One-part fast cure chipbonder epoxy adhesives for electronic applications

Abstract

One part epoxy adhesives are known for their versatility in applications including electronics. They generally give outstanding adhesion to a wider range of substrates, very high bond strength and have excellent electrical properties and resistance to soldering. At the same time, one-part epoxy adhesives still have several limitations for electronic applications related to the long-continued curing of well-known adhesives, for instance in mounting electronic components for soldering. In this paper, novel one-part fast-curing epoxy adhesives are presented. Crystalline secondary and tertiary amines salts of triazine tricarboxylic acid were used as the curing agents for epoxy resins. Proposed epoxy adhesives (EA) are cured for 15-30 s at 150-180/spl deg/C and possess the required "green" strength and heat resistance during the solder wave trip using high-speed equipment. The influence of amine type on gelation time, heat resistance and shelf life at room temperature of these adhesives were studied. It was shown that high heat resistance of EA is conditioned in presence of triazine tricarboxylic acid in curing agent. The test results showed the possibility of EA for mounting chips and other electronic components in high-speed processes.