory transactions between internal memories and external memories Communicating with AP Host and other processing units","PeriodicalId":246531,"journal":{"name":"2021 IEEE Hot Chips 33 Symposium (HCS)","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126812304","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
New Value Creation by Nano-Tactile Sensor Chip Exceeding our Fingertip Discrimination Ability 超越指尖识别能力的纳米触觉传感芯片创造新价值
2021 IEEE Hot Chips 33 Symposium (HCS) Pub Date : 2021-08-22 DOI: 10.1109/HCS52781.2021.9567179
H. Takao, Kazuki Watatani, Kazutami Arimoto
{"title":"New Value Creation by Nano-Tactile Sensor Chip Exceeding our Fingertip Discrimination Ability","authors":"H. Takao, Kazuki Watatani, Kazutami Arimoto","doi":"10.1109/HCS52781.2021.9567179","DOIUrl":"https://doi.org/10.1109/HCS52781.2021.9567179","url":null,"abstract":"Texture Discrimination and Quantification New Value Creation in Future Applications","PeriodicalId":246531,"journal":{"name":"2021 IEEE Hot Chips 33 Symposium (HCS)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126670895","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Graphcore Graphcore
2021 IEEE Hot Chips 33 Symposium (HCS) Pub Date : 2021-08-22 DOI: 10.1109/HCS52781.2021.9567075
S. Knowles
{"title":"Graphcore","authors":"S. Knowles","doi":"10.1109/HCS52781.2021.9567075","DOIUrl":"https://doi.org/10.1109/HCS52781.2021.9567075","url":null,"abstract":"IPU Foundations • AI is nascent – facilitating exploration is as vital as executing known algorithms. • Tera-scale models will be necessary for “super-human” AI. • Sparse evaluation will be necessary at tera-scale, $text{for} $ $ and Watts. • Rich natural data is sequences, images, and graphs. • Post-Dennard, keep memory and logic close. • Post-Moore, parallel computing over many chips.","PeriodicalId":246531,"journal":{"name":"2021 IEEE Hot Chips 33 Symposium (HCS)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131876288","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 43
Quantum Computing with Atoms 原子量子计算
2021 IEEE Hot Chips 33 Symposium (HCS) Pub Date : 2021-08-22 DOI: 10.1109/HCS52781.2021.9567420
C. Monroe
{"title":"Quantum Computing with Atoms","authors":"C. Monroe","doi":"10.1109/HCS52781.2021.9567420","DOIUrl":"https://doi.org/10.1109/HCS52781.2021.9567420","url":null,"abstract":"The Next Technological Revolution is Quantum Quantum Computers are poised to take over where conventional computers and Moore’s Law leave off. This quantum revolution will touch every sector of the economy.","PeriodicalId":246531,"journal":{"name":"2021 IEEE Hot Chips 33 Symposium (HCS)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122431622","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SM6: A 16nm System-on-Chip for Accurate and Noise-Robust Attention-Based NLP Applications : The 33rd Hot Chips Symposium – August 22-24, 2021 SM6:用于精确和噪声鲁棒的基于注意力的NLP应用的16nm片上系统:第33届热芯片研讨会(2021年8月22-24日
2021 IEEE Hot Chips 33 Symposium (HCS) Pub Date : 2021-08-22 DOI: 10.1109/HCS52781.2021.9567180
Thierry Tambe, En-Yu Yang, Glenn G. Ko, Yuji Chai, Coleman Hooper, M. Donato, P. Whatmough, Alexander M. Rush, D. Brooks, Gu-Yeon Wei
{"title":"SM6: A 16nm System-on-Chip for Accurate and Noise-Robust Attention-Based NLP Applications : The 33rd Hot Chips Symposium – August 22-24, 2021","authors":"Thierry Tambe, En-Yu Yang, Glenn G. Ko, Yuji Chai, Coleman Hooper, M. Donato, P. Whatmough, Alexander M. Rush, D. Brooks, Gu-Yeon Wei","doi":"10.1109/HCS52781.2021.9567180","DOIUrl":"https://doi.org/10.1109/HCS52781.2021.9567180","url":null,"abstract":"In this work, we present SM6, an SoC architecture for real-time denoised speech and NLP pipelines, featuring (1) MSSE: an unsupervised probabilistic sound source separation accelerator, (2) FlexNLP: a programmable inference accelerator for attention-based seq2seq DNNs using adaptive floating-point datatypes for wide dynamic range computations, (3) a dual-core Arm Cortex A53 CPU cluster, which provides on-demand SIMD FFT processing, and operating system support. In adverse acoustic conditions, MSSE allows FlexNLP to store up to 6x smaller ASR models obviating the very inefficient strategy of scaling up the DNN model to achieve noise robustness. MSSE and FlexNLP produce efficiency ranges of 4.33-17.6 Gsamples/s/W and 2.6-7.8TFLOPs/W, respectively, with per-frame end-to-end latencies of 15-45ms.","PeriodicalId":246531,"journal":{"name":"2021 IEEE Hot Chips 33 Symposium (HCS)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125413855","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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