校正:瞬态液相键合

{"title":"校正:瞬态液相键合","authors":"J. R. Holaday, C. Handwerker","doi":"10.1007/978-3-319-99256-3_11","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":184387,"journal":{"name":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","volume":"66 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Correction to: Transient Liquid Phase Bonding\",\"authors\":\"J. R. Holaday, C. Handwerker\",\"doi\":\"10.1007/978-3-319-99256-3_11\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":184387,\"journal\":{\"name\":\"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging\",\"volume\":\"66 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1007/978-3-319-99256-3_11\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/978-3-319-99256-3_11","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}