2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720)最新文献_第4页

Current issues and strategies in chip and higher level packaging 芯片和更高级别封装的当前问题和策略

2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720) Pub Date : 2004-03-13 DOI: 10.1109/AERO.2004.1368040

W. Bjorndahl, C. Pickman

{"title":"Current issues and strategies in chip and higher level packaging","authors":"W. Bjorndahl, C. Pickman","doi":"10.1109/AERO.2004.1368040","DOIUrl":"https://doi.org/10.1109/AERO.2004.1368040","url":null,"abstract":"As the degree of integration and number of local component interconnects has grown, the number of interconnects between boards as also increased. The increase has been substantial; to the point that on boards, the amount of available edge connect space along the periphery of the board is disappearing. For interconnections between electronic boxes, the amount of external electronic harnesses and connections is becoming difficult to handle at the test and system integration level. In addition, the bandwidth of board-to-board and box-to-box designs has increased with the continual desire to move to higher frequencies which puts additional requirements on the designs and materials used for interconnections. There are thus two pressures on interconnects, the first being the increased density required and the second being the desired capability to operate at higher and higher frequencies. To reduce the amount of interconnect, various methods such as serialization of many low bandwidth signals into a high bandwidth stream and free space optical interconnect (FSOI) have been described in the literature. In addition, cables, flexible interconnect strategies, and connectors have been designed and tested to fairly high frequencies. Some of these approaches can potentially reduce the number of interconnects required between boards and boxes. This work describes recent advances reported in the literature on these types of technologies. It also describes some practical problems encountered with some approaches and the potential benefits that might accrue for both signal integrity and reduced pressure on interconnect density should optimized systems be incorporated into designs.","PeriodicalId":208052,"journal":{"name":"2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131709876","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Development of robust analog and mixed-signal electronics for extreme environment applications 为极端环境应用开发强大的模拟和混合信号电子产品

2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720) Pub Date : 2004-03-13 DOI: 10.1109/AERO.2004.1368051

S. Terry, B. Blalock, J. Jackson, Suheng Chen, C. Durisety, M. Mojarradi, E. Kolawa

引用次数: 18

Noise performance of 0.35-/spl mu/m SOI CMOS devices and micropower preamplifier from 77-400 K 0.35-/spl mu/m SOI CMOS器件和微功率前置放大器在77-400 K范围内的噪声性能

2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720) Pub Date : 2004-03-13 DOI: 10.1109/AERO.2004.1368044

D. Binkley, C. E. Hopper, B. Blalock, M. Mojarradi, J. Cressler, L. Yong

引用次数: 10

Comparison of existing & proposed SOI MOSFET device structures for minimizing total dose radiation damage 比较现有和拟议的SOI MOSFET器件结构，以减少总剂量辐射损伤

2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720) Pub Date : 2004-03-13 DOI: 10.1109/AERO.2004.1368037

S. Parke

引用次数: 6

A dynamic scheduling algorithm with minimum context switches for spacecraft avionics systems 航天器航电系统最小上下文切换动态调度算法

2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720) Pub Date : 2004-03-13 DOI: 10.1109/AERO.2004.1368056

B. Zolfaghari

{"title":"A dynamic scheduling algorithm with minimum context switches for spacecraft avionics systems","authors":"B. Zolfaghari","doi":"10.1109/AERO.2004.1368056","DOIUrl":"https://doi.org/10.1109/AERO.2004.1368056","url":null,"abstract":"Most of the process-scheduling algorithms, which can be exploited by spacecraft avionics systems, fall into one of the two main categories: static algorithms and dynamic algorithms. Static algorithms assign priorities to processes before runtime. These algorithms bound the CPU utilization and require considerable information about the runtime parameters of processes in advance. Instead, these disadvantages encourage the spacecraft avionics system designers to exploit dynamic algorithms. However, these algorithms have their own disadvantages. For example, these algorithms require so many context switches to schedule the processes. This causes a notable overhead in the runtime. One of the well-known dynamic algorithms is the MLF (Minimum Laxity First) algorithm. The MLF algorithm suffers from a serious problem (in addition to the need for so many context switches). This paper proposes a novel dynamic algorithm called Optimized MLF which is an attempt to solve the problems of the MLF algorithm in order to make it more applicable to spacecraft avionics systems. The performance of the proposed scheduling algorithm is evaluated through the use of mathematical modeling as well as simulation results. Both the mathematical model and simulation results show that the optimized MLF algorithm requires less context switches than the traditional MLF and makes the MLF algorithm more applicable to spacecraft avionics systems.","PeriodicalId":208052,"journal":{"name":"2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125623630","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Elastic parameters of nanoclay-reinforced polymers for space and launch vehicles 空间和运载火箭用纳米粘土增强聚合物的弹性参数

