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2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)最新文献

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Case study on the differences between EMI resilience of analog ICs against continuous wave, modulated and transient disturbances 模拟集成电路对连续波、调制和瞬态干扰的电磁干扰弹性差异的实例研究
2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2015-11-01 DOI: 10.1109/EMCCOMPO.2015.7358358
M. Baran, W. Dehaene, H. Pues, K. Stijnen
{"title":"Case study on the differences between EMI resilience of analog ICs against continuous wave, modulated and transient disturbances","authors":"M. Baran, W. Dehaene, H. Pues, K. Stijnen","doi":"10.1109/EMCCOMPO.2015.7358358","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2015.7358358","url":null,"abstract":"Transient disturbance signals are getting more and more attention lately (e.g. in the automotive industry). Electromagnetic compatibility (EMC) at IC level so far focused on continuous wave (CW) disturbances and how to deal with them, but transient phenomena were not thoroughly studied yet. In this exploratory paper, we perform a case study (based on a basic current mirror) in order to reveal the effects of transient disturbances (as compared to CW ones) and to determine what IC design techniques could be used to deal with them.","PeriodicalId":236992,"journal":{"name":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114411608","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Resonance analysis for EMC improvement in integrated circuits 改进集成电路电磁兼容的共振分析
2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2015-11-01 DOI: 10.1109/EMCCOMPO.2015.7358330
Y. Bacher, N. Froidevaux, P. Dupre, H. Braquet, G. Jacquemod
{"title":"Resonance analysis for EMC improvement in integrated circuits","authors":"Y. Bacher, N. Froidevaux, P. Dupre, H. Braquet, G. Jacquemod","doi":"10.1109/EMCCOMPO.2015.7358330","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2015.7358330","url":null,"abstract":"To be compliant with electromagnetic compatibility standards, integrated circuits such as microcontrollers have to be robust to fast transient burst tests. Because of high voltage and fast transient voltage variations used no measurement is possible during the stress. Lack of information makes the debug of a product a real challenge. The objective of this work is to provide a measurement method which permits to have more information on the stress propagation on the power supply network. The methodology applied here on fast transient burst test could be extended to other kind of stress on power supply.","PeriodicalId":236992,"journal":{"name":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130664711","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Time-domain EMI measurement methodology 时域电磁干扰测量方法
2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2015-11-01 DOI: 10.1109/EMCCOMPO.2015.7358352
Shih-Yi Yuan, Ting-Wei Yeh, Y. Tang, Chiu-Kuo Chen
{"title":"Time-domain EMI measurement methodology","authors":"Shih-Yi Yuan, Ting-Wei Yeh, Y. Tang, Chiu-Kuo Chen","doi":"10.1109/EMCCOMPO.2015.7358352","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2015.7358352","url":null,"abstract":"With substantial progress in Internet of things (IoT), new challenges of EMI on IoT (IoT-EMI) measurement have emerged. The IoT-EMI behaviors are complex and dependent on the target's interactions between hardware and software. A systematic method for IoT-EMI measurement should be developed. However, the characteristics of IoT-EMI are digitally-controlled, time-varying, and software-dependent and make the IoT-EMI measurements difficult by conventional method. This paper proposes a time-domain measurement method for such issue. This method uses a `timestamp' by SW/HW-co-measurement strategy to analysis IoT-EMI behaviors. From the measurement result, the long-term measurements are comparable to the conventional SA measurements. And the software-related IoT-EMI results show tremendous differences - about 5-50 dBuV differences among different application programs are observed. To the best of the authors' knowledge, the software-dependent IoT-EMI behaviors are firstly observed and published.","PeriodicalId":236992,"journal":{"name":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125461995","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Examination of different adder structures concerning di/dt in a 180nm technology 180nm工艺中不同di/dt加法器结构的研究
2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2015-11-01 DOI: 10.1109/EMCCOMPO.2015.7358339
Andreas Rauchenecker, T. Ostermann
{"title":"Examination of different adder structures concerning di/dt in a 180nm technology","authors":"Andreas Rauchenecker, T. Ostermann","doi":"10.1109/EMCCOMPO.2015.7358339","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2015.7358339","url":null,"abstract":"In the presented paper we examine and compare different adder structures for their EMC behavior. On the one hand the analysis is carried out for different topologies as Ripple Carry Adder and Kogge Stone Adder. And on the other hand these topologies are realized in different logic styles as standard CMOS, complementary pass transistor logic, buffered NMOS pass transistor and complementary buffered NMOS pass transistor logic. All these variations are compared over di/dt, power consumption, speed / performance and transistor count. Additionally a new topology for the Kogge Stone Adder is introduced.","PeriodicalId":236992,"journal":{"name":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131806542","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Relation between internal terminal voltage and immunity behavior of LDO regulator circuits LDO稳压电路内端电压与抗扰度的关系
2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2015-11-01 DOI: 10.1109/EMCCOMPO.2015.7358346
Hidetoshi Miyahara, Nobuaki Ikehara, T. Matsushima, T. Hisakado, O. Wada
