4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)最新文献_第5页

Characterization of thin layers in microelectronic packaging using acoustic microscopy 微电子封装中薄层的声学显微镜表征

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI: 10.1109/ADHES.2000.860606

S. Canumalla, L. W. Kessler, S. K. Bhattacharya

引用次数: 4

Correlation of single lap joint strength, and deformation with joint resistance, surface, and cure conditions 单搭接强度和变形与接头阻力、表面和固化条件的关系

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI: 10.1109/ADHES.2000.860614

Erol Sancaktar, R. Gomatam

{"title":"Correlation of single lap joint strength, and deformation with joint resistance, surface, and cure conditions","authors":"Erol Sancaktar, R. Gomatam","doi":"10.1109/ADHES.2000.860614","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860614","url":null,"abstract":"For achieving a reliable adhesive bond, the adhesive must properly wet the surface asperities on the adherend before any other physical or chemical phenomena can take place. The physical phenomenon of mechanical interlocking is related to the surface morphology of the adherend. Generally, a rough surface increases adhesive joint strength, by enhancing the surface area and the extent of mechanical interlocking up to a limit. Particle loading and particle type can also influence surface wetting and the overall joint performance. In order to gain insight into the aspects of surface roughness, surface profile, filler particle shape, size, surface morphology, and joint resistance, experiments were conducted using 1018 cold rolled steel, which is convenient to etch and test. Surface modification was done by chemical etching with a recipe of chromic acid for 10 minutes. As a result, the average surface roughness changed from 0.45 microns to 1.65 microns, and the maximum roughness changed from 8.9 microns to 21 microns. Epon 830 adhesive with a viscosity of 170-225 Poise was used, filled with Nickel particles at 35% and 60% by volume. To elucidate the effect of particles, three different nickel particles were used, namely irregularly ellipsoidal Ni 104 particles of size 3 to 35 micron, spherical Ni 110 particles of size 3-8 micron in etched and unetched form. The metal specimens were bonded using 4 different adhesive thicknesses and cured. To gain insight into the effect of surface topography, SEM, and a profilometer were utilized to observe the surfaces. Strength and displacement values were measured at two different crosshead speeds of 1 and 100 mm/min, to assess the extent of interfacial failure.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133538832","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Investigations of plasma cleaning on the reliability of electrically conductive adhesives 等离子清洗对导电胶粘剂可靠性的影响

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI: 10.1109/ADHES.2000.860570

J. Morris, S. Probsthain

引用次数: 7

Evaluation of flip chip bonding using ACA on polyester substrates 用ACA在聚酯基板上进行倒装芯片键合的评价

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI: 10.1109/ADHES.2000.860571

R. Miessner, C. Nieland, R. Aschenbrenner, H. Reichl

{"title":"Evaluation of flip chip bonding using ACA on polyester substrates","authors":"R. Miessner, C. Nieland, R. Aschenbrenner, H. Reichl","doi":"10.1109/ADHES.2000.860571","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860571","url":null,"abstract":"The use of polyester as substrate material became more and more important recently for chip card and smart label applications. The material is economically and ecologically reasonable compared to PVC or ABS. As one of the main disadvantages is the low temperature stability, mainly isotropic conductive adhesives (ICA) have been used for interconnection of bare dies and single chip modules to the antennas. The use of anisotropic conductive adhesives (ACA) instead of ICA can potentially shorten the process time in manufacturing of chip card inlays or smart labels. This paper summarises our efforts to introduce the ACA technology to low temperature materials in several past and ongoing projects. Ni/Au bumped dies have been bonded to different coil materials like aluminium, copper and silver ink. As the characteristics of these antennas are completely different to each other, special treatments were necessary to ensure a stable interconnection. We characterised the flip chip assemblies to different metallisations in terms of adhesion, electrical interconnection, and manufacturability. Long term behaviour has been examined using high and low temperature storage, humidity exposure and temperature cycling. The study has shown that the selection of ACA has to be adjusted to the antenna material carefully. Thus mechanically and electrically stable interconnection could be established.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128271505","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Adhesion studies for flip-chip assemblies 倒装芯片组件的粘附研究