2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720) Pub Date : 2004-03-13 DOI: 10.1109/AERO.2004.1368071

K. Mallick, C. Paul

引用次数: 1

Determination of orbital elements for the formation assembly problem 编队装配问题轨道要素的确定

2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720) Pub Date : 2004-03-13 DOI: 10.1109/AERO.2004.1368059

S. Balaji, A. Tatnall

引用次数: 0

Configurable spacecraft control architectures for on-orbit servicing and upgrading of long life orbital platforms 用于长寿命轨道平台在轨服务和升级的可配置航天器控制体系结构

2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720) Pub Date : 2004-03-13 DOI: 10.1109/AERO.2004.1368057

J. Ross, D. Musliner, T. Kreider, J. Jacobs, M. Fisher

引用次数: 8

Extreme temperature electronics 极端温度电子产品

2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720) Pub Date : 2004-03-13 DOI: 10.1109/AERO.2004.1368047

L. Sadwick, R. J. Hwu, J. Chern

{"title":"Extreme temperature electronics","authors":"L. Sadwick, R. J. Hwu, J. Chern","doi":"10.1109/AERO.2004.1368047","DOIUrl":"https://doi.org/10.1109/AERO.2004.1368047","url":null,"abstract":"In this paper a new class of electronic devices, called solid state vacuum devices (SSVDs), is presented and discussed with the primary focus aimed toward extreme environment applications. SSVDs, due to their intrinsic high temperature operation and radiation hardness, should be extremely well suited for extreme environments that exist both on Earth and, for example, on the planet Venus. SSVDs combine features inherent to solid state and vacuum electronics in this new class of devices. SSVDs can be used as high voltage/high power devices (from DC to well into the GHz range) or as SSI or MSI integrated circuits. SSVDs can be made in many different sizes and shapes to suit the application. SSVDs can be compact and lightweight. SSVDs are, by their very nature, high temperature electronics. Device parameters (e.g., gain, g/sub m,/ output resistance, etc.) are design parameters that can be chosen to match the application. The power handling capability of SSVDs can range from less than milliwatts to easily more than tens of kilowatts. SSVD operation, parameters and performance results and information can be the focus of this presentation with the primary area of concentration on extreme environment high temperature applications.","PeriodicalId":208052,"journal":{"name":"2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720)","volume":"230 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134289107","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

A high resolution, extended temperature sigma delta ADC in 3.3 V 0.5 /spl mu/m SOS-CMOS 高分辨率，扩展温度σ δ ADC 3.3 V 0.5 /spl mu/m的SOS-CMOS

2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720) Pub Date : 2004-03-13 DOI: 10.1109/AERO.2004.1368055

M. Ericson, M. Bobrek, A. Bobrek, C. Britton, J. M. Rochelle, B. Blalock, R. Schultz

{"title":"A high resolution, extended temperature sigma delta ADC in 3.3 V 0.5 /spl mu/m SOS-CMOS","authors":"M. Ericson, M. Bobrek, A. Bobrek, C. Britton, J. M. Rochelle, B. Blalock, R. Schultz","doi":"10.1109/AERO.2004.1368055","DOIUrl":"https://doi.org/10.1109/AERO.2004.1368055","url":null,"abstract":"A /spl Sigma//spl Delta/ modulator designed specifically for extended temperature applications is reported. The design is fabricated in a 3.3-V 0.5 /spl mu/m SOS-CMOS process and incorporates a 2-2 cascade architecture allowing operation as either a 2/sup nd/- or 4/sup th/-order modulator. Experimental data for both modulator configurations are presented including dynamic range (or effective resolution), signal-to-noise ratio and total harmonic distortion over a temperature range of 25/spl deg/C to 225/spl deg/C. The design obtains an effective resolution of /spl sim/16 bits at 25/spl deg/C and /spl sim/12 bits at 225/spl deg/C, both at a digital output rate of 2 KS/s. Specific design details associated with high temperature operation are discussed including architectural issues, device sizing, and modulator noise. In addition, a digital decimation filter designed for use with the modulator and implemented in both software and in a field programmable gate array is summarized. This paper reports the first 4/sup th/-order /spl Sigma//spl Delta/ modulator fabricated in an SOI/SOS process and demonstrates the feasibility of high resolution data conversion at elevated temperatures.","PeriodicalId":208052,"journal":{"name":"2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122413833","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1