Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems最新文献_第4页

Simulation of reticle seekers using the generated thermal images 利用生成的热图像对定向导引头进行仿真

Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems Pub Date : 1996-11-18 DOI: 10.1109/APCAS.1996.569249

H. Hong, Sung-Hyun Han, G. Hong, Jongsoo Choi

引用次数: 14

Pb/In solder bump formation for a flip-chip bonding technique at high speed optical communication devices 用于高速光通信器件的倒装片键合技术的铅/铟焊料凸点形成

Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems Pub Date : 1996-11-18 DOI: 10.1109/APCAS.1996.569305

Haksoo Han, Hyunsoo Chung, Sungkook Park, Y. Joe, Sungsoon Park, Gwanchong Joo, N. Hwang, H. Lee, Kang Seungoo, Song Min-Kyu

{"title":"Pb/In solder bump formation for a flip-chip bonding technique at high speed optical communication devices","authors":"Haksoo Han, Hyunsoo Chung, Sungkook Park, Y. Joe, Sungsoon Park, Gwanchong Joo, N. Hwang, H. Lee, Kang Seungoo, Song Min-Kyu","doi":"10.1109/APCAS.1996.569305","DOIUrl":"https://doi.org/10.1109/APCAS.1996.569305","url":null,"abstract":"The increasing speed of advanced chip technologies has greatly challenged the interconnection methods and processes in order to achieve enhanced capability. We have successfully fabricated the solder bump and it's reflowing process for flip-chip bonding interconnection technique instead of conventional wire bonding for high speed devices. The lead (Pb: 350/spl deg/C) and the Indium (In: 157/spl deg/C) were used for solder bump and deposited by using thermal evaporation. The thickness of the deposited metal for solder bump was in the range of 5/spl sim/6 /spl mu/m thickness. Specially, to increase the accuracy and the reliability of the flip-chip bonding Technique, 3 layer thick photoresist about 30 /spl mu/m was used to control the deposition area for solder bump. It was also used for the lift-off process of excess deposited metal for solder bump. The height of solder bump through the reflowing process was controlled in the range of 10/spl sim/40 /spl mu/m according to the deposited area and shape. Also, the deposited area and shape was one of the most important parameters for solder bump fabrication. In addition, it was found that an oxidized surface layer effects on the increased melting temperature of deposited metal for solder bump. In this process, the reflowing temperature of PB/In (60:40 wt%) solder bumps was 230/spl plusmn/5/spl deg/C.","PeriodicalId":20507,"journal":{"name":"Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88636974","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

High-performance VLSI architecture for three-dimensional instrumentation based on a new concurrent memory-access scheme 基于一种新的并发存储器访问方案的三维仪器高性能VLSI体系结构

Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems Pub Date : 1996-11-18 DOI: 10.1109/APCAS.1996.569323

S. Lee, M. Hariyama, M. Kameyama

引用次数: 1

Application of uncovered region prediction for very low bit rate video coding 无覆盖区域预测在极低码率视频编码中的应用

Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems Pub Date : 1996-11-18 DOI: 10.1109/APCAS.1996.569237

Yeong-An Jeong, Dong-Wook Kim, Sung-Hyun Han, Jongsoo Choi

引用次数: 1

Reachability criterion of live free choice Petri nets 活体自由选择Petri网的可达性准则

Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems Pub Date : 1996-11-18 DOI: 10.1109/APCAS.1996.569288

T. Matsumoto

引用次数: 0

Analysis of stability control of a power system with a distributed constant circuit model 基于分布式恒电路模型的电力系统稳定控制分析

Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems Pub Date : 1996-11-18 DOI: 10.1109/APCAS.1996.569306

K. Takigawa, A. Hamada, K. Kawasaki, H. Ariyoshi

引用次数: 1

Novel enhanced pole selectivity bandpass filter with large dynamic range 新型大动态范围增强极选择性带通滤波器

Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems Pub Date : 1996-11-18 DOI: 10.1109/APCAS.1996.569218

A. Barua

引用次数: 1

A reconstruction method of damaged two-dimensional signal blocks using error correction coding based on DFT 一种基于DFT的二维信号块纠错重构方法

Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems Pub Date : 1996-11-18 DOI: 10.1109/APCAS.1996.569257

S. Yamasaki

引用次数: 1

A hierarchical MCM routing using four-via routing 使用四通路由的分层MCM路由

Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems Pub Date : 1996-11-18 DOI: 10.1109/APCAS.1996.569297

T. Watanabe, T. Fujii

{"title":"A hierarchical MCM routing using four-via routing","authors":"T. Watanabe, T. Fujii","doi":"10.1109/APCAS.1996.569297","DOIUrl":"https://doi.org/10.1109/APCAS.1996.569297","url":null,"abstract":"Recently, multichip modules (MCM) promise to be widely applied due to the advantage of multichip packaging. But, the routing problem for MCM is more difficult than those for VLSI or PCB because of the high packing density and high performance in MCM design. The problem is formulated as a general-area multilayer routing problem, and several algorithms have been proposed. Among these algorithms, a router of four-via routing proposed by Khoo and Cong (see IEEE Trans. CAD, vol.14, no.10, p.1277-90, 1995), named V4R, is the most efficient. V4R routes each net using no more than four interconnection vias, and it can make a better routing result than other MCM routers. However, there are some unresolved issues; for example, nets are routed in order of their terminal positions, so that more routing layers may be required even for short-length nets, or some routing layers are more congested because as many nets as possible are routed on the routing layers under consideration. In this paper, we present a hierarchical routing approach combined with V4R, aiming to improve the above-mentioned issues but also to preserve the characteristics of four-via routing and efficiency of V4R. In our proposed method, first, a routing area is divided into subareas hierarchically and then V4R is repeatedly applied in each subarea in the bottom-up way. Experimental results show that our approach is fairly good in the total routing-length compared with V4R itself.","PeriodicalId":20507,"journal":{"name":"Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83403912","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

HEART: a software architecture for distributed multimedia multiuser applications 用于分布式多媒体多用户应用程序的软件体系结构

Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems Pub Date : 1996-11-18 DOI: 10.1109/APCAS.1996.569248

Taekyoung Kwon, Sungsoo Park, Yanghee Choi, H. Kim, S. Kwon

引用次数: 0