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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging最新文献

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Correction to: Transient Liquid Phase Bonding 校正:瞬态液相键合
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-3-319-99256-3_11
J. R. Holaday, C. Handwerker
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引用次数: 0
Thermomechanical Modeling of High-Temperature Bonded Interface Materials 高温键合界面材料的热力学建模
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-3-319-99256-3_4
P. Paret, D. DeVoto, S. Narumanchi
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引用次数: 2
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability 微电子封装中高温应用的模贴材料:材料，工艺，设备和可靠性
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-3-319-99256-3
K. Siow, S. Ang, F. Masana
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引用次数: 27
Silver Sintering and Soldering: Bonding Process and Comparison 银的烧结和焊接:焊接工艺和比较
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-3-319-99256-3_1
S. Chen, H. Zhang
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引用次数: 5
Reliability and Failure Mechanisms of Sintered Silver as Die Attach Joint 烧结银模连接的可靠性及失效机理
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-3-319-99256-3_5
Y. Mei, Z. Wang, K. Siow
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引用次数: 5
Die-Attach Materials for Extreme Conditions and Harsh Environments 用于极端条件和恶劣环境的模贴材料
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-3-319-99256-3_10
Z. Shen, O. Fanini
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引用次数: 1
Process Control of Sintered Ag Joint in Production for Die Attach Applications 烧结银接头在模具上的工艺控制
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-3-319-99256-3_3
K. Siow, V. R. Manikam, S. T. Chua
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引用次数: 1
Transient Liquid Phase Bonding 瞬态液相键合
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-3-319-99256-3_9
J. R. Holaday, C. Handwerker
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引用次数: 1
Morphological Changes in Sintered Silver Due to Atomic Migration 原子迁移引起的烧结银的形态变化
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-3-319-99256-3_6
S. Mannan, A. Paknejad, A. Mansourian, Khalid Khtatba
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引用次数: 2
Sintered Copper (Cu): Chemistry, Process, and Reliability 烧结铜(Cu):化学、工艺和可靠性
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-3-319-99256-3_8
Y. Yamada
{"title":"Sintered Copper (Cu): Chemistry, Process, and Reliability","authors":"Y. Yamada","doi":"10.1007/978-3-319-99256-3_8","DOIUrl":"https://doi.org/10.1007/978-3-319-99256-3_8","url":null,"abstract":"","PeriodicalId":184387,"journal":{"name":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123041693","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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