Materials Characterization最新文献

{"title":"Stacking fault energy modulates softening mechanisms in FCC metals during ultrasonic normal vibration","authors":"Pengfei Song,&nbsp;Miaoyan Cao,&nbsp;Han Hu,&nbsp;Gang Liu,&nbsp;Siyuan Wang,&nbsp;YongXin Zhou,&nbsp;Xi Zhang","doi":"10.1016/j.matchar.2026.117121","DOIUrl":"10.1016/j.matchar.2026.117121","url":null,"abstract":"<div><div>Stacking fault energy (SFE) is shown to strongly correlate with, though not solely govern, the plastic deformation mechanisms of face-centered cubic (FCC) metals, yet its role during ultrasonic normal vibration (UNV)-assisted forming remains elusive. Through UNV-assisted tensile experiments and EBSD analysis of three FCC metals with distinct SFEs (low-SFE stainless steel, medium-SFE copper, and high-SFE aluminum alloy), this study reveals two distinct softening phenomena that correlate with SFE. The acoustic softening effect, most pronounced in medium-SFE copper, is interpreted as arising from a high-frequency periodic elastic strain field that reduces the activation barriers‌ for dislocation glide and cross-slip. For acoustic residual softening, the magnitude exhibits a systematic trend of increasing with decreasing SFE, being strongest in low-SFE stainless steel. This is associated with enhanced dynamic recovery and, in low- and medium-SFE materials, a UNV-associated reduction in twin boundary fraction that weakens the twin strengthening contribution. These findings suggest that SFE modulates the relative efficiency of distinct restoration mechanisms under UNV.</div></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":"240 ","pages":"Article 117121"},"PeriodicalIF":6.2,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149199359","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"From refined crystal structure to structural evolution of the Al-Fe-Si system: Single-crystal X-ray analysis revealing more than expected","authors":"Yibo Liu,&nbsp;Sulei Cai,&nbsp;Changzeng Fan,&nbsp;Zhefeng Xu,&nbsp;Ruidong Fu,&nbsp;Bin Wen,&nbsp;Lifeng Zhang","doi":"10.1016/j.matchar.2026.117145","DOIUrl":"10.1016/j.matchar.2026.117145","url":null,"abstract":"<div><div>The Al–Fe–Si system contains a variety of complex intermetallic compounds, among which the cubic <em>α</em>_c-AlFeSi has been extensively studied due to its intricate crystal structure as a quasicrystal approximant phase. In the present work, a high-pressure-synthesized (HPS) Al₇₄Fe_18.5Si_7.5 alloy and its differential scanning calorimetry (DSC)-treated counterpart were characterized mainly by single-crystal X-ray diffraction (SXRD), along with scanning electron microscopy (SEM) and transmission electron microscopy (TEM).</div><div>Firstly, the SXRD can confirm the coexistence of the HPS cubic <em>α</em>_c-AlFeSi phase and hexagonal <em>τ</em>₁₁-Al₄Fe_1.7Si phase as implied by powder X-ray diffraction (PXRD). Secondly, the transition from the cubic <em>α</em>_c-AlFeSi phase to the <em>α</em>_h-AlFeSi phase can be detected solely by SXRD instead of the dedicated electron backscatter diffraction (EBSD) technique. Thirdly, SXRD can discriminate the twins of <em>θ</em>-Al₁₃Fe₄, coexisting with <em>γ</em>-AlFeSi and pure Al, all of which are the byproducts of DSC-treated HPS sample, which could otherwise only be characterized by cumbersome EBSD and/or high-resolution transmission electron microscopy (HRTEM). Fourthly, the refined crystal structures of the aforementioned <em>α</em>_c-AlFeSi, <em>τ</em>₁₁-Al₄Fe_1.7Si, <em>α</em>_h-AlFeSi, and <em>γ</em>-AlFeSi can be provided by the SXRD, contributing to the topological analysis of the building units of these complex intermetallics. Last but not least, it also reveals that SXRD can discriminate the subtle differences in site occupancies of Al atoms in the <em>α</em>_c-AlFeSi and <em>α</em>_c-AlMnSi crystal structure models with the <em>Im</em><span><math><mover><mn>3</mn><mo>¯</mo></mover></math></span> space group. The fundamental differences between the <em>Pm</em><span><math><mover><mn>3</mn><mo>¯</mo></mover></math></span> and <em>Im</em><span><math><mover><mn>3</mn><mo>¯</mo></mover></math></span> space groups were fully understood by comparative analysis of both refined crystal structure models obtained by SXRD in the Al-Fe-Si and Al-Mn-Si systems.