烧结银接头在模具上的工艺控制

{"title":"烧结银接头在模具上的工艺控制","authors":"K. Siow, V. R. Manikam, S. T. Chua","doi":"10.1007/978-3-319-99256-3_3","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":184387,"journal":{"name":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","volume":"68 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Process Control of Sintered Ag Joint in Production for Die Attach Applications\",\"authors\":\"K. Siow, V. R. Manikam, S. T. Chua\",\"doi\":\"10.1007/978-3-319-99256-3_3\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":184387,\"journal\":{\"name\":\"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging\",\"volume\":\"68 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1007/978-3-319-99256-3_3\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/978-3-319-99256-3_3","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}