Tribology International最新文献_第2页

Vibration induced multiscale damage mechanism of BPP: From interfacial electron transfer distortion to surface thermal ablation 振动诱导BPP的多尺度损伤机理：从界面电子转移畸变到表面热烧蚀

IF 6.1 1区工程技术

Tribology International Pub Date : 2025-05-19 DOI: 10.1016/j.triboint.2025.110816

Xinyuan Cai , Dong Guan , Chun Zhang , Jianxing Zhou , Ting Chen , Zhen Chen

{"title":"Vibration induced multiscale damage mechanism of BPP: From interfacial electron transfer distortion to surface thermal ablation","authors":"Xinyuan Cai , Dong Guan , Chun Zhang , Jianxing Zhou , Ting Chen , Zhen Chen","doi":"10.1016/j.triboint.2025.110816","DOIUrl":"10.1016/j.triboint.2025.110816","url":null,"abstract":"<div><div>Surface fretting corrosion of the bipolar plate (BPP) impacts power density, efficiency, and durability of fuel cell. Traditional research focuses on surface coatings, while the significant degeneration of BPP surface due to road vibration is rarely considered. In this paper, a test bench is designed and fabricated to investigate the electrical contact of BPP interface, the contact vibration, current and interface force are regulated respectively, to obtain their impacts on performance degeneration of BPP. Results indicate the BPP surface temperature increases rapidly under 1 Hz vibration, which is close the fuel cell vibration under road operation, while the surface heat increases slowly under high frequency, high interface pressure and lower surface current density. Furthermore, the variation principle of surface contact resistance is analyzed, based on surface erosion characterization. And the erosion evolution mechanism is characterized and deduced. This investigation can provide a theoretical foundation and scientific evidence for inhibiting dynamic damage of the bipolar plate interface.</div></div>","PeriodicalId":23238,"journal":{"name":"Tribology International","volume":"210 ","pages":"Article 110816"},"PeriodicalIF":6.1,"publicationDate":"2025-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144134622","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Wear protection of extreme pressure/anti wear additives influenced by corrosion inhibitors in oil-lubricated rolling bearings 缓蚀剂对油润滑滚动轴承极压/抗磨添加剂磨损保护的影响

IF 6.1 1区工程技术

Tribology International Pub Date : 2025-05-19 DOI: 10.1016/j.triboint.2025.110807

Merle Reimers , Silvia Richter , Marius Bürger , Georg Jacobs , Florian König

引用次数: 0

Numerical investigation on pulling force and residual stresses in split-sleeve cold expansion of 2024-T3 aluminium alloy holes using a variable friction model 基于变摩擦模型的2024-T3铝合金孔裂套冷胀拉拔力和残余应力数值研究

IF 6.1 1区工程技术

Tribology International Pub Date : 2025-05-18 DOI: 10.1016/j.triboint.2025.110811

Pardeep Pankaj , Jeremiah Westrum , Hua Tan , Dave Kim

{"title":"Numerical investigation on pulling force and residual stresses in split-sleeve cold expansion of 2024-T3 aluminium alloy holes using a variable friction model","authors":"Pardeep Pankaj , Jeremiah Westrum , Hua Tan , Dave Kim","doi":"10.1016/j.triboint.2025.110811","DOIUrl":"10.1016/j.triboint.2025.110811","url":null,"abstract":"<div><div>Three-dimensional elastic-plastic finite element (FE) simulations were conducted to examine the effect of friction models on the performance of the split-sleeve cold expansion process for 2024-T3 aluminium (Al) alloy. To accurately capture the tribological interaction of the MoS<sub>2</sub>-based solid lubricant between the mandrel and sleeve, we integrated an empirically derived, contact-pressure-dependent variable friction model into the FE framework. A constant friction coefficient of 0.05 was applied for comparison. For each friction model, response surface analysis was performed using FE simulation results to systematically assess the effects of the cold expansion percentage and workpiece thickness on mandrel pulling force and residual stress fields around the cold-expanded holes. Split-sleeve cold expansion experiments, resulting in aluminium holes with a final diameter of 5.896 mm, were conducted for validation. Our comparative analysis shows that the variable friction model predicts mandrel pulling peak forces with errors within 10 % of the experimental values, whereas the constant friction model yields errors ranging from 11 % to 42 %. The variable friction model effectively captures the tribological behavior of the solid lubricant by accounting for the reduction in friction coefficient at the mandrel-sleeve interface as the mandrel passes through the aluminium hole under increasing contact pressure. The hole diameter estimates obtained using the variable friction model closely match experimental measurements, whereas the constant friction model overestimates hole diameters.</div></div>","PeriodicalId":23238,"journal":{"name":"Tribology International","volume":"210 ","pages":"Article 110811"},"PeriodicalIF":6.1,"publicationDate":"2025-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144134628","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Insight into the atomic-scale material removal of 4H-SiC electrochemical mechanical polishing (ECMP) using graphene oxide 利用氧化石墨烯去除4H-SiC电化学机械抛光（ECMP）的原子级材料

