2023 International Conference on Networking and Communications (ICNWC)最新文献_第3页

Cloud Based Attendance Automation System With Analytics And Reporting 基于云的考勤自动化系统与分析和报告

2023 International Conference on Networking and Communications (ICNWC) Pub Date : 2023-04-05 DOI: 10.1109/ICNWC57852.2023.10127524

Aayush Singh, K. Pavan Sai., V. Lavanya

{"title":"Cloud Based Attendance Automation System With Analytics And Reporting","authors":"Aayush Singh, K. Pavan Sai., V. Lavanya","doi":"10.1109/ICNWC57852.2023.10127524","DOIUrl":"https://doi.org/10.1109/ICNWC57852.2023.10127524","url":null,"abstract":"Managing attendance has always been tedious for the organizations as it is time consuming and repetitive activity. Fake attendance is a major issue to be addressed. Existing bio-metric system is a decent solution but they have limited functionality and have many vulnerabilities. Our objective is to provide an efficient and scalable cloud-based solution with facial recognition which can detect fake attendance and provide alerts to the management in case of irregular attendance. Our solution follows a verification process to avoid fake attendance. Initially, students have to upload a photo with their ID cards into our application. Next, the teacher or supervisor of the class will take a group photo of all the students and upload them into cloud through a mobile application, which will act as a user interface of our solution. The cloud architecture deployed in our solution combines various services like Amazon Rekognition, Amazon Simple Storage Service, Amazon Relational Database Service, Amazon Simple Notification Service, Amazon Lambda, Amazon Textract and Amazon Amplify in the most efficient manner in terms of storage and cost by regular deletion of unwanted data. We can then use the required cloud services to compare the faces of the student’s photo saved in our database with the group photo uploaded by the teacher to detect the students who are present. The proposed solution also analyzes the historical data within the database to prepare an aggregated report that consists of various fields like frequency of irregularity in attending classes, subject balance score and average attendance. While the back-end of the application is deployed in cloud, the front-end will be handled using Android as 70% of the general populace are dependent on this platform. Our solution uses Model-View-View-Model (MVVM) architecture. Execution time in MVVM applications is faster due to it supporting data binding with an average difference of 126.21ms.","PeriodicalId":197525,"journal":{"name":"2023 International Conference on Networking and Communications (ICNWC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128692259","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

An Efficient Wirelength Optimization for Booth Multiplier using Silicon Vias 利用硅过孔对展台乘法器进行有效的波长优化

2023 International Conference on Networking and Communications (ICNWC) Pub Date : 2023-04-05 DOI: 10.1109/ICNWC57852.2023.10127245

Ms. Aiswarya Kannan, Dr. B. Ramasubramanian, A. Abdulla, S. Akash, K. Hamshavarthan

{"title":"An Efficient Wirelength Optimization for Booth Multiplier using Silicon Vias","authors":"Ms. Aiswarya Kannan, Dr. B. Ramasubramanian, A. Abdulla, S. Akash, K. Hamshavarthan","doi":"10.1109/ICNWC57852.2023.10127245","DOIUrl":"https://doi.org/10.1109/ICNWC57852.2023.10127245","url":null,"abstract":"In today’s environment, 3D integration is crucial. As technology advances, 3D ICs effectively solve the connectivity issue due to their smaller size, which holds promise for heterogeneous integration. In a 3DIC, the inter-die signal is connected along the vertical axis using TSV. Where HPWL’s (Half Perimeter Wire-Length) role is unsatisfactory, there is no compromise in this case regarding the area and placement of TSVs. The 3D floor planners interpret TSV as points in the pre-processed scenarios, making the placement computation a challenging operation. An effective floor-planner optimises the overall wirelength under a set outline by synchronising the functional modules and the placement of TSV. Even though the wirelength in the most advanced 3D floorplans decreases to 26% from the pre-processed works, there is still a significant runtime overhead. To solve this, a new floor planning algorithm is chosen. Our approach consistently creates superior floorplans with less than 15% shorter wirelength and, on average, less TSVs than the previous state-of-the-art 3D floor-planner with TSV, on which the main focus is placed. Unlike the previous state-of-the-art floor planner, which took hours to complete, our method is atrociously quick enough to layout benchmark with a number of modules. After the routing stage, all PCB effects are removed, including any stray effects that may have been present. The circuit’s progress won’t be hampered in any manner.","PeriodicalId":197525,"journal":{"name":"2023 International Conference on Networking and Communications (ICNWC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129057698","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Cognitive Epidemic Supervision And Control By Interpretation Of Infected Patients 从感染患者的解读看认知疫情监测与控制