</div></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":"240 ","pages":"Article 117145"},"PeriodicalIF":6.2,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149199274","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Dislocation morphology-mediated creep processes in AlLi alloys","authors":"Fei Chen,&nbsp;Kai Gong,&nbsp;Lin Gu,&nbsp;Xianwei Ren,&nbsp;Wenfei Peng","doi":"10.1016/j.matchar.2026.117119","DOIUrl":"10.1016/j.matchar.2026.117119","url":null,"abstract":"<div><div>Creep aging process is a complex coupling process of age-hardening, recovery-softening and deformation-strengthening, which is jointly dominated by atomic thermal diffusion and dislocation motion, while the emergence of dislocation morphology on the creep behavior as well as the special multi-stage creep behavior and the mechanism of its influence are not clear. In this paper, the influence of different dislocation morphologies on the abnormal multi-stage creep behavior of Al<img>Li alloys is investigated. Specifically, the differences in dislocation morphology under different pre-deformation conditions and the contrasting subsequent creep behaviors were investigated. It was found that different dislocation morphologies exhibit significant structural differences and distinct evolutionary processes, leading to pronounced variations in creep aging behavior. The T4 specimen, dominated by screw dislocations, displays distinct multi-stage characteristics. The opening of screw dislocations governs the creep behavior in the first stage (Stage I), with more pronounced creep observed in the second stage (Stage II). Moreover, whether the opening of screw dislocations is hindered directly affects the emergence of the intermediate stage and multi-stage characteristics. In contrast, the T3 specimen, primarily characterized by dislocation lines and loops, has a creep mechanism jointly dominated by stress- and temperature-regulated dislocation motion and atomic thermal diffusion. The enhanced diffusion shortens the intermediate stage, rendering the multi-stage characteristics less pronounced. Furthermore, we discovered that a small degree of pre-deformation inhibits creep in Al<img>Li alloys, whereas as the pre-deformation level increases, its effect on creep shifts from inhibition to promotion, and the underlying mechanism was also revealed.</div></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":"240 ","pages":"Article 117119"},"PeriodicalIF":6.2,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149199275","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Modulation of interfacial behavior and properties of Sn-58Bi/Cu solder joints by micron-scale indium addition","authors":"Lei Sun,&nbsp;Peng He,&nbsp;Shuye Zhang,&nbsp;Jing Wang,&nbsp;Liang Zhang","doi":"10.1016/j.matchar.2026.117157","DOIUrl":"10.1016/j.matchar.2026.117157","url":null,"abstract":"<div><div>In this work, trace amounts of micron-scale indium (In) particles were incorporated into Sn<img>58Bi solder, and the modulation of interfacial behavior and properties of solder joints induced by In particles was systematically investigated. Adding a small amount of In particles to Sn<img>58Bi solder changed its melting temperature. When the In mass fraction was 0.3 wt%, the peak temperature of the solder decreased from the initial 141.22 °C to 140.97 °C. With the addition of micron-scale In particles, the interfacial intermetallic compound of the solder joints transformed from Cu₆Sn₅ to the more stable Cu₆(Sn,In)₅ phase, and its thickness also increased. At an In particles mass fraction of 0.3 wt%, the interfacial layer thickness increased from 1.83 μm to 2.23 μm. In particles modification homogenized and regularized the orientation of Cu₆(Sn,In)₅ grains, which exhibited a dominant preferred growth orientation along the (001) crystallographic direction. In addition, the solubilization of indium in the Sn matrix led to microstructure refinement of the solder joint, which raised the shear strength of Sn-58Bi-0.3In solder joints from 39.2 MPa to 41.8 MPa. Regarding the wettability of the solder joint, the spreading area of the Sn58Bi solder joint without In particles was 78.14 mm². A maximum spreading area of 90.05 mm² was obtained when the In mass fraction reached 0.3 wt%. When the In proportion was further raised, a decline could be observed in the spreading area.