{"title":"Investigation of the Interaction Between Cu2-x S +So Coatings and Pd(II) Ions by Cyclic Voltammetry and X-ray Photoelectron Spectroscopy","authors":"J. Vinkevičius, I. Mozginskiene, V. Jasulaitienė","doi":"10.1080/00202967.1999.11871291","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871291","url":null,"abstract":"The interaction between Pd 2+ ions and Cu 2-x S coating formed by three cycles and containing ∼30 at.% of elementary S has been investigated by the methods of cyclic voltammetry and photoelectron spectroscopy (one cycle of coating formation includes treatment of the surface with Cu(I)+Cu(II) ammoniate solution, hydrolysis of the adsorbed copper compounds and sulphidation of copper oxygen compounds in Na 2 S n solution). After exposure of such a coating to Pd 2+ ions (1.7 mM PdCl 2 , pH=2), an exchange as well as a redox interaction between the coating components and Pd 2+ ions has been shown to occur Due to this the amount of copper in the coating decreases from 2 to 4 times and that ofsulphur from 1.5 to 5 times. The coating modified in such a way has been found to contain up to 75 at.% of palladium, ∼90% of it being in a metallic state. It has been determined that at the beginning S 0 is bound into a soluble compound: 2Pd 2+ + S 0 + 3H 2 O → 2Pd 0 + H 2 SO 3 + 4H + . The Cu 2 S present in the coating is considered to interact with Pd 2+ , with the formation of Pd 0 and CuPdS 2 , while CuS reacts most likely according to the reaction: CuS + 3Pd 2+ + 3H 2 O → 3Pd 0 + H 2 SO 3 + Cu 2+ + 4H + . The Cu 2-x S + S 0 coating formed on a dielectric and modified with Pd 2+ , contrary to the initial Cu 2-x S + S 0 coating, can be plated with copper from any electrolyte for copper deposition.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":"266 1","pages":"237-241"},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871291","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58743530","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Preparation and characterization of Cu-MoSi2 composite coatings","authors":"Y. Wan, Y. L. Wang, H. Tao, G. Cheng, X. Dong","doi":"10.1080/00202967.1999.11871245","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871245","url":null,"abstract":"Cu-MoSi 2 composite coatings were obtained by an electrodeposition technique from a conventional acid copper sulfate bath. The effects of plating variable, such as particle concentration in the bath, cathode current density, stir rate and stir type on particle content in the composite coatings (Vp) were between Vp and stir rate, particle concentration in the bath and current density were related to the nature of incorporated particles (the density and electrical resistivity). Moreover, stir type showed a great effect on Vp of Cu-MoSi 2 . The codeposition rate and internal stress of Cu-MoSi 2 composite coatings were greatly influenced by plating variables. The physicomechanical properties electrical resistivity, hardness and wear resistance of Cu-MoSi 2 and Cu-Al 2 O 3 were determined. It was established that microhardness and wear resistance increased with the increase of Vp for both Cu-MoSi 2 and Cu-Al 2 O 3 . The hardness and electrical resistivity of Cu-MoSi 2 were lower compared with Cu-Al 2 O 3 . However, it was more abrasive than Cu-Al 2 O 3 .","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":"77 1","pages":"52-54"},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871245","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58741750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Hydraulic bulge test of electrodeposited copper foil","authors":"H. D. Merchant, M. G. Rozboril","doi":"10.1080/00202967.1999.11871247","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871247","url":null,"abstract":"The 18 pm to 72 μ thick commercial electrodeposited copper foils GR I and GR 3, the experimentalfoil TCAM and the commercial rolled foil GR 8 are tested in bulge and in tension at temperatures up t...","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":"179 1","pages":"55-59"},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871247","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742343","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Application of Silane Technology to Prevent Corrosion of Metals and Improve Paint Adhesion","authors":"T. Child, W. V. Ooij","doi":"10.1080/00202967.1999.11871249","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871249","url":null,"abstract":"Environmental, safety and cost issues surrounding the continued use of chromates have led to increased R&D activities to find alternative materials. Recent developments in the application of silane...","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":"77 1","pages":"64-70"},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871249","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742411","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"An expert system to identify anodic coating process defects. Part 2 : Compiling the hypertext database","authors":"A. Brace","doi":"10.1080/00202967.1999.11871264","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871264","url":null,"abstract":"The advantages of using a neural networks program for the identification of anodic coating process defects has been detailed in Part I of this paper. Having identified the defect it was considered desirable to develop a database which would provide information on the causes of defects, advise on corrective measures, include a relevant bibliography and be able to provide a graphics display of the defect where applicable. After illustrating some of the earlier databases the advantages of using a program containing a hypertext facility has been demonstrated and possible further development of the system is discussed.