2023 International Conference on Networking and Communications (ICNWC) Pub Date : 2023-04-05 DOI: 10.1109/ICNWC57852.2023.10127476

P. Vasanthan, D. Shanthini, K. Swathika

{"title":"Cognitive Epidemic Supervision And Control By Interpretation Of Infected Patients","authors":"P. Vasanthan, D. Shanthini, K. Swathika","doi":"10.1109/ICNWC57852.2023.10127476","DOIUrl":"https://doi.org/10.1109/ICNWC57852.2023.10127476","url":null,"abstract":"It is an understatement of how epidemics can last for a minimum of 5 years according to doctors and even after surviving a couple of them, humans haven’t been able to handle it in the optimal way. Each sector of healthcare facilities has to focus on various factors that can control an epidemic. The software hence developed as per the proposal, will focus on the primary healthcare providers in diagnosing the disease based on the CT scan of patients, control of room level environmental conditions for the affected patients by the secondary workers and monitoring distance with control by the security using cameras. It will also feature the necessity of social distance among hosts who require medical attention through online video calling facilities and a personalized Chat bot and statistical information for every patient. Each function of the prototype will be applicable for the respective practitioner who together can work to dwindle the aftermath of an epidemic/pandemic and outbreaks. The features are designed in a manner that will cautiously take the practitioners safety into picture along with the hosts.","PeriodicalId":197525,"journal":{"name":"2023 International Conference on Networking and Communications (ICNWC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132382917","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Comparative Analysis of 5G Multicarrier Systems using κ-μ & α-μ generalized fading channels 基于κ-μ和α-μ广义衰落信道的5G多载波系统对比分析

2023 International Conference on Networking and Communications (ICNWC) Pub Date : 2023-04-05 DOI: 10.1109/ICNWC57852.2023.10127382

Rishank Reddy Nareddy, V. S. K. Punyamurthala, S. Anuradha, Alan Chemparathickal Sabu

引用次数: 0

Predict the Price in Stock Market Based on Heuristic Search Techniques Using Tensor Representation 基于启发式搜索技术的张量表示股票市场价格预测

2023 International Conference on Networking and Communications (ICNWC) Pub Date : 2023-04-05 DOI: 10.1109/ICNWC57852.2023.10127251

P. Deivendran, N. Kumar, R. Yashwanth, R. Raghul, D. Naresh

引用次数: 0

Modelling and Analysis of different types of TSV for Three Dimensional Integrated Circuits 三维集成电路中不同类型TSV的建模与分析

2023 International Conference on Networking and Communications (ICNWC) Pub Date : 2023-04-05 DOI: 10.1109/ICNWC57852.2023.10127533