</div></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":"240 ","pages":"Article 117157"},"PeriodicalIF":6.2,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149199276","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Corrosion performance divergence and its microstructure origin in T′/η' dual-phase Al-Zn-Mg-Cu alloys with varying Zn/Mg ratios","authors":"Yan Zou,&nbsp;Lingfei Cao,&nbsp;Xiaodong Wu,&nbsp;Yan Xie,&nbsp;Songbai Tang,&nbsp;Benshi He","doi":"10.1016/j.matchar.2026.117156","DOIUrl":"10.1016/j.matchar.2026.117156","url":null,"abstract":"<div><div>Al-Zn-Mg-Cu alloys are widely used in aerospace and marine engineering, with service reliability jointly affected by general and localized corrosion. For emerging T′/η' dual-phase alloys, it remains unclear how Zn/Mg ratio modulates microstructure-corrosion correlations across different corrosion conditions, restricting targeted alloy design. Five peak-aged alloys with Zn/Mg ratios of 1.50–10.00 are systematically investigated via electrochemical, intergranular corrosion (IGC) and exfoliation corrosion (EXCO) tests combined with microstructure characterization. A notable performance divergence between general and localized corrosion resistance is observed. The T′-dominated alloy (Zn/Mg = 1.50) shows a low corrosion current density of 0.78 × 10⁻⁶ A/cm² but suffers the severest IGC with 347 μm maximum depth. The alloy with balanced T′/η' fraction (Zn/Mg = 4.44) exhibits the best localized-corrosion resistance (minimum IGC depth of 85 μm) with moderate general-corrosion activity. With rising Zn/Mg ratio, precipitate-free zone (PFZ) width decreases from 193 nm to 47 nm then rebounds slightly. Grain boundary precipitates (GBPs) refine from continuous to discontinuous distribution, with Cu content of GBPs peaking at Zn/Mg = 4.44. This divergence stems from distinct dominant corrosion mechanisms. General corrosion is governed by matrix anodic activity, whereas localized corrosion is controlled by grain boundary galvanic coupling. The balanced dual-phase structure suppresses intergranular corrosion via optimized grain boundary features, and this work demonstrates that single electrochemical metrics cannot evaluate localized-corrosion risk for multi-phase alloys.</div></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":"240 ","pages":"Article 117156"},"PeriodicalIF":6.2,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149199186","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Nb-modified Ag-Cu-Sn filler metal for brazing CoCrFeNiMoNb high-entropy alloy to oxygen-free copper: microstructural evolution, strengthening mechanisms and joint performance","authors":"Lili Cao,&nbsp;Kuaikuai Wu,&nbsp;Cunjiabei Feng,&nbsp;Siman Zhang,&nbsp;Xindi Wang,&nbsp;Quanbin Lu,&nbsp;Changmao Ji","doi":"10.1016/j.matchar.2026.117148","DOIUrl":"10.1016/j.matchar.2026.117148","url":null,"abstract":"<div><div>Brazing CoCrFeNiMoNb high-entropy alloys (HEAs) to oxygen-free copper (OFC) remains challenging because conventional Ag-based filler metals often provide insufficient interfacial compatibility and joint reliability. Here, Nb was introduced into Ag₅₀CuSn₁₂ filler metals to regulate interfacial reactions and microstructural evolution in HEA/OFC brazed joints. Nb addition markedly altered elemental redistribution and refined the brazed-seam microstructure, leading to a more homogeneous distribution of reaction products. The joint containing 10 wt% Nb exhibited the best overall performance, achieving a maximum shear strength of 73.65 MPa, approximately 24% higher than that of the Nb-free joint. Its corrosion