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Proceedings of the IEEE: Stay Informed. Become Inspired. 电气和电子工程师学会论文集》:保持信息灵通。激发灵感。
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-11-08 DOI: 10.1109/JPROC.2024.3479439
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引用次数: 0
Additively Manufactured Electronic Components in Multimaterial 3-D and 4-D Printing 多材料三维和四维打印中的快速制造电子元件
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-11-08 DOI: 10.1109/JPROC.2024.3484116
Yang Yang;Manos M. Tentzeris
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引用次数: 0
Room-Temperature Selective-Metallization Processes Applied to 3-D-Printed and Flexible Materials for Wireless Sensing 室温选择性金属化工艺应用于用于无线传感的三维打印和柔性材料
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-11-05 DOI: 10.1109/JPROC.2024.3481315
Valentina Palazzi;Federico Alimenti;Leonardo Pierantozzi;Matteo Ribeca;Leonardo Balocchi;Luca Valentini;Silvia Bittolo Bon;Paolo Mezzanotte;Manos M. Tentzeris;Luca Roselli
{"title":"Room-Temperature Selective-Metallization Processes Applied to 3-D-Printed and Flexible Materials for Wireless Sensing","authors":"Valentina Palazzi;Federico Alimenti;Leonardo Pierantozzi;Matteo Ribeca;Leonardo Balocchi;Luca Valentini;Silvia Bittolo Bon;Paolo Mezzanotte;Manos M. Tentzeris;Luca Roselli","doi":"10.1109/JPROC.2024.3481315","DOIUrl":"10.1109/JPROC.2024.3481315","url":null,"abstract":"This article describes sensors and radio frequency (RF) components manufactured by applying selective-metallization processes (metal foil tape, liquid metal filling, electro and electroless plating, and surface embossing) to 3-D-printed and flexible dielectric substrates. All these technologies can be implemented at room temperature, thus enabling the adoption of unconventional materials and biopolymers with low glass transition temperatures. In this article, we also describe how the above technologies are used to manufacture wireless transponders for tracking and sensing applications. Several examples of RF components are reported, including antennas, beamforming networks, Doppler radars, and wireless passive transponders based on backscatter radio. Innovative circuit design approaches (such as the via-less approach) are presented and their impact on circuit manufacturing and recyclability is discussed.","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 8","pages":"1065-1090"},"PeriodicalIF":23.2,"publicationDate":"2024-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10742604","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142588725","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Wireless 6G Connectivity for Massive Number of Devices and Critical Services 为大量设备和关键服务提供无线 6G 连接
IF 20.6 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-11-05 DOI: 10.1109/jproc.2024.3484529
Anders E. Kalor, Giuseppe Durisi, Sinem Coleri, Stefan Parkvall, Wei Yu, Andreas Mueller, Petar Popovski
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引用次数: 0
TechRxiv TechRxiv
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-10-29 DOI: 10.1109/JPROC.2024.3481751
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引用次数: 0
The Road to 6G: Driving the Next Wave of Connectivity—Part I 通往 6G:推动下一波连接浪潮--第一部分
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-10-29 DOI: 10.1109/JPROC.2024.3475891
Mohamed-Slim Alouini;Emil Björnson;Meixia Tao;Yasamin Mostofi
{"title":"The Road to 6G: Driving the Next Wave of Connectivity—Part I","authors":"Mohamed-Slim Alouini;Emil Björnson;Meixia Tao;Yasamin Mostofi","doi":"10.1109/JPROC.2024.3475891","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3475891","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 7","pages":"615-620"},"PeriodicalIF":23.2,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10738015","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142540451","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Future Special Issues/Special Sections of the Proceedings 论文集》未来的特刊/专栏
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-10-29 DOI: 10.1109/JPROC.2024.3477809
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引用次数: 0
Proceedings of the IEEE Publication Information 电气和电子工程师学会论文集》出版信息
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-10-29 DOI: 10.1109/JPROC.2024.3477794
{"title":"Proceedings of the IEEE Publication Information","authors":"","doi":"10.1109/JPROC.2024.3477794","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3477794","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 7","pages":"C2-C2"},"PeriodicalIF":23.2,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10738014","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142540432","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Connects You to a Universe of Information IEEE 将您与信息世界连接起来
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-10-29 DOI: 10.1109/JPROC.2024.3481749
{"title":"IEEE Connects You to a Universe of Information","authors":"","doi":"10.1109/JPROC.2024.3481749","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3481749","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 7","pages":"947-947"},"PeriodicalIF":23.2,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10738012","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142540435","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Membership IEEE 会员
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-10-29 DOI: 10.1109/JPROC.2024.3477798
{"title":"IEEE Membership","authors":"","doi":"10.1109/JPROC.2024.3477798","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3477798","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 7","pages":"C3-C3"},"PeriodicalIF":23.2,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10738011","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142540436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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