G. Subhashini, S. Vairaprakash, R. Chandralekha, R. Rajalakshmi, A.S. Amudhadevi, R. Ishwarya

{"title":"Modelling and Analysis of different types of TSV for Three Dimensional Integrated Circuits","authors":"G. Subhashini, S. Vairaprakash, R. Chandralekha, R. Rajalakshmi, A.S. Amudhadevi, R. Ishwarya","doi":"10.1109/ICNWC57852.2023.10127533","DOIUrl":"https://doi.org/10.1109/ICNWC57852.2023.10127533","url":null,"abstract":"The majority of systems on the market today are made up of intricate SoCs with integrated processors, large quantities of memory and FPGAs, but they do not offer a complete system solution for real-world systems [1]. Designers are faced with numerous technological and financial obstacles when attempting to combine such different technologies onto a single chip [2]. Additionally, vertical integration was shown to be a desirable alternative due to the continuously growing needs for low cost, smaller chips with more capability, and shorter time to market for portable systems [3]. Three-dimensional integration is the vertical interconnection of unpackaged or packaged semiconductors [3]. The most promising technique for designing ICs and systems with high performance, functionality, and lower power consumption than the 2D technologies is three dimensional integrated circuits (IC) in the form of three-dimensionally stacked chips. Using inter-tier interconnects that directly cross the substrate, various dice can be joined in 3D integration [4]. This is referred as Through Silicon Via (TSV) based 3D integration technology. To provide uniform environmental conditions throughout all tiers, TSV tapering is done to achieve the least amount of voltage drop and delay difference possible. When the resistance values and current demand for each tier are known, thevenin network architecture may be used for TSV sizing.","PeriodicalId":197525,"journal":{"name":"2023 International Conference on Networking and Communications (ICNWC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130600579","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Analysis and Design of a Two stage Telescopic OTA using SCL 180nm CMOS Technology 基于SCL 180nm CMOS技术的两级伸缩OTA分析与设计

2023 International Conference on Networking and Communications (ICNWC) Pub Date : 2023-04-05 DOI: 10.1109/ICNWC57852.2023.10127441

Vanitha Soman, Kamala Kannan Gandhi, M. Baskaran

引用次数: 0

Automating Hadoop Cluster On Aws Cloud Using Terraform 使用Terraform在Aws云上自动化Hadoop集群

2023 International Conference on Networking and Communications (ICNWC) Pub Date : 2023-04-05 DOI: 10.1109/ICNWC57852.2023.10127568

Yadvi Bhalla, V. Hemamalini, Shashwat Mishra

{"title":"Automating Hadoop Cluster On Aws Cloud Using Terraform","authors":"Yadvi Bhalla, V. Hemamalini, Shashwat Mishra","doi":"10.1109/ICNWC57852.2023.10127568","DOIUrl":"https://doi.org/10.1109/ICNWC57852.2023.10127568","url":null,"abstract":"Nowadays, companies need a lot of storage to store their data. Massive amounts of data can be stored with Hadoop. Studies show that by 2023, 90% of all Fortune 500 companies will have adopted Hadoop. However, it may take hours or even days to set up a Hadoop Cluster for storing data. When businesses manage their time well, they can consistently deliver their products and services on time. To make smart and calculated decisions, they need this data. Business forecasting is a practice that has been around for a long time, but in the past, it was often done with limited data. However, in today’s data-driven world, businesses must utilize data to make informed decisions and stay ahead of their competitors. By analyzing large amounts of data, businesses can make more accurate predictions and decisions about consumer preferences, market trends, and potential fraud activities. The insights gained from data analysis can benefit professionals across all industries, allowing them to make better decisions and improve their business outcomes.The main objective is to automate the formation of a Hadoop Cluster on AWS Cloud with the help of Terraform. The Hadoop Cluster will have the following nodes: Master Node, Slave Nodes, Client Nodes","PeriodicalId":197525,"journal":{"name":"2023 International Conference on Networking and Communications (ICNWC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116589309","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Design of SB-GNRFET and D-GNRFET using QuantumATK 基于QuantumATK的sb - gnfet和d - gnfet的设计

2023 International Conference on Networking and Communications (ICNWC) Pub Date : 2023-04-05 DOI: 10.1109/ICNWC57852.2023.10127562

P. Venkatramana, P. Nagarajan, S. J. Basha

引用次数: 0

Detecting Anomalies for corn crop disease using Isolation forest 利用隔离林检测玉米作物病害异常

2023 International Conference on Networking and Communications (ICNWC) Pub Date : 2023-04-05 DOI: 10.1109/ICNWC57852.2023.10127330

K. Sowmiya, M. Thenmozhi

引用次数: 0