current density decreased to 1.5060 × 10⁻⁴ A/cm², while the oxidation rate constant reached the minimum value, demonstrating enhanced corrosion and high-temperature oxidation resistance. Excessive Nb addition (12 wt%), however, led to a marked deterioration in corrosion resistance, with the corrosion current density rising to 2.3650 × 10⁻⁴ A/cm², even worse than that of the Nb-free joint. EBSD analysis revealed a refined microstructure with an average grain size of 39.4 μm and no pronounced crystallographic texture. The improved joint performance was primarily attributed to Nb-induced grain refinement, enhanced elemental diffusion, and suppressed growth of brittle Cu<img>Sn intermetallic compounds; however, excessive Nb precipitates coarse Nb-rich phases that trigger micro-galvanic corrosion and accelerate corrosive medium penetration, thereby degrading joint performance. This work demonstrates an effective Nb-microalloying strategy for developing low-Ag filler metals with balanced mechanical strength and environmental durability for dissimilar brazed joints.</div></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":"240 ","pages":"Article 117148"},"PeriodicalIF":6.2,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149199178","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Ni-induced interfacial reconstruction through polycrystalline Cu-based diffusion-layer formation in Zn-15Al-brazed Cu/Al joints","authors":"Tao Chen,&nbsp;Peng He,&nbsp;Tengzhou Xu,&nbsp;Jie Huang,&nbsp;Jinyi Luo,&nbsp;Wenmin Chu,&nbsp;Peng Zhang,&nbsp;Jie Wu","doi":"10.1016/j.matchar.2026.117158","DOIUrl":"10.1016/j.matchar.2026.117158","url":null,"abstract":"<div><div>Brittle intermetallic compounds in the Cu-side reaction layer often limit the mechanical performance of Cu/Al joints brazed with Zn<img>Al filler metals. Nominal Ni additions of 0–3.0 wt% were introduced into Zn<img>15Al filler metal to modify this reaction layer and improve the shear strength of flame-brazed Cu/Al joints. The Cu-side interfacial structure and local mechanical properties were characterized using FIB-assisted HRTEM and nanoindentation, while shear testing evaluated the joint strength. Ni addition changed the Cu-side reaction layer by forming a polycrystalline Cu-based diffusion layer adjacent to a fine-grained Al_4.2Cu_3.2Zn_0.7 layer. At a nominal addition of 0.3 wt% Ni, the fine-grained Al_4.2Cu_3.2Zn_0.7 layer had an average grain size of 2.2 μm and a thickness of 6.1 μm. Joints brazed with 0.3–0.5 wt% nominal Ni additions reached a maximum shear strength of 72.5 MPa, approximately 2.2 times that of the Ni-free joint. At higher additions, the fine-grained layer became thinner, while cracks crossed the Al_4.2Cu_3.2Zn_0.7 layer. The shear strength consequently decreased to 54.9 MPa at 3 wt% Ni. These results show that Ni addition reconstructs and refines the Cu-side reaction layer, and was associated with improved shear strength of Zn-15Al-brazed Cu/Al joints within a limited nominal-composition range.</div></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":"240 ","pages":"Article 117158"},"PeriodicalIF":6.2,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149199361","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"The synergistic regulatory role of Cu in the Sn-58Bi/Al low-temperature solder system: Thermodynamic, experimental, and first-principles analyses","authors":"Yipeng Xiang,&nbsp;Jing Wang,&nbsp;Biao Wang,&nbsp;Long Peng,&nbsp;Jian Zhao,&nbsp;Senlin Yi,&nbsp;Jianhua Zhao,&nbsp;Jikang Yan","doi":"10.1016/j.matchar.2026.117117","DOIUrl":"10.1016/j.matchar.2026.117117","url":null,"abstract":"<div><div>In this study, Sn-58Bi-<em>x</em>Cu composite solders and their corresponding flux were designed and prepared. Sn-58Bi-<em>x</em>Cu (<em>x</em> = 0, 0.1, 0.3, 0.5 wt%) composite solder powders were primarily prepared by ball milling Cu powder particles with varying concentrations together with Sn<img>58Bi powder. The solder powders were subsequently mixed with the organic amine flux to produce solder pastes. The effects of Cu addition on the