Thematic network adhesives in electronics-smart card roadmap

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI:10.1109/ADHES.2000.860628

R. Aschenbrenner, R. Miessner

引用次数: 0

Abstract

Discusses interconnection technologies for standard IC and additional components: used adhesives for mechanical and electrical interconnection. The aim of this roadmap survey is to find the important technology issues. It is planned to define future material needs upon the results of the roadmap.

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电子-智能卡路线图中的专题网络粘合剂

讨论标准集成电路和附加组件的互连技术:用于机械和电气互连的粘合剂。这个路线图调查的目的是找到重要的技术问题。计划根据路线图的结果确定未来的材料需求。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)

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