IF 6.1 1区工程技术

Tribology International Pub Date : 2025-05-16 DOI: 10.1016/j.triboint.2025.110803

Zirui Wang , Yuguang Zhu , Ronghao Ren , Tianyu Zhang , Yang Peng , Yongguang Wang , Xiaolong Lu , Chuanyang Wang

{"title":"Insight into the atomic-scale material removal of 4H-SiC electrochemical mechanical polishing (ECMP) using graphene oxide","authors":"Zirui Wang , Yuguang Zhu , Ronghao Ren , Tianyu Zhang , Yang Peng , Yongguang Wang , Xiaolong Lu , Chuanyang Wang","doi":"10.1016/j.triboint.2025.110803","DOIUrl":"10.1016/j.triboint.2025.110803","url":null,"abstract":"<div><div>Silicon carbide (SiC), owing to its excellent properties and extensive application, has been regarded as a promising semiconductor material. Nevertheless, due to the high hardness and chemical inertness of 4H-SiC, the improvement in the polishing efficiency remains a significant challenge for the industry. An ultra-precision polishing approach of electrochemical mechanical polishing (ECMP) by using the slurry, which contained the diamond abrasives and graphene oxide (GO), was presented. The single crystal 4H-SiC wafers were processed with ECMP using the slurry of 1 wt% diamond+ 0/0.25/0.5/0.75/1 wt% GO+ 1 wt% NaCl+ deionized water. Furthermore, the SiC-ECMP performance of material removal rate (<em>MRR</em>) and surface roughness (<em>R</em><sub>a</sub>) was investigated. In addition, the atomic force microscopy (AFM) morphologies of the pre-ECMP and post-ECMP 4H-SiC wafers were observed, respectively. The characteristics of ECMP slurry were conducted as well. The optimized SiC-ECMP process achieved an <em>MRR</em> of 2.32 μm/h and a <em>R</em><sub>a</sub> of 0.287 nm, demonstrating the feasibility of implementing an eco-friendly polishing process through precise control of slurry composition (diamond abrasives+ GO). This combination enables high-efficiency material removal and atomic-level surface quality while maintaining the environmental sustainability. This study offers a useful exploration in revealing the SiC-ECMP material removal mechanisms with the help of molecular dynamics (MD) simulations.</div></div>","PeriodicalId":23238,"journal":{"name":"Tribology International","volume":"210 ","pages":"Article 110803"},"PeriodicalIF":6.1,"publicationDate":"2025-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144099831","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Frictional property of anionic-surfactant-loaded MgAl-layered double hydroxide films on aluminum alloy using a ring compression test 阴离子表面活性剂负载mgal层状双氢氧化物膜在铝合金上的摩擦性能

IF 6.1 1区工程技术

Tribology International Pub Date : 2025-05-16 DOI: 10.1016/j.triboint.2025.110810

Satoru Fukugaichi , Yusuke Suga , Sota Noura , Kazuhiro Takeyama , Kazuhiko Kitamura , Hiromichi Aono

引用次数: 0

Superlubricity in dry rolling-sliding contacts with amorphous carbon film 非晶碳膜干滚滑接触的超润滑性