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":"77 1","pages":"120-122"},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871264","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742620","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Electrochemical cell reactions","authors":"F. Walsh, G. Ottewill","doi":"10.1080/00202967.1999.11871275","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871275","url":null,"abstract":"","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":"77 1","pages":"169-170"},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871275","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742847","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Novel Room Temperature Molten Salts for Aluminium Electrodeposition","authors":"A. Abbott, C. Eardley, N. Farley, A. Pratt","doi":"10.1080/00202967.1999.11871238","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871238","url":null,"abstract":"SUMMARYThis work describes novel room temperature molten salts which can be used for aluminium electrodeposition. We have characterised the conductivity as a function of the bath composition and shown that the changes in conductivity occur because of an equilibrium between [Al2Cl7] and [AlCl2 The voltammetry of the optimum melt is analysed together with the mechanism of nucleation. Hull cell tests were performed and the morphology of the deposits was analysed using scanning electron microscopy. These room temperature molten salts have a number of advantages over those described in the literature including lower water sensitivity, greater ease of purification and greatly reduced cost. The electrodeposition of adherent, dull aluminium is demonstrated. It is also shown that soluble aluminium anodes can be used. These novel baths form a viable alternative to conventional methods of depositing aluminium.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":"77 1","pages":"26-28"},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871238","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58741897","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Studies of Electroless Nickel Deposits with Low Phosphorus Content","authors":"Y. Zhang, M. Yao","doi":"10.1080/00202967.1999.11871252","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871252","url":null,"abstract":"SUMMARYA useful coating technology for electroless Ni-1.5wt%P has been developed. The bath can work normally for more than 5 turnovers with a plating rate of 20 μm/h. In the as-deposited condition, Ni-1.5wt%P deposit is a supersaturated solid solution of P dissolved in a nanocrystalline Ni matrix with a grain size of several nanometers. The microstructure transformed into a larger grain size Ni matrix with dispersive Ni3P precipitates with increasing the heat treatment temperature. Ni-1.5wt%P deposit possesses as-deposited hardness and wear resistance superior to Ni-10.5wt%P deposit. The microhardness and wear resistance can be further improved by proper heat treatment. The optimum wear resistance of Ni-1.5wt%P deposit corresponds to its peak hardness (annealing at 375°C for 1 h), whereas for Ni-10.5wt%P deposit the optimum wear resistance is obtained after annealing at 650°C for 1 h. Ni-1.5wt%Ppossesses a corrosion resistance in NaOH solution superior to conventional medium and high phosphorus deposits, ...","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":"77 1","pages":"78-83"},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871252","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742582","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"An Electrochemical Evaluation of Possible Non-Chromate Conversion Coating Treatments for Electrodeposited Zinc-Nickel Alloys","authors":"J. Wharton, G. Wilcox, K. R. Baldwin","doi":"10.1080/00202967.1999.11871272","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871272","url":null,"abstract":"A number of possible non-chromate conversion coating formulations have been studied to examine their efficacy as replacements for chromate-based coating treatments on electrodeposited zinc-nickel alloys. Data have been collected from both electrochemical and conventional salt fog corrosion tests. In the latter tests all the alternative non-chromate systems studied delayed the onset of the corrosion of the zinc-nickel coating itself but only the simple molybdate and the permanganate/molybdate dual treatment brought about improvements in times to red rusting of the steel substrate. The electrochemical evaluations suggested that simple molybdate-treated surfaces act as only moderate barriers to the chloride environments. Of the two dual treatments, permanganate/molybdate behaved similarly to the simple molybdate treated surfaces in the electrochemical tests, but the molybdate/permanganate was more protective, although this was not exhibited in the salt fog corrosion tests.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":"77 1","pages":"152-158"},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871272","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742831","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Ling Huang, J. Dong, Fang-Zu Yang, Shukai Xu, Sm Zhou
{"title":"Studies on the Mechanism, Structure and Microhardness of Ni-W Alloy Electrodeposits","authors":"Ling Huang, J. Dong, Fang-Zu Yang, Shukai Xu, Sm Zhou","doi":"10.1080/00202967.1999.11871279","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871279","url":null,"abstract":"SUMMARYThe electrodeposition of Ni-W alloy has been studied on the glassy carbon electrode by the cyclic voltammetry and potentiostatic step methods. It has been found that electrodeposition of Ni-W alloy involves an intermediate valence tungsten oxide which inhibits hydrogen evolution. Ni-W alloy electrodeposition occurs by a mechanism involving progressive nucleation followed by three dimensional growth.The structures of nickel-tungsten alloy deposits were analyzed by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). The XRD results from Ni-W alloy deposits reveal a face-centered cubic solid solution, the microstructure of the deposits exhibit (111) preferred orientation. The lattice constant and microhardness of Ni-W alloy deposit increase as the tungsten content increases, the XPS results of Ni-W alloy deposits indicate that the nickel and tungsten of the deposits exist in the metallic state, but the Ni-W alloy deposit with a tungsten content of 40.7% is an intermetallic compound. Th...","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":"33 1","pages":"185-187"},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871279","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742975","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}