Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena最新文献_第8页

Advanced methodology for assessing chip package interaction effects on chip performance and reliability after chip assembly and during chip operation 评估芯片封装在芯片组装后和芯片运行期间对芯片性能和可靠性影响的先进方法

Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena Pub Date : 2020-10-30 DOI: 10.1116/6.0000506

J. Choy, V. Sukharev, A. Kteyan

{"title":"Advanced methodology for assessing chip package interaction effects on chip performance and reliability after chip assembly and during chip operation","authors":"J. Choy, V. Sukharev, A. Kteyan","doi":"10.1116/6.0000506","DOIUrl":"https://doi.org/10.1116/6.0000506","url":null,"abstract":"An advanced multiphysics EDA (Electronic Design Automation) methodology is presented for analyzing thermal and thermomechanical problems during chip assembly and operation. The tool-prototype, which was built on the basis of this methodology, employs an anisotropic effective thermal-mechanical property methodology that replaces building complex geometries in finite element analysis simulations, thereby enhancing accuracy and performance significantly. With multiscale capabilities enabled, the tool-prototype first performs full chip stress and temperature analyses and detects hotspots. Then, a detailed analysis is performed in the selected regions of interest, with the resolution adjusted to a feature-scale by adopting a finer grid for extracting effective properties, and enables one to address feature-scale stress-induced issues such as back-end-of-line cracking or stress-induced mobility degradation of transistors. When the tool-prototype is linked with power analysis and layout EDA tools, it can perform the reliability check within the design flow. The assessment procedure will help to design power efficient chips by avoiding thermal and stress hotspots that compromise chip performance and reliability.","PeriodicalId":17652,"journal":{"name":"Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2020-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82180750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Shape and dose control for proximity effect correction on massively parallel electron-beam systems 大规模平行电子束系统接近效应校正的形状和剂量控制

Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena Pub Date : 2020-10-29 DOI: 10.1116/6.0000556

Nabid Hasan, Soo-Young Lee, Byungsup Ahn, Jin Choi, Joonsoo Park

{"title":"Shape and dose control for proximity effect correction on massively parallel electron-beam systems","authors":"Nabid Hasan, Soo-Young Lee, Byungsup Ahn, Jin Choi, Joonsoo Park","doi":"10.1116/6.0000556","DOIUrl":"https://doi.org/10.1116/6.0000556","url":null,"abstract":"Massively parallel electron-beam (e-beam) systems (MPESs) were developed to increase the writing throughput and demonstrated to be able to write large-scale patterns significantly faster compared to conventional single-beam systems. However, such systems still suffer from the inherent proximity effect due to the electron scattering in the resist. The proximity effect correction (PEC) has been investigated for a long time, and several PEC schemes have been proposed. Though most of the PEC schemes may be employed for an MPES, their direct application would be subject to the system’s constraints, e.g., a relatively large beam size, a fixed exposing interval, and the same deflection angle for all beams, which may lead to nonoptimal correction results. In this work, practical methods for realizing various types of spatial dose distributions required for the PEC and implementing both shape and dose corrections under the MPES constraints have been developed. It has been shown that, with these methods, the proximity effect correction can be performed effectively with the critical dimension error, line edge roughness, and total dose taken into account.","PeriodicalId":17652,"journal":{"name":"Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2020-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79618626","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Effects of cavity shapes and rounded corners of mold on polymer filling process in nanoimprint lithography 模腔形状和圆角对纳米压印工艺中聚合物填充过程的影响

Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena Pub Date : 2020-10-23 DOI: 10.1116/6.0000498

Lijun Ma, Mingya Zhang, Xiaolei Zhang, Xu Zheng, S. Xue, Qing Wang

{"title":"Effects of cavity shapes and rounded corners of mold on polymer filling process in nanoimprint lithography","authors":"Lijun Ma, Mingya Zhang, Xiaolei Zhang, Xu Zheng, S. Xue, Qing Wang","doi":"10.1116/6.0000498","DOIUrl":"https://doi.org/10.1116/6.0000498","url":null,"abstract":"The effects of cavity shapes and rounded corners on polymer filling and mold stress distributions of nanoimprint lithography are investigated using a numerical simulation approach. Three types of mold cavities including a rectangular cavity with vertical sidewalls, a trapezoidal cavity with inclined sidewalls, and a semicircular cavity with curved sidewalls are used to study the polymer flow and the filling situation in the embossing stage. Stress distributions of three types of molds are compared to evaluate the mold durability under different imprint pressures. To further optimize filling ratios and the stress concentration, three molds with round corners are proposed. Simulation results show that the mold with a semicircular cavity can achieve complete filling under the lowest pressure, but the maximum von Mises stress is greater than that of others. The filling ratio of the trapezoidal cavity is better than that of the rectangular cavity, and the maximum von Mises stress is the smallest among three types of molds. With the increase in the radius of round corners for three molds, filling ratios are improved and the maximum stresses decrease apparently, which not only improve the pattern transferring fidelity but also prolong the service life of the mold effectively.","PeriodicalId":17652,"journal":{"name":"Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2020-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80341172","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Electrospun Mn2O3 web electrodes: Influence of fabrication parameters on electrochemical performance 电纺丝Mn2O3网状电极:制备参数对电化学性能的影响

Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena Pub Date : 2020-10-23 DOI: 10.1116/6.0000553

