2015 IEEE International Workshop on Integrated Power Packaging (IWIPP)最新文献_第3页

A carrier-based discontinuous space vector modulation for three-level NPC inverter 基于载波的三电平NPC逆变器不连续空间矢量调制

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2015-05-03 DOI: 10.1109/IWIPP.2015.7295982

Chengzhu Piao, J. Hung

{"title":"A carrier-based discontinuous space vector modulation for three-level NPC inverter","authors":"Chengzhu Piao, J. Hung","doi":"10.1109/IWIPP.2015.7295982","DOIUrl":"https://doi.org/10.1109/IWIPP.2015.7295982","url":null,"abstract":"This paper presents carrier-based discontinuous space vector pulse width modulation (DSVPWM) method for three-level three-phase neutral point clamped (NPC) voltage source inverter (VSI). Based on the relationship between space vector pulse width modulation (SVPWM) and carrier based modulation, a simplified DSVPWM method for three-phase inverter is introduced by skillfully arranging two zero voltage vectors. In this method, the conventional space vector modulator with equal division of zero voltage vector time is modified to generate different discontinuous modulating waves. The switching sequences for six basic types of discontinuous PWM are studied. It includes DSVPWMmax, DSVPWMmin, DSVPWM0, DSVPWM1, DSVPWM2, and DSVPWM3. According to the carrier-based PWM, simplified SVPWM, and traditional discontinuous PWM strategies, the DSVPWM strategies called as DSVPWMx, including six basic types of DSVPWM and eight novel types of DSVPWM, are proposed and studied. By this method, switching losses of inverter are optimized and life expectancy of inverter can be increased using a suitable discontinuous modulation technique. The proposed method is theoretically analyzed, and verified by simulation results.","PeriodicalId":214539,"journal":{"name":"2015 IEEE International Workshop on Integrated Power Packaging (IWIPP)","volume":"129 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122978160","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Thermal management of lateral GaN power devices 横向GaN功率器件的热管理

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2015-05-03 DOI: 10.1109/IWIPP.2015.7295973

C. Yu, E. Labouré, C. Buttay

引用次数: 12

WBG inverter for commercial power generation and vehicle electrification 用于商业发电和汽车电气化的WBG逆变器

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2015-05-03 DOI: 10.1109/IWIPP.2015.7295972

D. Murthy-Bellur, Elias Ayana, S. Kunin, B. Palmer, S. Varigonda

引用次数: 7

Design of a reduced form factor passive heat sink for high power applications 设计一种用于高功率应用的小尺寸无源散热器

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2015-05-03 DOI: 10.1109/IWIPP.2015.7295974

S. Seal, M. Glover, H. Mantooth

引用次数: 3

Power electronics packaging challenges for future warship applications 未来舰船应用的电力电子封装挑战

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2015-05-03 DOI: 10.1109/IWIPP.2015.7295965

R. Cuzner

{"title":"Power electronics packaging challenges for future warship applications","authors":"R. Cuzner","doi":"10.1109/IWIPP.2015.7295965","DOIUrl":"https://doi.org/10.1109/IWIPP.2015.7295965","url":null,"abstract":"Power conversion and solid state protection technologies are critical enablers to the accomplishment of the Navy's vision for shipboard Next Generation Integrated Power Systems but for most commercial offerings of this equipment the simultaneous achievements of high power density with electromagnetic and thermal compatibility and high reliability are prohibitive cost drivers. The increasing availability of wide bandgap power semiconductors provides the opportunity for the development of power electronic systems with a smaller footprint, higher efficiency and lower demands for external thermal management - enabling more widespread introduction of power electronic systems into the shipboard environment with lower system integration costs. However, the shipboard environment poses challenging competing requirements that cannot be ignored. The purpose of this paper is to highlight the future packaging challenges in three areas: modularity, increased module functionality and retrofit. These challenges are illustrated by three specific examples: medium voltage solid state transformer, medium voltage dc solid state circuit breaker and low voltage variable speed drive.","PeriodicalId":214539,"journal":{"name":"2015 IEEE International Workshop on Integrated Power Packaging (IWIPP)","volume":"88 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129891569","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 15

6.5 kV Si/SiC hybrid power module: An ideal next step? 6.5 kV Si/SiC混合动力模块:理想的下一步?

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2015-05-03 DOI: 10.1109/IWIPP.2015.7295979

A. Huang, Xiaoqing Song, Liqi Zhang

引用次数: 34

Embedding active and passive components in PCBs and inorganic substrates for power electronics 电力电子用pcb和无机基板中嵌入有源和无源元件

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2015-05-03 DOI: 10.1109/IWIPP.2015.7295990

Ernie Parker, B. Narveson, A. Alderman, Louis Burgyan

{"title":"Embedding active and passive components in PCBs and inorganic substrates for power electronics","authors":"Ernie Parker, B. Narveson, A. Alderman, Louis Burgyan","doi":"10.1109/IWIPP.2015.7295990","DOIUrl":"https://doi.org/10.1109/IWIPP.2015.7295990","url":null,"abstract":"The Packaging Committee of the Power Sources Manufacturers Association (PSMA) organized and sponsored a special project to study how innovations in 3D packaging either were currently or are projected to be leveraged by the power electronics industry. Phase 1 of this special project resulted in a Technology Report titled “3D Power Packaging” [1] that was prepared under contract by Tyndall Institute of Cork, Ireland and published March 2014. Phase 2 of the special project continued to examine 3D power packaging but with a focus on embedded substrate technologies; it was prepared under contract LTEC Corporation with subcontract to Anagenesis, Inc. and Fraunhofer-Institure and was published March 2015 [2]. The phase 2 report covers a spectrum from active and passive component technologies for embedding, die attach materials and processes, thermal management, and additive manufacturing; however the heart of the report is a chapter on technologies for embedding in PCBs and inorganic substrates. This paper provides an overview of the findings from that report regarding technologies that are currently in production and those forecast to be viable for volume production in the near future.","PeriodicalId":214539,"journal":{"name":"2015 IEEE International Workshop on Integrated Power Packaging (IWIPP)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117329041","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Parasitic extraction procedure for silicon carbide power modules 寄生提取程序的碳化硅功率模块

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2015-05-03 DOI: 10.1109/IWIPP.2015.7295986

A. Lemmon, R. Graves

引用次数: 47

Chip-level and package-level thermal constraints in power semiconductor switch modules 功率半导体开关模块中的芯片级和封装级热约束

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2015-05-03 DOI: 10.1109/IWIPP.2015.7295983

K. Shenai

引用次数: 0

Reliability-oriented design of gate driver for SiC devices in voltage source converter 电压源变换器中SiC器件栅极驱动器的可靠性设计

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2015-05-03 DOI: 10.1109/IWIPP.2015.7295968

Zheyu Zhang, Zhiqiang Wang, Fred Wang, L. Tolbert, B. Blalock

引用次数: 6