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI: 10.1109/ADHES.2000.860569

R. Pearson

引用次数: 1

Electric field effects in the production of ICA joints 电场效应在ICA接头生产中的应用

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI: 10.1109/ADHES.2000.860602

M. Heuschkel, J. Morris

引用次数: 2

Reliability study of sub 100 micron pitch, flex-to-ITO/glass interconnection, bonded with an anisotropic conductive film 基于各向异性导电膜的亚100微米间距柔性ito /玻璃互连可靠性研究

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI: 10.1109/ADHES.2000.860599

C. Murray, P. Hogerton, T. Chheang, R. L. Rudman, H. Egeberg

引用次数: 3

Delamination analysis of electronic package assemblies with insulated metal substrate 绝缘金属衬底电子封装组件的分层分析

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI: 10.1109/ADHES.2000.860574

T. Hauck, L. Mercado, V. Sarihan

{"title":"Delamination analysis of electronic package assemblies with insulated metal substrate","authors":"T. Hauck, L. Mercado, V. Sarihan","doi":"10.1109/ADHES.2000.860574","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860574","url":null,"abstract":"Electronic packages are multi-layered structures with a large number of interfaces. Under certain conditions, some interfaces could delaminate, resulting in failures. Reliability tests on flip chip assemblies of L8AA daisy chain die on insulated metal substrate (IMS) have revealed that the lifetime is mainly determined by the material interfaces. The dominating end of life failure mechanism is interfacial fracture between underfill and passivation layers. A fundamental understanding of these failure mechanisms and the experimental characterization of associated material properties are a key requirement in order to develop an optimal package design with an extended life time of the interconnect system. For flip-chip assemblies, packages with LMS substrate are much more prone to interface delamination than packages with FR-4 substrate. Cracks in the packages with IMS substrate are not catastrophic. In this paper, finite element approach, incorporated with interface fracture mechanics method, has been used to investigate the interface failure phenomenon. Excellent agreements have been obtained between experimental data and the simulation results.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134536701","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Reliability of ACF in flip-chip with various bump heights 不同碰撞高度倒装芯片中ACF的可靠性

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI: 10.1109/ADHES.2000.860580

C.M.L. Wu, J. Liu, N. H. Yeung

{"title":"Reliability of ACF in flip-chip with various bump heights","authors":"C.M.L. Wu, J. Liu, N. H. Yeung","doi":"10.1109/ADHES.2000.860580","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860580","url":null,"abstract":"Anisotropic Conductive Film (ACF) is being widely used in flip-chip (FC) technology because of its fine pitch characteristic and can also serve as an environmentally friendly joining material. The bumps of the FC are usually made from nickel. Since pressure is applied to force the conductive particles to make a contact between the nickel bumps and the copper pads in printed circuit boards (PCB) or flexible circuits (flex), the deformation of the bump can affect the electrical conductivity. In particular, the height of the bumps can change the deformation characteristics, and hence the reliability of the interconnection in the FC assembly. In this study, FC assemblies on PCB and flex, with bump heights of 4, 20 and 40 /spl mu/m, and with a constant copper pad height were considered. During the bonding process, a pressure of 4.5 kg/mm/sup 2/ and temperature of 180/spl deg/C were applied to the top surface of the FC for 30 sec. Moreover, a thermal cycle from -40 to 125/spl deg/C was also applied to the assemblies with various bump heights. The stress distributions of the assemblies were analyzed. It was found that the largest stress occurred when the height of bump is smallest. Also, the stresses in the ACF of the FC-on-flex assembly are generally larger than those in the FC-on-PCB assembly.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"203 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114659611","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

Thematic network adhesives in electronics-smart card roadmap 电子-智能卡路线图中的专题网络粘合剂

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI: 10.1109/ADHES.2000.860628

R. Aschenbrenner, R. Miessner

引用次数: 0