{"title":"Proceedings of the IEEE: Stay Informed. Become Inspired.","authors":"","doi":"10.1109/JPROC.2024.3479439","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3479439","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 8","pages":"C4-C4"},"PeriodicalIF":23.2,"publicationDate":"2024-11-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10747812","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142595827","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Additively Manufactured Electronic Components in Multimaterial 3-D and 4-D Printing","authors":"Yang Yang;Manos M. Tentzeris","doi":"10.1109/JPROC.2024.3484116","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3484116","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 8","pages":"950-953"},"PeriodicalIF":23.2,"publicationDate":"2024-11-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10747809","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142595841","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Room-Temperature Selective-Metallization Processes Applied to 3-D-Printed and Flexible Materials for Wireless Sensing","authors":"Valentina Palazzi;Federico Alimenti;Leonardo Pierantozzi;Matteo Ribeca;Leonardo Balocchi;Luca Valentini;Silvia Bittolo Bon;Paolo Mezzanotte;Manos M. Tentzeris;Luca Roselli","doi":"10.1109/JPROC.2024.3481315","DOIUrl":"10.1109/JPROC.2024.3481315","url":null,"abstract":"This article describes sensors and radio frequency (RF) components manufactured by applying selective-metallization processes (metal foil tape, liquid metal filling, electro and electroless plating, and surface embossing) to 3-D-printed and flexible dielectric substrates. All these technologies can be implemented at room temperature, thus enabling the adoption of unconventional materials and biopolymers with low glass transition temperatures. In this article, we also describe how the above technologies are used to manufacture wireless transponders for tracking and sensing applications. Several examples of RF components are reported, including antennas, beamforming networks, Doppler radars, and wireless passive transponders based on backscatter radio. Innovative circuit design approaches (such as the via-less approach) are presented and their impact on circuit manufacturing and recyclability is discussed.","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 8","pages":"1065-1090"},"PeriodicalIF":23.2,"publicationDate":"2024-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10742604","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142588725","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Anders E. Kalor, Giuseppe Durisi, Sinem Coleri, Stefan Parkvall, Wei Yu, Andreas Mueller, Petar Popovski
{"title":"Wireless 6G Connectivity for Massive Number of Devices and Critical Services","authors":"Anders E. Kalor, Giuseppe Durisi, Sinem Coleri, Stefan Parkvall, Wei Yu, Andreas Mueller, Petar Popovski","doi":"10.1109/jproc.2024.3484529","DOIUrl":"https://doi.org/10.1109/jproc.2024.3484529","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"144 1","pages":""},"PeriodicalIF":20.6,"publicationDate":"2024-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142588546","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"TechRxiv","authors":"","doi":"10.1109/JPROC.2024.3481751","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3481751","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 7","pages":"948-948"},"PeriodicalIF":23.2,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10738124","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142540438","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"The Road to 6G: Driving the Next Wave of Connectivity—Part I","authors":"Mohamed-Slim Alouini;Emil Björnson;Meixia Tao;Yasamin Mostofi","doi":"10.1109/JPROC.2024.3475891","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3475891","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 7","pages":"615-620"},"PeriodicalIF":23.2,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10738015","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142540451","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Future Special Issues/Special Sections of the Proceedings","authors":"","doi":"10.1109/JPROC.2024.3477809","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3477809","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 7","pages":"946-946"},"PeriodicalIF":23.2,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10738010","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142540450","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Proceedings of the IEEE Publication Information","authors":"","doi":"10.1109/JPROC.2024.3477794","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3477794","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 7","pages":"C2-C2"},"PeriodicalIF":23.2,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10738014","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142540432","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"IEEE Connects You to a Universe of Information","authors":"","doi":"10.1109/JPROC.2024.3481749","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3481749","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 7","pages":"947-947"},"PeriodicalIF":23.2,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10738012","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142540435","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"IEEE Membership","authors":"","doi":"10.1109/JPROC.2024.3477798","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3477798","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 7","pages":"C3-C3"},"PeriodicalIF":23.2,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10738011","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142540436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}