180nm工艺中不同di/dt加法器结构的研究

Andreas Rauchenecker, T. Ostermann
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引用次数: 2

摘要

在本文中,我们研究并比较了不同加法器结构的电磁兼容性能。一方面对不同的拓扑结构进行了纹波进位加法器和Kogge Stone加法器的分析。另一方面,这些拓扑结构以不同的逻辑风格实现,如标准CMOS、互补通型晶体管逻辑、缓冲NMOS通型晶体管和互补缓冲NMOS通型晶体管逻辑。所有这些变化都是通过di/dt、功耗、速度/性能和晶体管数量进行比较的。此外,还介绍了Kogge石加法器的新拓扑结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Examination of different adder structures concerning di/dt in a 180nm technology
In the presented paper we examine and compare different adder structures for their EMC behavior. On the one hand the analysis is carried out for different topologies as Ripple Carry Adder and Kogge Stone Adder. And on the other hand these topologies are realized in different logic styles as standard CMOS, complementary pass transistor logic, buffered NMOS pass transistor and complementary buffered NMOS pass transistor logic. All these variations are compared over di/dt, power consumption, speed / performance and transistor count. Additionally a new topology for the Kogge Stone Adder is introduced.
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