M. C. Brockway, J. Skinner

引用次数: 1

Electromigration simulation and design considerations for integrated circuit power grids 集成电路电网的电迁移仿真及设计考虑

Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena Pub Date : 2020-10-20 DOI: 10.1116/6.0000476

F. Najm, V. Sukharev

引用次数: 5

Bias-voltage-dependent measurement of apparent barrier height on low-work-function thin film 低功函数薄膜上视势垒高度的偏置电压依赖性测量

Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena Pub Date : 2020-10-16 DOI: 10.1116/6.0000436

K. Nagaoka, S. Ohmi

引用次数: 2

Parylene micropillars coated with thermally grown SiO2 热生长SiO2包覆的聚对二甲苯微柱

Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena Pub Date : 2020-10-15 DOI: 10.1116/6.0000558

Xiaocheng Liu, P. Fecko, Z. Fohlerova, T. Karásek, J. Pekárek, P. Neužil

{"title":"Parylene micropillars coated with thermally grown SiO2","authors":"Xiaocheng Liu, P. Fecko, Z. Fohlerova, T. Karásek, J. Pekárek, P. Neužil","doi":"10.1116/6.0000558","DOIUrl":"https://doi.org/10.1116/6.0000558","url":null,"abstract":"The modification of surface properties frequently requires the binding of suitable compounds to the original surface. Silanes or thiols can be directly covalently bonded to either Si-based materials or Au, thus ruling out polymers. Here, we show the utilization of a layer of SiO2 with a thickness of a few nanometers that serves as a cross-linker between polymers and silanes providing covalent bonding to the surface. We deposited a polymer onto a thermally oxidized microstructured Si surface followed by subsequent Si removal. We demonstrated a Si-based nanotechnology fabrication method that can be generally used to modify the surface properties of practically any polymer via SiO2 cross-linking. This can produce any topology, including microstructures, nanostructures, or composite microstructure/nanostructures terminating in different shapes, since all the steps involving polymer deposition are conducted at room temperature after the Si surface has been thermally oxidized. This technique opens a broad field of new applications for polymers in microstructures and nanostructures that have stable water surface contact angle values with the contact angle set by demand for gecko-mimicking structures or lotus leaf inspired surfaces.","PeriodicalId":17652,"journal":{"name":"Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2020-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89419650","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Au-free low-temperature ohmic contacts for AlGaN/AlN/GaN heterostructures AlGaN/AlN/GaN异质结构的无金低温欧姆触点

Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena Pub Date : 2020-10-08 DOI: 10.1116/6.0000287

Xiaowei Wang, Hsien-chih Huang, B. Green, Xiang Gao, D. Rosenmann, Xiuling Li, J. Shi

引用次数: 5

Stability of TiO2-coated ZnO photocatalytic thin films for photodegradation of methylene blue tio2包覆ZnO光催化薄膜光降解亚甲基蓝的稳定性研究

Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena Pub Date : 2020-10-07 DOI: 10.1116/6.0000306

Rogel Jan B. Butalid, A. P. S. Cristobal, Arantxa Danielle S. Montallana, M. Vasquez

{"title":"Stability of TiO2-coated ZnO photocatalytic thin films for photodegradation of methylene blue","authors":"Rogel Jan B. Butalid, A. P. S. Cristobal, Arantxa Danielle S. Montallana, M. Vasquez","doi":"10.1116/6.0000306","DOIUrl":"https://doi.org/10.1116/6.0000306","url":null,"abstract":"Investigations on the stability of titanium dioxide ( TiO 2)-coated zinc oxide (ZnO) thin films upon repeated uses for methylene blue (MB) degradation were conducted. Photocorrosion of ZnO, upon exposure to light in aqueous media, can affect the photocatalytic performance due to loss of material. Hence, coating with a more stable metal oxide was seen as a way to suppress the effects of photocorrosion. In this study, homogeneous wurtzite ZnO nanostructured thin films were obtained from thermal oxidation of sputter-deposited Zn films on glass substrates. TiO 2 was subsequently deposited onto the ZnO nanostructured thin films using a reactive magnetron sputtering system in an admixture of argon and oxygen gases. After deposition, the thin films were annealed at 500 °C for 1 h. The photocatalytic efficiency and stability of the thin films were investigated after multiple degradation cycles. The addition of a TiO 2 film increased the surface roughness and blueshifted the absorption edge of the ZnO thin films. The coated films obtained up to 94.3% degradation efficiency of MB after a 180-min exposure cycle using a solar light simulator. After three cycles, degradation efficiency decreased for the uncoated ZnO photocatalysts. Analysis of the MB solution after one degradation cycle revealed the presence of Zn 2 + ions attributed to the effects of photocorrosion. Higher Zn 2 + concentrations were observed when the ZnO surface is uncoated. This study showed that the addition of a thin, antiphotocorrosion material such as TiO 2 layer decreased the dissolution of ZnO caused by photocorrosion without a significant reduction in the photodegradation efficiency.","PeriodicalId":17652,"journal":{"name":"Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2020-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79503344","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 17

Mechanically reliable hybrid organosilicate glasses for advanced interconnects 用于高级互连的机械可靠的杂化有机硅酸盐玻璃

Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena Pub Date : 2020-10-05 DOI: 10.1116/6.0000517

Karsu I. Kilic, R. Dauskardt

引用次数: 2