{"title":"Relation between internal terminal voltage and immunity behavior of LDO regulator circuits","authors":"Hidetoshi Miyahara, Nobuaki Ikehara, T. Matsushima, T. Hisakado, O. Wada","doi":"10.1109/EMCCOMPO.2015.7358346","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2015.7358346","url":null,"abstract":"Because predicting undesired behaviors in IC (Integrated Circuit) due to conducted electromagnetic disturbances is necessary for front-loading the design process, immunity models are becoming more important to predict a malfunction at the design stage of electronic products. In this paper, the failure to function mechanism in a LDO (Low Dropout) voltage regulator is investigated from the aspect of the internal terminal in a circuit. Simulations confirm a relation between the internal reference voltage and the DC shift error at certain frequencies. Thus, monitoring the voltage or current at an internal terminal between functional blocks gives useful information about an IC model to predict immunity.","PeriodicalId":236992,"journal":{"name":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127681996","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Simulation of radiated emission during the design phase based on scattering parameter measurement 基于散射参数测量的设计阶段辐射发射仿真
2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2015-11-01 DOI: 10.1109/EMCCOMPO.2015.7358362
H. Hackl, G. Winkler, B. Deutschmann
{"title":"Simulation of radiated emission during the design phase based on scattering parameter measurement","authors":"H. Hackl, G. Winkler, B. Deutschmann","doi":"10.1109/EMCCOMPO.2015.7358362","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2015.7358362","url":null,"abstract":"As the electromagnetic compatibility (EMC) of IC products takes on greater significance for competitiveness, IC manufacturers are increasingly interested in evaluating the EMC performance of their products as soon as during the very first design phase without the need of prototypes. There are a number of approaches to predict radiated emissions of automotive components as defined in the CISPR25 standard. However, it can be concluded that none of them are suitable for continuous use by the circuit designer itself because they either need a manufactured prototype and a lab engineer, or lots of simulation time and resources. The designer is normally no EMC expert and does not want to deal with additional, complex simulation tools. This paper presents the generation and use of a simulation model which can easily be implemented in the design environment (e.g. Cadence Virtuoso) used by the designer and does not notably increase the simulation time. The transient data is post-processed with a Matlab script emulating an EMI test receiver.","PeriodicalId":236992,"journal":{"name":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125525461","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
ESD test at component level 元器件级ESD测试
2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2015-11-01 DOI: 10.1109/EMCCOMPO.2015.7358348
Lars Glaesser, S. Koenig
{"title":"ESD test at component level","authors":"Lars Glaesser, S. Koenig","doi":"10.1109/EMCCOMPO.2015.7358348","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2015.7358348","url":null,"abstract":"Apart from ESD tests at system level, e.g. according to IEC 61000-4-2, the investigation of the EMC immunity of individual ICs is becoming increasingly important: an ESD sensitive IC could cause problems in subsequent system level tests when in use. Knowing in advance what to expect from an IC can help save time and money in the design process. An appropriate component level test bench is therefore required. Using standard ESD generators (system level test methods) for component level tests can lead to unexpected results. This paper describes problems that can arise when using standard ESD generators in a customised test set-up whereby a microcontroller is used as a DUT (the tested IC) for demonstration purposes.","PeriodicalId":236992,"journal":{"name":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131465182","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Ageing effects on power RF LDMOS reliability using the Transmission Line Matrix method 传输线矩阵法研究老化对功率RF LDMOS可靠性的影响
2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2015-11-01 DOI: 10.1109/EMCCOMPO.2015.7358349
Ahmed Aldabbagh, A. Duffy
{"title":"Ageing effects on power RF LDMOS reliability using the Transmission Line Matrix method","authors":"Ahmed Aldabbagh, A. Duffy","doi":"10.1109/EMCCOMPO.2015.7358349","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2015.7358349","url":null,"abstract":"In this paper, the Transmission Line Matrix (TLM) method is used to study the electro-thermal performance degradation in RF LDMOS (Radio Frequency - Laterally Diffused Metal Oxide Semiconductor) transistors, through Thermal Cycling Test (TCT), as the temperature is a crucial parameter in RF devices. A hybrid approach is presented, which combines the modelling of thermal diffusion and electric effects within a two dimensional TLM model to observe the device behaviour after simulated ageing, through including the ageing loop in a unified solver. Two sets of test results are compared with published data in order to verify the performance of the proposed hybrid solver. The work shows the suitability of using the TLM to model ageing phenomenon in MOS devices.","PeriodicalId":236992,"journal":{"name":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115379269","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit 用于控制电路的PWM模式的热电磁磁化率特性
2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2015-11-01 DOI: 10.1109/EMCCOMPO.2015.7358355
J. Dienot, E. Batista, I. Ramos
{"title":"Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit","authors":"J. Dienot, E. Batista, I. Ramos","doi":"10.1109/EMCCOMPO.2015.7358355","DOIUrl":"https://doi.org/10.1109/EMCCOMPO.2015.7358355","url":null,"abstract":"With constraints for high-level integration of electronics, new EMC behaviors have to be considered to prevent real electromagnetic compliance. Especially, in embedded and on-board device's context, environmental temperature has an influence on the circuit behavior and EMC figures. This paper deals with susceptibility studies combined with temperature effects on electronic devices used to control power and transmissions. Specific dual thermal-electromagnetic test set-up developed for this are presented. Main results of an experimental campaign on digital PCB dedicated for generation of Pulse Width Modulation (PWM) patterns are presented. Temperature dependant susceptibility and sensitivity of the PWM parameters are compared and analyzed.","PeriodicalId":236992,"journal":{"name":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121137348","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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