4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)最新文献_第6页

Development of high-density interconnection techniques for contactless smart cards 非接触式智能卡高密度互连技术的发展

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI: 10.1109/ADHES.2000.860573

A. Aintila, J. Sarkka, J. Kivilahti

{"title":"Development of high-density interconnection techniques for contactless smart cards","authors":"A. Aintila, J. Sarkka, J. Kivilahti","doi":"10.1109/ADHES.2000.860573","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860573","url":null,"abstract":"Summary form only given. This paper deals with techniques that are used for fabricating high density and thin assemblies with emphasis on materials, implementation and reliability. Moreover, a new potential interconnection and packaging technique being particularly suitable for contacting ultra-thin chips is also introduced. In the production tests electroless fine-pitch Ni/Au bumped chips were bonded with solder paste but the results were not satisfactory. Commercial isotropically and anisotropically conductive adhesives allowing denser interconnections than conventional soldering gave markedly better results and are now used in volume production of contactless cards. A new type of ACA containing fusible filler particles was employed for bonding flip chip bumps on the substrate with metallurgically compatible contact pads. The results proved to be very promising especially from the electrical continuity point of view. A solderless interconnection technique, which is especially suitable for producing very fine pitch interconnections, was employed successfully for fabricating contactless smart cards. In this technique, in which the substrate conductors are chemically deposited on shallow bumps of the embedded chips, high reliability of the interconnections can be achieved.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123511325","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Performance of the stud bump bonding (SBB) process in comparison to solder flip chip technology 螺栓碰撞键合(SBB)工艺的性能与焊接倒装芯片技术的比较

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI: 10.1109/ADHES.2000.860587

W. Reinert, T. Harder

{"title":"Performance of the stud bump bonding (SBB) process in comparison to solder flip chip technology","authors":"W. Reinert, T. Harder","doi":"10.1109/ADHES.2000.860587","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860587","url":null,"abstract":"In flip chip on board, a flip chip packaging technology, a number of assembly techniques have been proposed using different bump materials, different techniques for the bump application and various methods for the electrical interconnection. Among these, the Stud Bump Bonding (SBB) process, which is widely used in Japan also for high volume production, is very interesting for several reasons and therefore is discussed in this paper. The stud bump bonding process uses Au bumps which are applied mechanically on the wafer or on the chip using a thermosonic ball bonder enabling fine pitch bumping. The process works with available chips, having peripheral bond pads of a pitch down to 80 /spl mu/m, and does not need an under bump metallization (UBM). The SBB process with Au bumps uses mainly isotropically conductive adhesive (ICA) joining. The adhesive is applied by dip transfer. In the present work the total SBB process is evaluated. Besides the bumping, the flip chip assembly process covering the dip transfer of conductive adhesive, the pick and place as well as the underfill process are investigated with special emphasis on process automation. The reliability evaluation concentrates on thermo-mechanical and corrosion effects. The SBB process is compared to solder flip chip technology using solder bumps which are applied by the stencil printing of ultra-fine-pitch solder paste.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126735937","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 14

Degradation mechanisms of anisotropic conductive adhesive joints for flip chip on flex applications 倒装芯片各向异性导电胶接头在挠性应用中的降解机理

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI: 10.1109/ADHES.2000.860588

Y. Chan, K. Hung, C. Tang, C.M.L. Wu

引用次数: 31

One-part fast cure chipbonder epoxy adhesives for electronic applications 用于电子应用的片式快固化环氧胶粘剂

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI: 10.1109/ADHES.2000.860581

O. Figovsky, L. Sklyarsky, O. Sklyarsky

{"title":"One-part fast cure chipbonder epoxy adhesives for electronic applications","authors":"O. Figovsky, L. Sklyarsky, O. Sklyarsky","doi":"10.1109/ADHES.2000.860581","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860581","url":null,"abstract":"One part epoxy adhesives are known for their versatility in applications including electronics. They generally give outstanding adhesion to a wider range of substrates, very high bond strength and have excellent electrical properties and resistance to soldering. At the same time, one-part epoxy adhesives still have several limitations for electronic applications related to the long-continued curing of well-known adhesives, for instance in mounting electronic components for soldering. In this paper, novel one-part fast-curing epoxy adhesives are presented. Crystalline secondary and tertiary amines salts of triazine tricarboxylic acid were used as the curing agents for epoxy resins. Proposed epoxy adhesives (EA) are cured for 15-30 s at 150-180/spl deg/C and possess the required \"green\" strength and heat resistance during the solder wave trip using high-speed equipment. The influence of amine type on gelation time, heat resistance and shelf life at room temperature of these adhesives were studied. It was shown that high heat resistance of EA is conditioned in presence of triazine tricarboxylic acid in curing agent. The test results showed the possibility of EA for mounting chips and other electronic components in high-speed processes.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126152854","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A novel IMB technology for integrating active and passive components 一种集成有源和无源元件的新型IMB技术

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI: 10.1109/ADHES.2000.860617

R. Tuominen, J. Kivilahti

引用次数: 20

4/sub th/ International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 4/sub /电子制造中的粘合剂连接和涂层技术国际会议

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 1900-01-01 DOI: 10.1109/ADHES.2000.860562

引用次数: 2