IF 6.1 1区工程技术

Tribology International Pub Date : 2025-05-16 DOI: 10.1016/j.triboint.2025.110809

Hongzhan Chen , Chengjun Huang , Xin Tang , Quansheng Ma , Shaobo Gao , Shang Li , Yuqing Fan , Jie Jin , Tianbao Ma

引用次数: 0

A comment on “In-situ pressure and temperature measurements under mixed friction in rolling contacts and comparison with TEHD simulations” 对“滚动接触中混合摩擦的地压和温度测量及其与TEHD模拟的比较”的评论

IF 6.1 1区工程技术

Tribology International Pub Date : 2025-05-15 DOI: 10.1016/j.triboint.2025.110801

Scott Bair

引用次数: 0

Influence of weld parameters on the tribocorrosion behaviour of friction stir welded AA5052 in the marine environment 焊接参数对AA5052搅拌摩擦焊在海洋环境中摩擦腐蚀行为的影响

IF 6.1 1区工程技术

Tribology International Pub Date : 2025-05-15 DOI: 10.1016/j.triboint.2025.110808

G S Anantharam , Kunal Bhalchandra Bhole , Basil Kuriachen , Shashi Bhushan Arya

引用次数: 0

Influence of laser-induced discrete hardening units on gear surface fatigue resistance: Investigation from contact behavior and lubrication state 激光诱导离散硬化单元对齿轮表面抗疲劳性能的影响：基于接触行为和润滑状态的研究

IF 6.1 1区工程技术

Tribology International Pub Date : 2025-05-15 DOI: 10.1016/j.triboint.2025.110797

Yifan Wei , Yuyang He , Zehui Gu , Jinghu Ji , Yonghong Fu

引用次数: 0

Anisotropy dependence of chip formation and plastic deformation in Fe-25Cr-20Ni austenitic stainless steel during micro-scratching Fe-25Cr-20Ni奥氏体不锈钢微刮伤过程中切屑形成和塑性变形的各向异性依赖性

IF 6.1 1区工程技术

Tribology International Pub Date : 2025-05-14 DOI: 10.1016/j.triboint.2025.110799

Beibei Lv , Qinglong Chen , Yunjie Li , Fangyuan Wang , Yulong Zhang , Jie Han , Zhengyi Jiang , Wenzhen Xia

{"title":"Anisotropy dependence of chip formation and plastic deformation in Fe-25Cr-20Ni austenitic stainless steel during micro-scratching","authors":"Beibei Lv , Qinglong Chen , Yunjie Li , Fangyuan Wang , Yulong Zhang , Jie Han , Zhengyi Jiang , Wenzhen Xia","doi":"10.1016/j.triboint.2025.110799","DOIUrl":"10.1016/j.triboint.2025.110799","url":null,"abstract":"<div><div>The wear characteristics of the tribological pair and the mechanisms of material removal are significantly influenced by the plastic deformation of the contact surface during the tribological process of metallic materials. Chip formation is recognized as one of the primary mechanisms contributing to material loss during the wear process. However, the underlying mechanisms governing chip formation remain incompletely elucidated. This paper employs micro-scratch testing to investigate the wear behavior of the {001}, {101}, and {111} grains in austenitic stainless steel under varying scratch directions and applied loads. The transition from initial indentation contact to plowing and subsequent chip formation is systematically examined, revealing the influence of crystallographic orientation and scratch direction on chip formation mechanisms. Our results demonstrate that the chip formation and plastic deformation exhibit substantial dependence on crystallographic orientation and scratch direction, which are closely associated with the activation of specific slip systems within the grains. The depth profile within the worn track and the surface topography surrounding it have a major impact on the frictional response and chip formation process. A critical depth for chip formation is identified under specific loading conditions, below which chip formation is more likely to occur. This research provides valuable insights into the micro-scale tribological behavior of face-centered cubic metallic materials, offering a theoretical foundation for optimizing material properties, enhancing wear resistance, and prolonging service life in engineering applications.</div></div>","PeriodicalId":23238,"journal":{"name":"Tribology International","volume":"210 ","pages":"Article 110799"},"PeriodicalIF":6.1,"publicationDate":"2025-05-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144134621","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0