基于各向异性导电膜的亚100微米间距柔性ito /玻璃互连可靠性研究

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI:10.1109/ADHES.2000.860599

C. Murray, P. Hogerton, T. Chheang, R. L. Rudman, H. Egeberg

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引用次数: 3

摘要

本研究的目的是鉴定一种3M z轴(各向异性)导电膜，用于要求低于100 /spl μ m /m节距弯曲的ITO/玻璃连接。环境稳定性试验研究了加速老化条件:100/spl℃干燥、125/spl℃干燥、-40/spl℃/100/spl℃循环、-55/spl℃/125/spl℃冲击、60/spl℃/95%RH和85/spl℃/85%RH。我们检测了这些粘结剂在环境老化后的电气性能和剥离性能。

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Reliability study of sub 100 micron pitch, flex-to-ITO/glass interconnection, bonded with an anisotropic conductive film

The objective of this study was to qualify a 3M Z-Axis (anisotropic) conductive film for use in applications calling for sub 100 /spl mu/m pitch flex to ITO/glass connections. For the environmental stability tests, the following accelerated aging conditions were studied: 100/spl deg/C dry, 125/spl deg/C dry, -40/spl deg/C/100/spl deg/C cycle, -55/spl deg/ C/125/spl deg/C shock, 60/spl deg/ C/95%RH and 85/spl deg/ C/85%RH. We examined both the electrical and peel performance of these bonds after environmental aging.

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4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)

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