低磷化学镀镍的研究

IF 1.2 4区 材料科学 Q4 ELECTROCHEMISTRY
Y. Zhang, M. Yao
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引用次数: 22

摘要

开发了一种实用的化学镀Ni-1.5wt%P涂层技术。镀液可正常工作5次以上,电镀速率可达20 μm/h。在沉积状态下,Ni-1.5wt%P沉积是P的过饱和固溶体,溶解在晶粒尺寸为几纳米的纳米晶Ni基体中。随着热处理温度的升高,微观组织转变为晶粒尺寸较大的Ni基体,析出弥散的Ni3P相。Ni-1.5wt%P沉积层的硬度和耐磨性优于Ni-10.5wt%P沉积层。通过适当的热处理,可进一步提高显微硬度和耐磨性。Ni-1.5wt%P镀层的最佳耐磨性对应于其峰值硬度(在375°C退火1 h),而Ni-10.5wt%P镀层的最佳耐磨性是在650°C退火1 h后获得的。Ni-1.5wt%P镀层在NaOH溶液中的耐腐蚀性优于传统的中磷和高磷镀层。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Studies of Electroless Nickel Deposits with Low Phosphorus Content
SUMMARYA useful coating technology for electroless Ni-1.5wt%P has been developed. The bath can work normally for more than 5 turnovers with a plating rate of 20 μm/h. In the as-deposited condition, Ni-1.5wt%P deposit is a supersaturated solid solution of P dissolved in a nanocrystalline Ni matrix with a grain size of several nanometers. The microstructure transformed into a larger grain size Ni matrix with dispersive Ni3P precipitates with increasing the heat treatment temperature. Ni-1.5wt%P deposit possesses as-deposited hardness and wear resistance superior to Ni-10.5wt%P deposit. The microhardness and wear resistance can be further improved by proper heat treatment. The optimum wear resistance of Ni-1.5wt%P deposit corresponds to its peak hardness (annealing at 375°C for 1 h), whereas for Ni-10.5wt%P deposit the optimum wear resistance is obtained after annealing at 650°C for 1 h. Ni-1.5wt%Ppossesses a corrosion resistance in NaOH solution superior to conventional medium and high phosphorus deposits, ...
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来源期刊
Transactions of The Institute of Metal Finishing
Transactions of The Institute of Metal Finishing 工程技术-材料科学:膜
CiteScore
3.40
自引率
10.50%
发文量
62
审稿时长
3 months
期刊介绍: Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.
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