2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME)最新文献

An FPGA implementation of a brushless DC motor speed controller 一种无刷直流电机速度控制器的FPGA实现

2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2010-12-03 DOI: 10.1109/SIITME.2010.5653617

B. Alecsa, A. Onea

引用次数: 10

E-learning packaging technologies course in the frame of the MSYSTECH European project MSYSTECH欧洲项目框架下的电子学习包装技术课程

2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2010-12-03 DOI: 10.1109/SIITME.2010.5650874

M. Pantazica, N. Codreanu, P. Svasta, C. Ionescu

引用次数: 0

Investigation on the efficiency of thermal relief shapes on different Printed Circuit Boards 不同印刷电路板上热浮雕形状效率的研究

2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2010-12-03 DOI: 10.1109/SIITME.2010.5650836

I. Plotog, G. Vărzaru, R. Bunea, I. Busu, T. Cucu, P. Svasta

{"title":"Investigation on the efficiency of thermal relief shapes on different Printed Circuit Boards","authors":"I. Plotog, G. Vărzaru, R. Bunea, I. Busu, T. Cucu, P. Svasta","doi":"10.1109/SIITME.2010.5650836","DOIUrl":"https://doi.org/10.1109/SIITME.2010.5650836","url":null,"abstract":"As known, thermal relief is a technique used to separate soldering pads or plated through-hole vias from large copper planes in order to reduce soldering dwell time by providing thermal resistance during the process, thus minimizing the heat transfer to the plane. However, during normal operation, the same thermal resistance limits the heat transfer for power component dissipation. The narrower the thermal pad, the greater temperature increasing during power dissipation. Hence, the dimensions of the thermal pads are critical. The work presents the results of a practical approach not for a hole via or a pad for an ordinarily component connected to a large copper area, but a medium power Surface Mounting Device, SMD, using the Printed Circuit Board, PCB, as heat sink. There are taken into consideration different thermal pads and there are investigated by temperature measurements with thermocouples and thermovision. The variables are the thermal pad dimensions, the area of the radiant surface, the base material of PCB, and the reflow soldering process. It is analyzed the effect of the thermal pad versus the temperature on the soldering pad and beyond the thermal pad and on the case of the device during reflow soldering process and during operation","PeriodicalId":155180,"journal":{"name":"2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126764578","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Modeling and simulation of Cylindrical PET 2D using direct inversion method 基于直接反演法的圆柱形PET二维建模与仿真

2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2010-12-03 DOI: 10.1109/SIITME.2010.5653649

V. Stefanescu, Christian Faye, D. Stoichescu, A. Florescu

引用次数: 2

Matlab implementation of PEM fuel cell stack membrane hydration subsystem PEM燃料电池堆膜水化子系统的Matlab实现

2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2010-12-03 DOI: 10.1109/SIITME.2010.5653396

D. Stoichescu, A. Florescu, A. Vasile, Alina Sultana

引用次数: 0

An RFID tag simulator for the FDX and HDX protocols 一个RFID标签模拟器的FDX和HDX协议

2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2010-12-03 DOI: 10.1109/SIITME.2010.5653722

D. Vuza, S. Chițu, P. Svasta

引用次数: 4

Power transformers model used for inverters simulations 用于逆变器仿真的电力变压器模型

2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2010-12-03 DOI: 10.1109/SIITME.2010.5649130

A. Taut, O. Pop, S. Lungu

引用次数: 1

Optimization of a boost switching-mode power supply using electro-thermal modeling and simulation 利用电热建模与仿真优化升压开关电源

2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2010-12-03 DOI: 10.1109/SIITME.2010.5650828

C. Negrea, M. Rangu, P. Svasta

引用次数: 3

Euro training courses of microsystems technology and nanotechnology for electronics 欧洲微系统技术和纳米技术电子学培训课程

2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2010-12-03 DOI: 10.1109/SIITME.2010.5653755

R. Bátorfi, Z. Illyefalvi-Vitéz, G. Wendin, H. Heinzelmann, D. Demarchi, P. Civera

{"title":"Euro training courses of microsystems technology and nanotechnology for electronics","authors":"R. Bátorfi, Z. Illyefalvi-Vitéz, G. Wendin, H. Heinzelmann, D. Demarchi, P. Civera","doi":"10.1109/SIITME.2010.5653755","DOIUrl":"https://doi.org/10.1109/SIITME.2010.5653755","url":null,"abstract":"EuroTraining is the part of the EC initiated Europractice service, which aims to stimulate the wider exploitation of state-of-the-art micro/nano electronics and microsystem technologies by the European industry and academia. EuroTraining invites engineers and scientists from companies, SMEs, universities and institutes to upgrade their knowledge by professional and awareness courses entitled “Design Your Own Microsystem” and “Nanotechnology for Electronics”. The courses were lectured by highly qualified experts in cooperation with local scientists, whose institutes were also invited to facilitate further scientific connection between the course participants and the national institute. A large emphasis were put on multidisciplinarity, as trends point to integration, therefore, the courses have been developed for engineers coming from a very different background (electrical-, biomedical-, chemical-, mechanical engineers) and for physicists, medical doctors, chemists, etc. The courses were very successful, participants benefited much from that they have learned: refreshed and widened their knowledge, and might open new opportunities in their studies and careers.","PeriodicalId":155180,"journal":{"name":"2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132438602","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A student's point of view on engineering practice 一个学生对工程实践的看法

2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2010-12-03 DOI: 10.1109/SIITME.2010.5650818

Pitica Madalina Dana

引用次数: 0