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2015 IEEE International Workshop on Integrated Power Packaging (IWIPP)最新文献

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Behavioral modeling for stability in multi-chip power modules 多芯片电源模块稳定性行为建模
2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2015-05-03 DOI: 10.1109/IWIPP.2015.7295985
M. Mazzola, M. Rahmani, J. Gafford, A. Lemmon, R. Graves
{"title":"Behavioral modeling for stability in multi-chip power modules","authors":"M. Mazzola, M. Rahmani, J. Gafford, A. Lemmon, R. Graves","doi":"10.1109/IWIPP.2015.7295985","DOIUrl":"https://doi.org/10.1109/IWIPP.2015.7295985","url":null,"abstract":"Since fast switching is an essential part of the value of wide bandgap devices (i.e., silicon carbide and gallium nitride power transistors) it is imperative that the designers of high-power modules using WBG devices have modeling and simulation tools to manage the “near RF” dynamic behavior of the system in order to preclude instability and to manage electromagnetic emission. The behavioral modeling reported in this work is computationally efficient for use in high-power multi-chip-module (MCM) package layout and die integration. Physics-based modeling is used to form a multiport S-parameter behavioral model. Comparison in the frequency domain is made between theoretical and experimental linear S-parameters for an exemplar direct bonded copper (DBC) board. Time domain experimental results are shown as a reference for future time-domain MCM performance evaluations using the S-parameter models.","PeriodicalId":214539,"journal":{"name":"2015 IEEE International Workshop on Integrated Power Packaging (IWIPP)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130328221","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Advanced packaging technologies for fully exploiting attributes of WBG power electronics 先进的封装技术，充分利用WBG电力电子器件的特性
2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2015-05-03 DOI: 10.1109/IWIPP.2015.7295970
Zhenxian Liang
{"title":"Advanced packaging technologies for fully exploiting attributes of WBG power electronics","authors":"Zhenxian Liang","doi":"10.1109/IWIPP.2015.7295970","DOIUrl":"https://doi.org/10.1109/IWIPP.2015.7295970","url":null,"abstract":"A set of technical parameters of power electronics package has been employed to characterize the packaging technologies, in order to improve the criteria such as efficiency, cost-effectiveness and reliability of wide bandgap (WBG) power semiconductors in power conversion applications. Some technologies such as integrated gate driver, planar electrical interconnection, and integrated cooling have been developed. The comprehensive improvements in module's electrical, thermal performance and manufacturability help utilize fully the attributes provided exclusively by the WBG power semiconductors. The technical advancements lead to cost-effective, high efficiency, high power density in automotive electric power conversion systems.","PeriodicalId":214539,"journal":{"name":"2015 IEEE International Workshop on Integrated Power Packaging (IWIPP)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121167517","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Compact and optimized solar power converter: Taking another step to augment solar energy efficiency 紧凑和优化的太阳能转换器:又迈出了提高太阳能效率的一步
2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 1900-01-01 DOI: 10.1109/icscti.2015.7489589
Y. Kumar, Sachin Beniwal, Shivender Dahiya
{"title":"Compact and optimized solar power converter: Taking another step to augment solar energy efficiency","authors":"Y. Kumar, Sachin Beniwal, Shivender Dahiya","doi":"10.1109/icscti.2015.7489589","DOIUrl":"https://doi.org/10.1109/icscti.2015.7489589","url":null,"abstract":"This paper will discuss some ground breaking changes in the solar cell converter. There are changes that we have incorporated result in a significant improvement over the present technology. The aim of this paper was to determine a way to reduce the size while improving lifetime of the device, without a compromise to cost.","PeriodicalId":214539,"journal":{"name":"2015 IEEE International Workshop on Integrated Power Packaging (IWIPP)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121269190","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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