Studies on the Mechanism, Structure and Microhardness of Ni-W Alloy Electrodeposits

IF 1.2 4区材料科学 Q4 ELECTROCHEMISTRY

Transactions of The Institute of Metal Finishing Pub Date : 1999-01-01 DOI:10.1080/00202967.1999.11871279

Ling Huang, J. Dong, Fang-Zu Yang, Shukai Xu, Sm Zhou

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引用次数: 16

Abstract

SUMMARYThe electrodeposition of Ni-W alloy has been studied on the glassy carbon electrode by the cyclic voltammetry and potentiostatic step methods. It has been found that electrodeposition of Ni-W alloy involves an intermediate valence tungsten oxide which inhibits hydrogen evolution. Ni-W alloy electrodeposition occurs by a mechanism involving progressive nucleation followed by three dimensional growth.The structures of nickel-tungsten alloy deposits were analyzed by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). The XRD results from Ni-W alloy deposits reveal a face-centered cubic solid solution, the microstructure of the deposits exhibit (111) preferred orientation. The lattice constant and microhardness of Ni-W alloy deposit increase as the tungsten content increases, the XPS results of Ni-W alloy deposits indicate that the nickel and tungsten of the deposits exist in the metallic state, but the Ni-W alloy deposit with a tungsten content of 40.7% is an intermetallic compound. Th...

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Ni-W合金镀层的机理、组织和显微硬度研究

摘要采用循环伏安法和恒电位步进法研究了Ni-W合金在玻碳电极上的电沉积。发现镍钨合金的电沉积过程中含有抑制析氢的中间价氧化钨。Ni-W合金电沉积的发生机制是渐进形核和三维生长。采用x射线衍射(XRD)和x射线光电子能谱(XPS)分析了镍钨合金镀层的结构。Ni-W合金镀层的XRD分析结果表明，Ni-W合金镀层为面心立方固溶体，其显微组织表现为(111)择优取向。Ni-W合金镀层的晶格常数和显微硬度随钨含量的增加而增加，镍- w合金镀层的XPS结果表明，镀层中的镍和钨以金属态存在，而钨含量为40.7%的Ni-W合金镀层为金属间化合物。Th……

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来源期刊

Transactions of The Institute of Metal Finishing 工程技术-材料科学：膜

CiteScore

3.40

自引率

10.50%

发文量

审稿时长

3 months

期刊介绍： Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.