2017 IEEE CPMT Symposium Japan (ICSJ)最新文献

Low loss multimode polymer shuffling optical waveguide for high-density optical circuit 用于高密度光电路的低损耗多模聚合物洗牌光波导

2017 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2017-12-26 DOI: 10.1109/ICSJ.2017.8240138

Kohei Abe, T. Ishigure

引用次数: 1

Low temperature, low pressure, fluxless and plateless Cu-Cu bonding by Cu nano particle transient liquid phase sintering 低温、低压、无焊剂、无板的Cu-Cu纳米颗粒瞬态液相烧结技术

2017 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2017-12-26 DOI: 10.1109/ICSJ.2017.8240132

Takehiro Yamamoto, M. K. Faiz, T. Suga, T. Miyashita, M. Yoshida

引用次数: 0

Time evolution of strain distribution under bonding pad during ultrasonic wire-bonding at 200°C 200℃下超声焊线焊垫下应变分布的时间演化

2017 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2017-12-26 DOI: 10.1109/ICSJ.2017.8240137

M. Sakamoto, Kenichi Nakadozono, K. Iwanabe, T. Asano

引用次数: 1

3-Dimensionally crossed polymer optical waveguide with GI circular core using the mosquito method 用蚊形法制备GI圆芯三维交叉聚合物光波导

2017 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2017-12-26 DOI: 10.1109/ICSJ.2017.8240109

O. F. Rasel, T. Ishigure

引用次数: 2

Accurate core alignment technique in the mosquito method for realizing 3-dimensional optical wiring 实现三维光学布线的蚊法精确芯对准技术

2017 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2017-12-26 DOI: 10.1109/ICSJ.2017.8240134

Kumi Date, K. Fukagata, T. Ishigure

引用次数: 0

Low-loss light coupling design for multimode polymer optical waveguides with VCSEL light sources VCSEL光源多模聚合物光波导的低损耗光耦合设计

2017 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2017-12-26 DOI: 10.1109/ICSJ.2017.8240135

Kohei Suganuma, T. Ishigure

引用次数: 0

Design optimization of heat sink using additive manufacturing 利用增材制造技术优化散热器设计

2017 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2017-12-26 DOI: 10.1109/ICSJ.2017.8240096

Y. Tateishi, V. Parque, T. Miyashita, H. Gohara, R. Kato, Y. Ikeda

引用次数: 6

Polymer waveguide incorporated with europium-aluminum polymer composite for compact and efficient amplification devices 聚合物波导结合了铕铝聚合物复合材料的紧凑和高效的放大装置

2017 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2017-12-26 DOI: 10.1109/ICSJ.2017.8240111

Yurie Yoshida, T. Fukui, T. Ishigure

引用次数: 4

Analysis of the wire/substrate interface during ultrasonic bonding process 超声键合过程中线材/衬底界面的分析

2017 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2017-11-01 DOI: 10.1109/ICSJ.2017.8240117

Y. Long, F. Dencker, Andreas Isaak, Chun Li, M. Wurz, J. Twiefel, J. Wallaschek, F. Schneider, J. Hermsdorf

{"title":"Analysis of the wire/substrate interface during ultrasonic bonding process","authors":"Y. Long, F. Dencker, Andreas Isaak, Chun Li, M. Wurz, J. Twiefel, J. Wallaschek, F. Schneider, J. Hermsdorf","doi":"10.1109/ICSJ.2017.8240117","DOIUrl":"https://doi.org/10.1109/ICSJ.2017.8240117","url":null,"abstract":"The ultrasonic wire bonding has been applied in the semiconductor packaging industry ever since its innovation in the 1960s. The mechanisms of the bonding process, however, are still unclear. According to state-of-the-art, the extremely short bonding process can be divided into four phases. These phases at the bonding interface were analyzed either from a side view or from a 2-D view but only after the bonding process when the wire was removed or cut. A 2-D real-time observation at the bonding interface, which is beneficial to a deeper understanding on these phases, has not been conducted. In this work, a transparent glass was used as the substrate and a high-speed observation system was installed underneath the glass to real-time observe the different phases from a 2-D view. The wire/substrate contact area and the friction area as well as their expansion over time were first observed. During this period, the oxide scale breakage area can be detected. A static dark area related to the formation of microwelds then appeared from the central region. During the expansion of this area, some oxides retained within this static area while most oxides were carried to the peripheral contact area. Friction continued during the extension of the contact area and the static area. These findings provide a deeper insight into the wire bonding process.","PeriodicalId":225668,"journal":{"name":"2017 IEEE CPMT Symposium Japan (ICSJ)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124249263","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Low temperature and low pressure fluxless Cu-Cu bonding by Ag-based transient liquid phase sintering for high temperature application 银基瞬态液相烧结低温低压无熔合Cu-Cu

2017 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2017-11-01 DOI: 10.1109/ICSJ.2017.8240115

M. K. Faiz, Takehiro Yamamoto, M. Yoshida

{"title":"Low temperature and low pressure fluxless Cu-Cu bonding by Ag-based transient liquid phase sintering for high temperature application","authors":"M. K. Faiz, Takehiro Yamamoto, M. Yoshida","doi":"10.1109/ICSJ.2017.8240115","DOIUrl":"https://doi.org/10.1109/ICSJ.2017.8240115","url":null,"abstract":"This work is the first to achieve a low temperature (≦250 °C) and low pressure (≦0.1 MPa) fluxless bonding of plateless Cu-Cu substrates by transient liquid phase sintering (TLPS) of Ag nanoparticles and Sn-Bi eutectic powder. Sintering was conducted under formic environment to assist the wetting of Sn-Bi and to suppress the oxidation of Cu substrate. Effect of mixture composition to the shear strength, microstructure, and remelting temperature was investigated. The effect of formic gas environment to the shear strength and microstructure was also examined. It was found that shear strength of 30wt% added Sn-Bi (Ag-30SnBi) that was sintered at 250 °C was higher than 20 MPa, which is comparable to the conventional Pb-based solder. The determined remelting temperature by differential scanning calorimetry (DSC) test was found to shift to higher temperature compared to the Sn-Bi eutectic temperature, implying the possibility of high temperature operation. Formic gas environment was observed by SEM to assist the densification of the sintering microstructure by the reduction of the oxide layer on the sintering structure and subsequently promoting the formation of sintering necks.","PeriodicalId":225668,"journal":{"name":"2017 IEEE CPMT Symposium Japan (ICSJ)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121585332","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0