2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM)最新文献_第6页

A Novel One-Step Calibration Method for On-Chip Oscillator 一种新的片上振荡器一步校准方法

2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2018-11-01 DOI: 10.1109/ICAM.2018.8596361

Yan Chen, Yousheng Chen, X. Tan, Xu Wang, Yan Guo

引用次数: 0

The Characterization of Superconducting Tungsten Thin Films Deposited by DC Magnetron Sputtering 直流磁控溅射沉积超导钨薄膜的表征

2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2018-11-01 DOI: 10.1109/ICAM.2018.8596502

Meng Wu, Wei Liang, Jinwen Zhang

引用次数: 1

Power Characteristics for the Dual Channel 4H-SiC Metal Semiconductor Field Effect Transistor 双通道4H-SiC金属半导体场效应晶体管的功率特性

2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2018-11-01 DOI: 10.1109/ICAM.2018.8596550

Xianjun Zhang, Na You

引用次数: 0

Rapid Production of Customised Electronic Systems Via Multifunctional Additive Manufacturing Technology 通过多功能增材制造技术快速生产定制电子系统

2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2018-11-01 DOI: 10.1109/ICAM.2018.8596477

Ji Li, Yang Wang, Jiangling He, Handa Liu, Gengzhao Xiang

{"title":"Rapid Production of Customised Electronic Systems Via Multifunctional Additive Manufacturing Technology","authors":"Ji Li, Yang Wang, Jiangling He, Handa Liu, Gengzhao Xiang","doi":"10.1109/ICAM.2018.8596477","DOIUrl":"https://doi.org/10.1109/ICAM.2018.8596477","url":null,"abstract":"Multifunctional additive manufacturing technologies can facilitate the rapid development and direct production of full-functional electronic devices by coupling the capabilities of additive manufacturing processes with other types of manufacturing techniques. In addition, these methods present evident advantages for improving the development speed and complexity of mass customized electronic products. In this work, we propose a multifunctional additive manufacturing solution that integrates dual-material fused deposition modeling 3D printing and selective electroless plating. Nickel alloy film can be selectively plated on 3D printed free-form plastic structures. With four-point probe investigation, EDS anlysis and SEM imaging, it was identified that the resistivity of plated film can be regulated by controlling the electroless plating parameters including reaction temperature and pH value. A minimal resistivity of nickel alloy film was approximate $mathbf{8.4}times mathbf{10}^{-mathbf{5}}Omegacdotmathbf{cm}$, when the electroless plating was conducted at 50°C and pH 8.5. A 555 timer circuit with blinking LED was fabricated in both 2D and 3D manner as a demonstrator to prove the feasibility of this technology in practical industry applications.","PeriodicalId":220324,"journal":{"name":"2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"51 Suppl 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131347634","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Implementation of Multipath Transformer in CMOS Voltage-Controlled Oscillator CMOS VCO Using Multi-Path Transformer 用多径变压器实现CMOS压控振荡器中的多径变压器

2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2018-11-01 DOI: 10.1109/ICAM.2018.8596589

W. Lai, S. Jang, Yu-Wen Huang

引用次数: 0

Optimal Design of Insulation in Compact Switchgear Based on ANSYS Simulation and Partial Discharge Test 基于ANSYS仿真和局部放电试验的紧凑型开关柜绝缘优化设计

2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2018-11-01 DOI: 10.1109/ICAM.2018.8596485

Lin Zhao, Liya Ye, Ruixiang Tao, Fei Yuan, Yong Yang, Peng Jiang

引用次数: 1

A Wideband Tunable Voltage Controlled Oscillator Supporting Non-harmonically-Related Multiple Frequency Bands for Future 5G Applications Using $mathbf{0.13}-mu mathbf{m}$ SiGe BiCMOS Technology 基于$mathbf{0.13}-mu mathbf{m}$ SiGe BiCMOS技术的支持未来5G非谐波多频段宽带可调谐压控振荡器

2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2018-11-01 DOI: 10.1109/ICAM.2018.8596529

F. Ullah, Yu Liu, Zhiqiang Li, Xiaosong Wang, M. Sarfraz, Haiying Zhang

引用次数: 0

A CMOS Laser Driver with Configurable Optical Power for Time-of-Flight 3D-Sensing 一种可配置光功率的飞行时间三维传感CMOS激光驱动器

2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2018-11-01 DOI: 10.1109/ICAM.2018.8596490

Cheng Wang, Shenglong Zhuo, Chang Liu

引用次数: 1

Efficient Hihg-Sigma Yield Analysis with Yield Optimization Method for Near-Threshold SRAM Design 基于成品率优化方法的近阈值SRAM设计高效高sigma成品率分析

2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2018-11-01 DOI: 10.1109/ICAM.2018.8596401

Chengzhi Jiang, Xiaoming Fan, Y. Xing, Xiangkun Qi, Yang Wang, He Wang

{"title":"Efficient Hihg-Sigma Yield Analysis with Yield Optimization Method for Near-Threshold SRAM Design","authors":"Chengzhi Jiang, Xiaoming Fan, Y. Xing, Xiangkun Qi, Yang Wang, He Wang","doi":"10.1109/ICAM.2018.8596401","DOIUrl":"https://doi.org/10.1109/ICAM.2018.8596401","url":null,"abstract":"The enhancement of process, the feature size of device becomes smaller, and the deductions of power supply require the design of SRAM should be consummated. For the design of 6-T SRAM, although we have many methods to optimize it in order to overcome lots of challenges. But the smaller feature size and lower power supply will produce a decline in the performance of Static Noise Margin (SNM) and increase of leakage current. They also produce much more uncertain factors than before. To make matters worse, 6-T SRAM may not work properly. So a new structure with good design-for-yield (DFY) to work at lower supply voltage becomes more important. We have found a alternative structure, which we call it 8-T SRAM. And we can prove its performance is more suitable for the demand in the future SRAM design. But there is still no comprehensive method to optimize 8-T SRAM design, and we don't know whether its yield is acceptable or not. In this paper, we propose a comprehensive method for statistical 8-T SRAM design relying on an efficient combination of yield analysis and performance optimization. To the best of our knowledge, this is the first time that such a comprehensive method is applied to analyzing and optimizing the 8-T SRAM design with lower power supply.","PeriodicalId":220324,"journal":{"name":"2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122207985","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

A Novel Hardware Trojan Protection Technology Based on Logic Encryption 一种新的基于逻辑加密的硬件木马防护技术

2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2018-11-01 DOI: 10.1109/ICAM.2018.8596337

Yi-lun Zhang, Yingjian Yan, Jun-Wei Li, Min Liu

引用次数: 1