bonding characteristics of the solder alloys and the Al/solder interface were investigated using X-ray diffraction, scanning electron microscopy, and electron backscatter diffraction, together with wettability, tensile strength, and aging tests, as well as thermodynamic, transmission electron microscopeand first-principles calculations. The results show that the solder exhibits the best overall performance at a Cu content of 0.3 wt%. Cu reacts with Sn to form η-Cu₆Sn₅, which promotes refinement of the Bi phase through heterogeneous nucleation and improves the hardness and interfacial bonding performance of the solder through dislocation pinning and dispersion strengthening. The hardness increases by 20.8%, while the tensile strength increases by a factor of 1.85. First-principles calculations show that moderate Cu doping enhances the interfacial electronic interactions, increases the interfacial adhesion energy by 3.6%, and improves interfacial stability. These findings provide a theoretical basis and technical support for the application of low-temperature solders in aluminum-based electronic packaging.</div></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":"240 ","pages":"Article 117117"},"PeriodicalIF":6.2,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149199429","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Corrigendum to ‘Depth-dependent microstructural evolution and strengthening of a fourfold-composite gradient nanostructure in a NiW750 alloy’ [Materials Characterization 240 (2026) 117031]","authors":"Weimin Wang,&nbsp;Kaixuan Chen,&nbsp;Jilan Wang,&nbsp;Zhengda Yang,&nbsp;Tianxin Weng,&nbsp;Zhihui Wang,&nbsp;Chenxiao Huo,&nbsp;Chenyu Zhao,&nbsp;Wei Xu,&nbsp;Bingqing Cheng,&nbsp;Zidong Wang","doi":"10.1016/j.matchar.2026.117089","DOIUrl":"10.1016/j.matchar.2026.117089","url":null,"abstract":"","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":"240 ","pages":"Article 117089"},"PeriodicalIF":6.2,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149153903","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Effect of interface geometry on microstructural evolution and wear resistance of laser-cladding Ni-based composite coatings for shaft components","authors":"Jinsu Yu,&nbsp;Chao Zhang,&nbsp;Pengfei Xu,&nbsp;Bingtao Wu,&nbsp;Ji Zhao","doi":"10.1016/j.matchar.2026.117126","DOIUrl":"10.1016/j.matchar.2026.117126","url":null,"abstract":"<div><div>To improve the wear resistance and reliability of laser cladding composite coatings for shaft components, this study proposes a laser cladding strategy based on engineered interface geometry. Continuous helical V- and U-shaped grooves of 0.3 and 0.6 mm depth were machined on the shaft surface prior to cladding to regulate heat transfer, melt flow, and solidification behavior. Ni-based composite coatings with in-situ ceramic phases were fabricated on the grooved surfaces, and the effects of groove geometry and depth on the microstructure and wear resistance were systematically investigated. The results show that the grooves reduced heat dissipation and promoted melt flow, thereby facilitating Ti and C diffusion and the in-situ formation and homogeneous dispersion of ceramic phases. The 0.3-mm-deep U-shaped grooves effectively reduced porosity, while the 0.6-mm-deep U-shaped grooves promoted a more homogeneous ceramic-phase distribution. Compared with the ungrooved coating, the coating with 0.6-mm-deep U-shaped grooves exhibited 7.7% higher microhardness and 44.9% lower wear volume. The improved wear resistance was ascribed to the more homogeneous ceramic-phase distribution and the mechanical support provided by the substrate grooves under the applied load. This study provides a practical interface-engineering strategy for improving the microstructure and wear performance of laser cladding ceramic-reinforced composite coatings.</div></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":"240 ","pages":"Article 117126"},"PeriodicalIF":6.2,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149199185","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}